MTFC64GASAONS-IT TR

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 818 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of MTFC64GASAONS-IT TR – IC FLASH 512GBIT MMC 153TFBGA

The MTFC64GASAONS-IT TR is a Micron industrial-grade UFS flash memory device providing 512 Gbit (64G x 8) of non-volatile NAND SLC storage in a 153-ball TFBGA package (11.5 × 13 mm). It combines an integrated UFS controller and NAND flash to deliver compact, embedded storage for industrial applications that require robust temperature operation and protected boot/storage features.

Designed to the JEDEC/UFS specification (UFS v2.1) and supporting industrial operating temperatures, this device targets embedded systems that need high-performance serial flash storage with hardware-backed protections and system-level features such as RPMB and high-speed boot.

Key Features

  • Core / Memory  512 Gbit total capacity implemented as 64G × 8 of SLC NAND flash for non-volatile storage.
  • UFS Interface  JEDEC/UFS specification version 2.1-compliant interface with advanced 6-signal differential I/O, 2-lane support and Gear 1/2/3 operation.
  • Performance Modes  High-speed operation including Gear 1/2/3 support and a 52 MHz clock reference.
  • Power  VCC supply range of 2.7 V to 3.6 V and VCCQ2 of 1.7 V to 1.95 V to support standard embedded power domains.
  • Security & Data Protection  Permanent and power-on write protection plus a replay-protected memory block (RPMB) for authenticated storage partitions.
  • System Features  Boot operation (high-speed boot), sleep mode, background operation, reliable write, discard/erase, command queuing, FFU and cache support.
  • Reliability & Maintenance  REFRESH operation and temperature event notification to support long-term data integrity and system monitoring.
  • Package & Environmental  153-ball JEDEC TFBGA (11.5 × 13 mm, 1.2 mm height), rated for industrial case surface temperatures from –40°C to +95°C; BGA, MSL3.

Typical Applications

  • Industrial Embedded Systems  Compact, non-volatile storage and boot support for controllers and edge computing modules operating across –40°C to +95°C.
  • Networking and Communications Equipment  High-speed UFS interface and two-lane differential I/O are suited for embedded firmware and data storage in telecommunications and network devices.
  • Imaging and Data Logging  Large-capacity SLC NAND and background operation features enable reliable capture and retention of sensor, imaging or logging data in industrial environments.
  • Embedded Boot and Secure Storage  High-speed boot capability and RPMB/protection features support secure boot partitions and authenticated storage for embedded platforms.

Unique Advantages

  • Industrial temperature rating: Specified operation from –40°C to +95°C for deployment in harsh or wide-range environments.
  • Integrated UFS controller with 2-lane support: Advanced 6-signal differential I/O and Gear 1/2/3 support deliver high-speed serial performance inside a single packaged device.
  • Built-in security and protection: Permanent and power-on write protection plus RPMB provide hardware-level mechanisms for secure and authenticated data partitions.
  • Flexible power domains: Broad VCC range (2.7–3.6 V) and VCCQ2 (1.7–1.95 V) accommodate common embedded power architectures.
  • Compact JEDEC TFBGA package: 153-ball, 11.5 × 13 mm footprint optimizes board space for dense embedded designs.
  • SLC NAND reliability: Non-volatile SLC NAND technology used for the device supports endurance-focused industrial storage use cases.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GASAONS-IT TR integrates Micron NAND and a UFS controller in a compact TFBGA package to provide industrial-grade, high-speed embedded storage with hardware protections and system features such as high-speed boot and RPMB. Its specified voltage ranges and wide operating temperature make it suitable for designs that require robust, long-term storage under challenging environmental conditions.

This device is appropriate for engineers designing industrial embedded systems, networking equipment, or other products that need substantial non-volatile capacity, secure storage partitions, and a JEDEC/UFS v2.1-compliant interface in a space-efficient package.

If you need pricing, availability or technical evaluation support for MTFC64GASAONS-IT TR, request a quote or submit an inquiry to receive further product and procurement information.

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