MTFC64GASAONS-IT TR
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 818 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GASAONS-IT TR – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GASAONS-IT TR is a Micron industrial-grade UFS flash memory device providing 512 Gbit (64G x 8) of non-volatile NAND SLC storage in a 153-ball TFBGA package (11.5 × 13 mm). It combines an integrated UFS controller and NAND flash to deliver compact, embedded storage for industrial applications that require robust temperature operation and protected boot/storage features.
Designed to the JEDEC/UFS specification (UFS v2.1) and supporting industrial operating temperatures, this device targets embedded systems that need high-performance serial flash storage with hardware-backed protections and system-level features such as RPMB and high-speed boot.
Key Features
- Core / Memory 512 Gbit total capacity implemented as 64G × 8 of SLC NAND flash for non-volatile storage.
- UFS Interface JEDEC/UFS specification version 2.1-compliant interface with advanced 6-signal differential I/O, 2-lane support and Gear 1/2/3 operation.
- Performance Modes High-speed operation including Gear 1/2/3 support and a 52 MHz clock reference.
- Power VCC supply range of 2.7 V to 3.6 V and VCCQ2 of 1.7 V to 1.95 V to support standard embedded power domains.
- Security & Data Protection Permanent and power-on write protection plus a replay-protected memory block (RPMB) for authenticated storage partitions.
- System Features Boot operation (high-speed boot), sleep mode, background operation, reliable write, discard/erase, command queuing, FFU and cache support.
- Reliability & Maintenance REFRESH operation and temperature event notification to support long-term data integrity and system monitoring.
- Package & Environmental 153-ball JEDEC TFBGA (11.5 × 13 mm, 1.2 mm height), rated for industrial case surface temperatures from –40°C to +95°C; BGA, MSL3.
Typical Applications
- Industrial Embedded Systems Compact, non-volatile storage and boot support for controllers and edge computing modules operating across –40°C to +95°C.
- Networking and Communications Equipment High-speed UFS interface and two-lane differential I/O are suited for embedded firmware and data storage in telecommunications and network devices.
- Imaging and Data Logging Large-capacity SLC NAND and background operation features enable reliable capture and retention of sensor, imaging or logging data in industrial environments.
- Embedded Boot and Secure Storage High-speed boot capability and RPMB/protection features support secure boot partitions and authenticated storage for embedded platforms.
Unique Advantages
- Industrial temperature rating: Specified operation from –40°C to +95°C for deployment in harsh or wide-range environments.
- Integrated UFS controller with 2-lane support: Advanced 6-signal differential I/O and Gear 1/2/3 support deliver high-speed serial performance inside a single packaged device.
- Built-in security and protection: Permanent and power-on write protection plus RPMB provide hardware-level mechanisms for secure and authenticated data partitions.
- Flexible power domains: Broad VCC range (2.7–3.6 V) and VCCQ2 (1.7–1.95 V) accommodate common embedded power architectures.
- Compact JEDEC TFBGA package: 153-ball, 11.5 × 13 mm footprint optimizes board space for dense embedded designs.
- SLC NAND reliability: Non-volatile SLC NAND technology used for the device supports endurance-focused industrial storage use cases.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GASAONS-IT TR integrates Micron NAND and a UFS controller in a compact TFBGA package to provide industrial-grade, high-speed embedded storage with hardware protections and system features such as high-speed boot and RPMB. Its specified voltage ranges and wide operating temperature make it suitable for designs that require robust, long-term storage under challenging environmental conditions.
This device is appropriate for engineers designing industrial embedded systems, networking equipment, or other products that need substantial non-volatile capacity, secure storage partitions, and a JEDEC/UFS v2.1-compliant interface in a space-efficient package.
If you need pricing, availability or technical evaluation support for MTFC64GASAONS-IT TR, request a quote or submit an inquiry to receive further product and procurement information.