MTFC64GASAQHD-AIT

IC FLASH 512GBIT EMMC 153VFBGA
Part Description

IC FLASH 512GBIT EMMC 153VFBGA

Quantity 947 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q104ECCNN/AHTS CodeN/A

Overview of MTFC64GASAQHD-AIT – IC FLASH 512GBIT EMMC 153VFBGA

The MTFC64GASAQHD-AIT is a 512 Gbit e.MMC memory device that integrates a MultiMediaCard (MMC) controller with NAND flash memory. It provides a 64G × 8 organization and implements the JEDEC e.MMC 5.1 standard feature set for embedded storage and boot operation.

Designed for applications requiring robust embedded non-volatile storage, the device supports high-speed interfaces up to 200 MHz, HS200/HS400 modes, and offers automotive-grade qualification with AEC-Q104 and an operating temperature range of –40°C to +85°C.

Key Features

  • Core & Memory  Integrated MMC controller paired with NAND flash memory organized as 64G × 8, providing 512 Gbit of non-volatile storage.
  • Standards & Compliance  JEDEC/MMC standard version 5.1-compliant implementation with command classes, command queue, and backward compatibility with previous MMC standards.
  • Interface & Performance  Advanced 12-signal interface supporting ×1, ×4, and ×8 I/Os (host-selectable); e.MMC interface clock up to 200 MHz and boot frequency up to 52 MHz; HS200/HS400 supported.
  • Boot & Security  High-speed boot operation, replay-protected memory block (RPMB), temporary and power-on write protection, permanent write protection, and high-priority interrupt (HPI).
  • Reliability & Manageability  ECC and block management implemented, field firmware update (FFU), device health report, BKOPS control, reliable write, discard and sanitize, and thermal protection.
  • Power & Voltage  VCC range 2.7 V to 3.6 V and VCCQ 1.70 V to 1.95 V to match common embedded power domains.
  • Package & Temperature  153-ball VFBGA package (11.5 mm × 13 mm) in a compact form factor; specified operating temperature range from –40°C to +85°C (TA).
  • Automotive Qualification  AEC-Q104 qualification and functional-safety related documentation options are listed in product material for designs requiring automotive-level assurance.

Typical Applications

  • Automotive embedded storage  In-vehicle non-volatile storage and boot media where AEC-Q104 qualification and –40°C to +85°C operation are required.
  • Boot and system firmware storage  High-speed boot operation and field firmware update (FFU) support reliable system boot and firmware maintenance.
  • Secure data storage  RPMB (replay-protected memory block) and multiple write-protection mechanisms provide secure on-board data handling.
  • Embedded systems requiring compact package  The 153-ball VFBGA (11.5×13 mm) footprint enables dense board-level integration for space-constrained designs.

Unique Advantages

  • Integrated MMC controller and NAND flash: Reduces system integration complexity by delivering a single-package embedded storage solution.
  • JEDEC e.MMC 5.1 compliance: Ensures compatibility with hosts and software stacks designed to the JESD84-B51 specification.
  • High-speed interface modes: Support for up to 200 MHz and HS200/HS400 provides bandwidth for demanding embedded storage tasks.
  • Automotive-grade qualification: AEC-Q104 qualification supports use in designs that require automotive-oriented validation.
  • Comprehensive data management features: ECC, block management, reliable write, and device health reporting help maintain data integrity and simplify maintenance.
  • Compact, industry-standard package: 153-ball VFBGA (11.5×13 mm) enables compact BOM and board placement.

Why Choose MTFC64GASAQHD-AIT?

The MTFC64GASAQHD-AIT combines a JEDEC-compliant e.MMC 5.1 interface with integrated NAND flash to deliver 512 Gbit of embedded non-volatile storage in a compact 153-ball VFBGA package. Its high-speed interface options, boot support, and security features make it suitable for embedded systems where reliable boot, secure storage, and field firmware update capability are required.

With AEC-Q104 qualification and a specified operating range of –40°C to +85°C, this device is positioned for applications that require automotive-grade validation, compact integration, and robust data management over the product lifecycle.

Request a quote or submit an inquiry to obtain pricing and availability information for the MTFC64GASAQHD-AIT.

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