MTFC64GASAONS-AIT TR
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 364 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q104 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GASAONS-AIT TR – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GASAONS-AIT TR is a 512‑Gbit non‑volatile NAND flash memory device with an integrated UFS controller, manufactured by Micron Technology Inc. It implements a UFS2.1 interface architecture and is targeted at systems requiring high-density, managed flash storage with automotive-grade qualification.
Designed for high-speed boot and secure data storage, the device combines advanced UFS features (including RPMB and background operation) with a compact 153‑TFBGA package and an extended operating temperature range to support demanding embedded environments.
Key Features
- Memory & Capacity 512 Gbit organized as 64G × 8, implemented as NAND Flash (SLC), providing managed non‑volatile storage on a single device.
- UFS Interface JEDEC/UFS specification version 2.1 compliant with an advanced multi‑signal interface, differential I/O pins and support for 2 lanes and Gear 1/2/3 operation for high throughput.
- Integrated Controller & Functional Features Built‑in UFS controller with features such as permanent and power‑on write protection, boot operation (high‑speed boot), replay‑protected memory block (RPMB), command queuing, cache, discard/erase and background operation.
- Power & Voltage Main supply (VCC) 2.7–3.6 V and VCCQ2 1.7–1.95 V, supporting a range of system power domains.
- Reliability & Data Retention Retention performance statements included in datasheet (examples: 5 years @ 55°C at 10% of PE; 1 year @ 55°C at maximum PE) and additional operations such as REFRESH and temperature event notification.
- Qualification & Safety AEC‑Q104 qualification and package compliance notes; options for automotive and functional safety documentation and FMEDA per the datasheet.
- Package & Temperature 153‑TFBGA package (11.5 mm × 13 mm) with operating case temperature range from −40°C to +95°C (TC). Package rated MSL3 in datasheet.
- Clock & Interface Timing Listed clock frequency 52 MHz (device timing parameters provided in datasheet).
Typical Applications
- Automotive storage and boot media High‑density UFS storage with boot operation support for vehicle electronic systems requiring managed non‑volatile memory.
- Secure data and authentication Replay‑protected memory block (RPMB) enables protected storage for authentication keys and secure counters.
- System firmware and background storage Background operation, cache and discard/erase features support firmware storage and maintenance activities without disrupting runtime operation.
- Harsh‑environment embedded systems Extended operating temperature range and AEC qualification make the device suitable for embedded applications operating across wide temperature extremes.
Unique Advantages
- Automotive qualification (AEC‑Q104): Provides documented qualification for applications requiring this level of product assessment.
- JEDEC/UFS 2.1 compliance: Standardized UFS interface and protocol support for compatibility with UFS host controllers that implement the same specification.
- Integrated controller with UFS features: On‑die management, RPMB, high‑speed boot and background operations reduce host software complexity and offload flash management tasks.
- High density in compact package: 512 Gbit capacity in a 153‑TFBGA (11.5 × 13 mm) footprint for space‑constrained applications.
- Wide voltage and temperature operating range: VCC 2.7–3.6 V and case temperature −40°C to +95°C (TC) support diverse system power and environmental conditions.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GASAONS-AIT TR combines a high‑capacity NAND array with an integrated UFS controller and automotive‑level qualification to deliver a managed storage solution optimized for embedded systems that require secure boot, reliable retention, and high throughput. Its UFS2.1 feature set (including RPMB, high‑speed boot, and background operations) simplifies host integration while meeting stringent environmental and qualification requirements.
This device is well suited for designers requiring dense, packaged non‑volatile storage with standardized UFS interfacing and documented AEC qualification. The Micron implementation provides retention and functional safety documentation options to support long‑term reliability and system integration needs.
If you would like pricing, availability, or a formal quote for the MTFC64GASAONS-AIT TR, please request a quote or submit an inquiry to receive product and purchasing information.
