MTFC64GASAONS-AAT TR

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 726 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q104ECCNN/AHTS CodeN/A

Overview of MTFC64GASAONS-AAT TR – IC FLASH 512GBIT MMC 153TFBGA

The MTFC64GASAONS-AAT TR is a 512 Gbit non-volatile NAND flash device integrating a UFS controller and NAND flash memory. It implements JEDEC/UFS specification version 2.1 features and is provided in a 153-ball TFBGA package targeted for automotive-grade storage applications.

Designed for systems requiring high-capacity, high-speed embedded storage, the device offers UFS protocol support, advanced interface options, and automotive-oriented qualification and temperature range for robust operation in demanding environments.

Key Features

  • Memory Core Integrated NAND flash with a memory organization of 64G × 8 delivering 512 Gbit of non-volatile storage.
  • UFS Interface JEDEC/UFS specification version 2.1-compliant controller with an advanced 6-signal interface, differential I/O pins and support for two lanes; high-speed operation with Gear 1/2/3 supported.
  • Boot and System Services Supports high-speed boot operation, permanent and power-on write protection, replay-protected memory block (RPMB), background operation, command queuing and cache/FFU features.
  • Data Management Provides reliable write, discard/erase, REFRESH operation and temperature event notification to assist in data integrity and maintenance workflows.
  • Power Core supply VCC specified at 2.7–3.6 V and VCCQ2 at 1.7–1.95 V.
  • Package and Mounting 153-TFBGA package, nominally 11.5 mm × 13 mm × 1.2 mm, BGA with MSL3 handling.
  • Temperature and Qualification Case operating temperature range −40°C to +105°C (TC) and Qualification: AEC-Q104. Retention characteristics include AEC-Q100-005 compliance notes from the device documentation.
  • Automotive and Functional Safety Options Device options and documentation reference Automotive SPICE Level 1, PPAP and FMEDA (ISO 26262-5:2018) for safety-related development and deployment.

Typical Applications

  • Automotive Storage and Infotainment High-capacity UFS storage suitable for system images, multimedia and persistent data in automotive infotainment systems, with high-speed boot support.
  • Telematics and Connectivity Modules Non-volatile storage for firmware, logs and secure data regions including RPMB in vehicle telematics control units.
  • Advanced Driver Assistance Systems (ADAS) Local storage for maps, logs and system state that benefits from reliable write mechanisms and temperature event notification.

Unique Advantages

  • High Capacity in a Compact Package: 512 Gbit density in a 153-TFBGA (11.5 × 13 mm) package reduces board area while providing large onboard storage.
  • Standards-Based UFS Interface: JEDEC/UFS 2.1 compliance with multi-lane, differential I/O and Gear 1/2/3 support enables high-speed data transfer and interoperability with UFS hosts.
  • Automotive-Grade Qualification: AEC-Q104 qualification and specified −40°C to +105°C case temperature range support deployment in automotive environments.
  • System-Level Protection Features: Permanent and power-on write protection, RPMB and reliable write capabilities help protect firmware and secure data.
  • Functional Safety Documentation Available: Options for Automotive SPICE Level 1, PPAP and FMEDA (ISO 26262-5:2018) support integration into safety-focused development processes.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GASAONS-AAT TR combines a high-density NAND array with a standards-compliant UFS controller to deliver large, high-speed non-volatile storage in a compact automotive-qualified package. Its integrated system features—boot support, secure RPMB, protection mechanisms and background/refresh operations—are targeted at embedded designs that require reliable persistent storage under extended temperature and qualification requirements.

This device is suited for engineers designing automotive storage, telematics, infotainment and safety-related modules who need scalable capacity, JEDEC/UFS interoperability, and documented functional safety options for long-term system reliability.

Request a quote or contact sales to discuss availability, pricing and technical support for the MTFC64GASAONS-AAT TR.

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