MTFC64GASAONS-AAT TR
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 726 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q104 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GASAONS-AAT TR – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GASAONS-AAT TR is a 512 Gbit non-volatile NAND flash device integrating a UFS controller and NAND flash memory. It implements JEDEC/UFS specification version 2.1 features and is provided in a 153-ball TFBGA package targeted for automotive-grade storage applications.
Designed for systems requiring high-capacity, high-speed embedded storage, the device offers UFS protocol support, advanced interface options, and automotive-oriented qualification and temperature range for robust operation in demanding environments.
Key Features
- Memory Core Integrated NAND flash with a memory organization of 64G × 8 delivering 512 Gbit of non-volatile storage.
- UFS Interface JEDEC/UFS specification version 2.1-compliant controller with an advanced 6-signal interface, differential I/O pins and support for two lanes; high-speed operation with Gear 1/2/3 supported.
- Boot and System Services Supports high-speed boot operation, permanent and power-on write protection, replay-protected memory block (RPMB), background operation, command queuing and cache/FFU features.
- Data Management Provides reliable write, discard/erase, REFRESH operation and temperature event notification to assist in data integrity and maintenance workflows.
- Power Core supply VCC specified at 2.7–3.6 V and VCCQ2 at 1.7–1.95 V.
- Package and Mounting 153-TFBGA package, nominally 11.5 mm × 13 mm × 1.2 mm, BGA with MSL3 handling.
- Temperature and Qualification Case operating temperature range −40°C to +105°C (TC) and Qualification: AEC-Q104. Retention characteristics include AEC-Q100-005 compliance notes from the device documentation.
- Automotive and Functional Safety Options Device options and documentation reference Automotive SPICE Level 1, PPAP and FMEDA (ISO 26262-5:2018) for safety-related development and deployment.
Typical Applications
- Automotive Storage and Infotainment High-capacity UFS storage suitable for system images, multimedia and persistent data in automotive infotainment systems, with high-speed boot support.
- Telematics and Connectivity Modules Non-volatile storage for firmware, logs and secure data regions including RPMB in vehicle telematics control units.
- Advanced Driver Assistance Systems (ADAS) Local storage for maps, logs and system state that benefits from reliable write mechanisms and temperature event notification.
Unique Advantages
- High Capacity in a Compact Package: 512 Gbit density in a 153-TFBGA (11.5 × 13 mm) package reduces board area while providing large onboard storage.
- Standards-Based UFS Interface: JEDEC/UFS 2.1 compliance with multi-lane, differential I/O and Gear 1/2/3 support enables high-speed data transfer and interoperability with UFS hosts.
- Automotive-Grade Qualification: AEC-Q104 qualification and specified −40°C to +105°C case temperature range support deployment in automotive environments.
- System-Level Protection Features: Permanent and power-on write protection, RPMB and reliable write capabilities help protect firmware and secure data.
- Functional Safety Documentation Available: Options for Automotive SPICE Level 1, PPAP and FMEDA (ISO 26262-5:2018) support integration into safety-focused development processes.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GASAONS-AAT TR combines a high-density NAND array with a standards-compliant UFS controller to deliver large, high-speed non-volatile storage in a compact automotive-qualified package. Its integrated system features—boot support, secure RPMB, protection mechanisms and background/refresh operations—are targeted at embedded designs that require reliable persistent storage under extended temperature and qualification requirements.
This device is suited for engineers designing automotive storage, telematics, infotainment and safety-related modules who need scalable capacity, JEDEC/UFS interoperability, and documented functional safety options for long-term system reliability.
Request a quote or contact sales to discuss availability, pricing and technical support for the MTFC64GASAONS-AAT TR.