MTFC64GASAONS-AIT ES
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 927 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MTFC64GASAONS-AIT ES – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GASAONS-AIT ES is a 512 Gbit non-volatile NAND flash memory device supplied in a 153-TFBGA (11.5 × 13 mm) package. The device integrates a Universal Flash Storage (UFS) controller and NAND Flash and is provided with an MMC memory interface as specified in the product data.
Designed for embedded systems requiring high-density, persistent storage, the device targets applications that need compact package integration, power-managed operation, and built-in data-protection features drawn from the device specification.
Key Features
- Memory and Density 512 Gbit total capacity organized as 64G × 8, providing high-density non-volatile storage in a single-package solution.
- Controller and Interface Integrates a UFS controller and NAND Flash; product specification lists an MMC memory interface. JEDEC/UFS specification features (v2.1 and selected v3.0 features) are included in the device description.
- Performance and Signaling High-speed UFS signaling features are documented in the device content, including support for advanced multi-lane differential I/O and gear modes (Gear 1/2/3) and two-lane operation.
- Power and Voltage Supply voltage range of 2.7 V to 3.6 V and supporting VCCQ2 at 1.7–1.95 V as indicated in the device documentation.
- Data Protection and Reliability Built-in features include permanent and power-on write protection, replay-protected memory block (RPMB), boot operation, reliable write, discard/erase, command queuing, and background operation.
- Retention and Package Compliance Retention is documented as AEC-Q100-005 compliant in the datasheet content; package is 153-ball JEDEC TFBGA with MSL3 handling noted in the device description.
- Operating Conditions Specified operating temperature range of −40°C to 85°C (TA) and a clock frequency listed as 52 MHz in the product data.
Typical Applications
- Automotive Systems Automotive UFS memory features and documented AEC-Q100-005 retention compliance make the device suitable for embedded storage roles in automotive electronic systems where non-volatile high-density memory is required.
- Embedded Storage Compact 153-TFBGA package and integrated controller support use as primary or extended storage in space-constrained embedded designs.
- Secure Boot and Protected Storage Boot operation and replay-protected memory block (RPMB) features enable use cases that require authenticated or protected storage regions for boot and secure data.
Unique Advantages
- High-density single-package solution: 512 Gbit capacity in a 153-TFBGA (11.5 × 13 mm) package reduces board area for high-capacity storage needs.
- Integrated controller and NAND: UFS controller integration simplifies host interaction and internal management of NAND operations.
- Comprehensive data-protection features: Permanent and power-on write protection plus RPMB and reliable-write mechanisms support secure and reliable data handling.
- Wide supply range: 2.7 V to 3.6 V operation supports common embedded power rails.
- Documented retention compliance: Retention AEC-Q100-005 compliance is listed in the device documentation for designs that reference that retention standard.
- Compact JEDEC package and shipping options: 153-ball JEDEC TFBGA package with availability in tray and tape-and-reel shipping forms simplifies assembly and manufacturing flow.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
This device offers a high-capacity, integrated flash memory option that combines NAND storage with a UFS controller in a compact 153-TFBGA package. The documented feature set—covering multi-lane high-speed signaling, boot and protected storage capabilities, and a broad supply-voltage window—supports embedded designs that need persistent, managed storage with data-protection mechanisms.
MTFC64GASAONS-AIT ES is suitable for design teams targeting compact, high-density storage implementations, including automotive and other embedded systems that reference the device’s retention compliance and packaged form factors. The device is offered in standard manufacturing shipping forms to support production workflows.
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