W74M12FVZPIQ TR
| Part Description |
IC FLASH 128MBIT SPI/QUAD 8WSON |
|---|---|
| Quantity | 817 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 28 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 8-WSON (6x5) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 80 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 8-WDFN Exposed Pad | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Quad I/O | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | 8542.32.0071 |
Overview of W74M12FVZPIQ TR – IC FLASH 128MBIT SPI/QUAD 8WSON
The W74M12FVZPIQ TR is a 128 Mbit non-volatile serial Flash memory in an 8-WSON (6×5) package. It implements a Serial Peripheral Interface with Dual/Quad I/O and supports executing code directly from Dual/Quad SPI (XIP), making it suitable for space-constrained embedded systems.
Designed for systems operating from a single 2.7 V to 3.6 V supply and an ambient temperature range of -40°C to 85°C, the device targets applications that require compact, high-density Flash storage with secure authentication features.
Key Features
- Memory Density — 128 Mbit organized as 16M × 8, providing a large non-volatile storage footprint in a small package.
- Flash Technology — NAND Flash non-volatile memory for persistent code and data storage.
- Serial Interface — SPI with Quad I/O support (Serial Clock, Chip Select, IO0–IO3) for higher throughput and flexible bus configurations.
- Clock Frequency — 80 MHz specified clock frequency for SPI transactions.
- Secure Authentication — Device includes secure authentication features and supports authentication flash operations as described in the datasheet.
- Unique and Security Registers — Includes a 64-bit unique serial number and security register capability (three 256-byte security registers) as documented in the datasheet.
- Power Range — Single-supply operation from 2.7 V to 3.6 V for common 3 V system compatibility.
- Industrial Temperature — Operating range from -40°C to 85°C for a broad set of embedded environments.
- Package — Space-saving 8-WSON (6×5) / 8-WDFN with exposed pad for thermal and PCB mounting considerations.
Typical Applications
- Embedded firmware storage — Non-volatile program storage and code shadowing to RAM for microcontroller-based systems.
- Execute-in-place (XIP) — Execute code directly from Dual/Quad SPI for systems that reduce external RAM requirements.
- Media and data storage — Storage for voice, text and other data in space-constrained products.
- Secure identity and authentication — Devices and systems that leverage on-chip secure authentication features and unique serial number for secure boot or device identity.
Unique Advantages
- High density in a small footprint: 128 Mbit organized as 16M × 8 in an 8-WSON (6×5) package reduces PCB area without sacrificing capacity.
- Flexible high-speed serial interface: Quad I/O SPI enables higher effective data rates and flexible bus usage for faster code and data transfer.
- Integrated secure features: On-device secure authentication and dedicated security registers support enhanced device integrity and identity functions.
- Wide operating conditions: 2.7 V–3.6 V supply range and -40°C to 85°C operating temperature enable use across many embedded system environments.
- XIP capability: Support for executing code directly from Dual/Quad SPI helps simplify system memory architecture and can reduce external RAM requirements.
Why Choose IC FLASH 128MBIT SPI/QUAD 8WSON?
The W74M12FVZPIQ TR offers a combination of high-density 128 Mbit NAND Flash, Quad SPI connectivity, and on-device secure authentication in a compact 8-WSON package. It is positioned for embedded designs that need persistent code and data storage, efficient code execution from serial Flash, and device-level security features within common 3 V system constraints.
This device is suited for engineers and procurement teams building space- and power-conscious products that require reliable non-volatile storage, XIP capability, and secure identity features, delivering a balance of capacity, interface flexibility, and thermal/power compatibility for long-term system integration.
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