3530ECUSAGRM

IC MPU OMAP-35XX 600MHZ 423FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 423-FCBGA (16x16)

Quantity 1,886 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3530
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package423-FCBGA (16x16)
Display & Interface ControllersLCDECCN5A992CGradeIndustrial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case423-LFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed600MHz
Supplier Device Package423-FCBGA (16×16)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of 3530ECUSAGRM – IC MPU OMAP-35XX 600MHz 423-FCBGA

The 3530ECUSAGRM is an industrial-grade microprocessor IC from the Texas Instruments OMAP3530 family featuring an ARM® Cortex®-A8 core operating at 600 MHz in a 423-FCBGA (16×16) package. It combines a high-performance application processor core with integrated multimedia and signal-processing subsystems to address embedded designs that require compute, graphics and I/O integration.

Targeted at embedded and industrial markets, this device delivers a compact, surface-mount solution with LPDDR memory support, graphics acceleration, multiple USB ports and display interface capabilities—all rated for −40 °C to 105 °C operation.

Key Features

  • Core: ARM® Cortex®-A8 single 32-bit core running at 600 MHz providing application-level processing for embedded systems.
  • Co-processors and DSP: Integrated NEON™ SIMD multimedia support and TMS320C64x+ DSP architecture for advanced signal processing and multimedia acceleration; C64x+ memory architecture details such as L1 and L2 memory blocks are included in the device architecture.
  • Graphics and Video Acceleration: On-chip graphics acceleration and video hardware accelerators as part of the OMAP3530 architecture to support rich user interfaces and multimedia workloads.
  • Memory Controller: LPDDR memory controller support for mobile/embedded DRAM configurations.
  • Interfaces: Multiple USB interfaces (USB 1.x — 3 ports and USB 2.0 — 1 port), LCD display controller and HDQ/1-Wire for compact system interfacing.
  • System DMA and I/O: Enhanced DMA (EDMA) controller and peripheral connectivity consistent with the OMAP3530 architecture to support high-throughput data movement and peripheral integration.
  • Package and Mounting: 423-LFBGA / 423-FCBGA supplier device package (16×16) designed for surface-mount assembly.
  • Industrial Qualification: Grade: Industrial, with an operating temperature range of −40 °C to 105 °C for robust field deployments.
  • Compliance: RoHS compliant, meeting modern environmental directives for component selection.

Typical Applications

  • Industrial Control & Automation: Use the industrial-grade temperature range and integrated processing to run embedded control, monitoring and HMI tasks in harsh environments.
  • Multimedia Devices: Leverage graphics acceleration, video hardware accelerators and NEON SIMD to power user interfaces and multimedia playback in embedded products.
  • Signal Processing & Imaging: Employ the C64x+ DSP and NEON coprocessor for real-time signal processing, audio/video codecs and imaging pipelines.
  • Embedded Display Systems: Utilize the LCD display controller and 2D/3D acceleration for compact human-machine interfaces and information displays.

Unique Advantages

  • Integrated Multimedia Subsystems: Combines ARM Cortex-A8 processing with NEON SIMD and DSP architecture to reduce external component count and offload compute-intensive tasks.
  • Compact BGA Package: 423-FCBGA (16×16) delivers a high-density, surface-mount form factor suitable for space-constrained embedded boards.
  • Industrial Temperature Rating: −40 °C to 105 °C operation supports deployments in demanding environments without additional thermal derating.
  • Broad I/O Set: Multiple USB ports, LCD controller and HDQ/1-Wire provide flexible connectivity options for peripheral-rich designs.
  • Memory and DMA Support: LPDDR controller and EDMA architecture enable efficient memory access and high-throughput data transfers for multimedia and real-time workloads.
  • Standards-Based Architecture: Built on the OMAP3530 family architecture to leverage documented processor, DSP and accelerator capabilities for system design and optimization.

Why Choose 3530ECUSAGRM?

The 3530ECUSAGRM positions itself as a balanced, industrial-grade application processor for embedded designs that need combined application processing, multimedia acceleration and DSP capability in a single, compact package. Its ARM® Cortex®-A8 core at 600 MHz, integrated NEON and C64x+ DSP elements, and on-chip graphics/video accelerators make it suited for designs that demand both compute and media performance.

Choose this device when your design requires a robust, well-documented processor architecture with LPDDR memory support, multiple USB interfaces and an LCD display controller, all in a surface-mount 423-FCBGA package rated for −40 °C to 105 °C operation. The RoHS-compliant, industrial-grade configuration supports long-term deployment in embedded and industrial applications.

Request a quote or submit a pricing inquiry for 3530ECUSAGRM to receive available lead-time and volume pricing information.

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