3530ECUSAGRM
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 423-FCBGA (16x16) |
|---|---|
| Quantity | 1,886 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3530 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C64x+, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 423-FCBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A992C | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 423-LFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 600MHz | ||
| Supplier Device Package | 423-FCBGA (16×16) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of 3530ECUSAGRM – IC MPU OMAP-35XX 600MHz 423-FCBGA
The 3530ECUSAGRM is an industrial-grade microprocessor IC from the Texas Instruments OMAP3530 family featuring an ARM® Cortex®-A8 core operating at 600 MHz in a 423-FCBGA (16×16) package. It combines a high-performance application processor core with integrated multimedia and signal-processing subsystems to address embedded designs that require compute, graphics and I/O integration.
Targeted at embedded and industrial markets, this device delivers a compact, surface-mount solution with LPDDR memory support, graphics acceleration, multiple USB ports and display interface capabilities—all rated for −40 °C to 105 °C operation.
Key Features
- Core: ARM® Cortex®-A8 single 32-bit core running at 600 MHz providing application-level processing for embedded systems.
- Co-processors and DSP: Integrated NEON™ SIMD multimedia support and TMS320C64x+ DSP architecture for advanced signal processing and multimedia acceleration; C64x+ memory architecture details such as L1 and L2 memory blocks are included in the device architecture.
- Graphics and Video Acceleration: On-chip graphics acceleration and video hardware accelerators as part of the OMAP3530 architecture to support rich user interfaces and multimedia workloads.
- Memory Controller: LPDDR memory controller support for mobile/embedded DRAM configurations.
- Interfaces: Multiple USB interfaces (USB 1.x — 3 ports and USB 2.0 — 1 port), LCD display controller and HDQ/1-Wire for compact system interfacing.
- System DMA and I/O: Enhanced DMA (EDMA) controller and peripheral connectivity consistent with the OMAP3530 architecture to support high-throughput data movement and peripheral integration.
- Package and Mounting: 423-LFBGA / 423-FCBGA supplier device package (16×16) designed for surface-mount assembly.
- Industrial Qualification: Grade: Industrial, with an operating temperature range of −40 °C to 105 °C for robust field deployments.
- Compliance: RoHS compliant, meeting modern environmental directives for component selection.
Typical Applications
- Industrial Control & Automation: Use the industrial-grade temperature range and integrated processing to run embedded control, monitoring and HMI tasks in harsh environments.
- Multimedia Devices: Leverage graphics acceleration, video hardware accelerators and NEON SIMD to power user interfaces and multimedia playback in embedded products.
- Signal Processing & Imaging: Employ the C64x+ DSP and NEON coprocessor for real-time signal processing, audio/video codecs and imaging pipelines.
- Embedded Display Systems: Utilize the LCD display controller and 2D/3D acceleration for compact human-machine interfaces and information displays.
Unique Advantages
- Integrated Multimedia Subsystems: Combines ARM Cortex-A8 processing with NEON SIMD and DSP architecture to reduce external component count and offload compute-intensive tasks.
- Compact BGA Package: 423-FCBGA (16×16) delivers a high-density, surface-mount form factor suitable for space-constrained embedded boards.
- Industrial Temperature Rating: −40 °C to 105 °C operation supports deployments in demanding environments without additional thermal derating.
- Broad I/O Set: Multiple USB ports, LCD controller and HDQ/1-Wire provide flexible connectivity options for peripheral-rich designs.
- Memory and DMA Support: LPDDR controller and EDMA architecture enable efficient memory access and high-throughput data transfers for multimedia and real-time workloads.
- Standards-Based Architecture: Built on the OMAP3530 family architecture to leverage documented processor, DSP and accelerator capabilities for system design and optimization.
Why Choose 3530ECUSAGRM?
The 3530ECUSAGRM positions itself as a balanced, industrial-grade application processor for embedded designs that need combined application processing, multimedia acceleration and DSP capability in a single, compact package. Its ARM® Cortex®-A8 core at 600 MHz, integrated NEON and C64x+ DSP elements, and on-chip graphics/video accelerators make it suited for designs that demand both compute and media performance.
Choose this device when your design requires a robust, well-documented processor architecture with LPDDR memory support, multiple USB interfaces and an LCD display controller, all in a surface-mount 423-FCBGA package rated for −40 °C to 105 °C operation. The RoHS-compliant, industrial-grade configuration supports long-term deployment in embedded and industrial applications.
Request a quote or submit a pricing inquiry for 3530ECUSAGRM to receive available lead-time and volume pricing information.

Date Founded: 1930
Headquarters: Dallas, Texas, USA
Employees: 34,000+
Revenue: $17.52 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016