AM62A74AUMSIAMBRQ1

2 TOPS VISION SOC WITH RGB-IR IS
Part Description

ARM® Cortex®-A53 Microprocessor IC Sitara™ 4 Core, 64-Bit 1.4GHz 484-FCBGA (18x18)

Quantity 172 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM62A
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-R5FCore ProcessorARM® Cortex®-A53Device Package484-FCBGA (18x18)
Display & Interface ControllersMIPI-CSIECCNN/AEthernet10/100/1000Mbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width4 Core, 64-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case484-BFBGA, FCBGA
RAM ControllersDDR4, LPDDR4REACH ComplianceREACH UnknownRoHS ComplianceUnknown
Security FeaturesAES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMSSpeed1.4GHzSupplier Device Package484-FCBGA (18×18)
USBUSB 2.0 (2)Voltage – I/O1.1V, 1.2V, 1.8V, 3.3V

Overview of AM62A74AUMSIAMBRQ1 – 2 TOPS VISION SOC WITH RGB-IR IS

The AM62A74AUMSIAMBRQ1 is a Sitara AM62A-series vision SoC built around a quad Arm® Cortex®-A53 64-bit microprocessor cluster running up to 1.4 GHz, with integrated vision and deep-learning accelerators. It combines multi-core application processing with dedicated Cortex‑R5F co‑processors, vision ISP and VPAC blocks, and a C7x-based Deep Learning Accelerator to address embedded vision and edge inference workloads.

Designed for automotive-grade and industrial applications, the device offers camera and display support, multimedia codecs, multiple high-speed interfaces, on-chip SRAM and DDR memory subsystem support, and security features—enabling compact, integrated systems for vision-based sensing and edge compute tasks.

Key Features

  • Core & Processing  Quad 64-bit Arm® Cortex®-A53 cluster up to 1.4 GHz with 512 KB L2 shared cache (SECDED ECC) plus integrated Arm® Cortex®-R5F co‑processors for MCU functions and device management.
  • Deep Learning Accelerator  C7x floating-point DSP delivering up to 40 GFLOPS and a Matrix Multiply Accelerator (MMA) capable of up to 2 TOPS (8-bit) for edge inference workloads; includes 1.25 MB L2 SRAM with SECDED ECC.
  • Vision Processing & ISP  Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) capable of 315 MPixel/s, up to 5 MP @ 60 fps, support for 12‑bit RGB‑IR and up to 16‑bit RAW inputs, WDR, LDC, VISS and multi-scalar processing.
  • Memory Subsystem  Supports DDR4 and LPDDR4 with a 32‑bit data bus and inline ECC; up to 8 GByte addressable DDR range and multiple on‑chip SRAM/OCRAM banks with SECDED ECC totaling up to 2.29 MB on-chip.
  • Multimedia & Video  Hardware encode/decode supporting HEVC (H.265) and H.264 up to 4K UHD; Motion JPEG encode at high throughput and a display subsystem supporting up to 2048×1080 @ 60 fps with 24‑bit DPI output.
  • Interfaces & Connectivity  MIPI CSI‑2 receiver with up to 4‑lane D‑PHY (2.5 Gbps per lane), two 10/100/1000 Mbps Ethernet ports, USB 2.0 ports, DMA and other system interfaces.
  • Security & Reliability  Integrated security features including AES, ARM TrustZone, RSA, ECC, SHA2, PKA, DRBG, Secure Boot and hardware random number generation; memory ECC and CRC protections across subsystems.
  • Package & Thermal  Supplied in a 484‑FCBGA (18×18) surface‑mount package and rated for an operating temperature range of −40 °C to 125 °C. The device carries AEC‑Q100 qualification and is graded for automotive use.

Typical Applications

  • Automotive vision systems  Camera and vision subsystems that require RGB‑IR ISP support, vision accelerators and safety‑focused memory ECC in automotive environments.
  • Edge AI and inference appliances  On‑device deep learning inference using the C7x accelerator and MMA for real‑time vision analytics.
  • Smart cameras and machine vision  High‑throughput ISP and VPAC blocks for multi‑megapixel image capture, preprocessing and direct DDR streaming via DMA.
  • Multimedia gateways and displays  Systems requiring hardware video encode/decode and a display subsystem supporting up to 2048×1080 @ 60 fps.

Unique Advantages

  • Integrated vision and AI accelerators: Combines ISP, VPAC and a C7x/MMA deep learning engine to consolidate camera preprocessing and inference on a single device, reducing external accelerator needs.
  • Automotive‑grade qualification: AEC‑Q100 qualification and an industrial temperature range (−40 °C to 125 °C) support deployment in automotive and harsh environments.
  • Robust on‑chip memory and ECC: Multiple SECDED ECC‑protected on‑chip SRAM banks and inline DDR ECC increase system reliability for safety‑oriented applications.
  • Comprehensive multimedia support: Hardware codecs for HEVC/H.265 and H.264 plus high‑throughput MIPI CSI‑2 and display interfaces enable end‑to‑end video pipelines.
  • Flexible memory and I/O: LPDDR4/DDR4 support, dual Gigabit Ethernet and USB 2.0 ports provide a versatile platform for connectivity and high‑bandwidth data movement.

Why Choose AM62A74AUMSIAMBRQ1?

The AM62A74AUMSIAMBRQ1 positions multi‑core application processing, deterministic MCU functions, vision preprocessing and edge AI acceleration within a single automotive‑grade SoC. Its combination of Cortex‑A53 cores, Cortex‑R5F co‑processors, C7x deep learning engine and VPAC/ISP subsystems makes it suited to embedded systems that require integrated vision pipelines, hardware media processing and robust system security.

This device is well suited for designers targeting automotive and industrial vision systems that need scalable inference performance, ECC‑protected memory, comprehensive I/O and media capabilities, and a compact 484‑FCBGA package for production deployments.

Request a quote or submit an inquiry to receive pricing, availability and technical support for AM62A74AUMSIAMBRQ1 and to discuss integration into your next vision or edge AI design.

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