LS1020AXN7MQB

IC MPU QORIQ 1.2GHZ 525FCPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32-Bit 1.2GHz 525-FCPBGA (19x19)

Quantity 60 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1020A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package525-FCPBGA (19x19)
ECCNPENDING ECCNEthernetGbE (3)HTS Code0000.00.0000
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 105°CPackage / Case525-FBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesSecure Boot, TrustZone®Speed1.2GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 (1), USB 3.0 + PHY

Overview of LS1020AXN7MQB – IC MPU QORIQ 1.2GHZ 525FCPBGA

The LS1020AXN7MQB is an NXP QorIQ Layerscape microprocessor integrating dual ARM® Cortex®-A7 cores running at up to 1.2 GHz. It targets power‑sensitive embedded networking and industrial applications that require multi‑core processing, high‑speed I/O and integrated security.

Designed for systems requiring efficiency and integration, the device combines ECC‑protected caches, advanced security features and a broad set of high‑speed interfaces to address use cases such as enterprise access points, IoT gateways, controllers and security appliances.

Key Features

  • Core  Dual ARM® Cortex®-A7 cores, 32‑bit, operating up to 1.2 GHz for multicore application processing and control.
  • On‑chip Acceleration  NEON™ SIMD and multimedia co‑processor support plus dual-precision FPU for compute‑intensive signal and media tasks.
  • Memory  Integrated DDR3L/DDR4 memory controllers supporting multiple bus widths to accommodate flexible memory configurations.
  • Cache and Reliability  ECC protection for L1 and L2 caches to improve data integrity in embedded systems.
  • High‑Speed Interfaces  Four‑lane, 6 GHz multprotocol SerDes supporting up to three Gigabit Ethernet ports (with IEEE 1588), dual PCIe Gen2 DMA‑controlled ports and additional serial I/O.
  • Storage and USB  Single SATA 3.0 port (3 Gbps) and dual USB controllers including USB 3.0 with integrated PHY and USB 2.0 support.
  • Security  Secure Boot and ARM TrustZone® for hardware‑backed platform security and partitioning.
  • System Integration  QUICC Engine support (on LS1020A) and a broad set of peripheral interfaces such as QuadSPI, IFC, SD/MMC, I2C and SPI to simplify system design.
  • Power  Engineered for power‑sensitive applications with device-level design points targeting operation under 3 W.
  • Package & Temperature  525‑FCPBGA (19×19) surface‑mount package rated for industrial operation from −40 °C to 105 °C.
  • Qualification & Compliance  Industrial qualification and RoHS compliance for deployment in regulated embedded environments.

Typical Applications

  • Enterprise Access Points and Routers  Dual cores, multiple GbE ports and IEEE 1588 support enable high‑performance networking for 802.11ac/n access points and gateway devices.
  • I/O Line Cards and Controllers  Integrated PCIe, SerDes lanes and rich peripheral set serve I/O expansion, line card and controller designs requiring deterministic data paths.
  • Security Appliances  Hardware security features such as Secure Boot and TrustZone® together with multicore processing address secure packet processing and appliance control.
  • IoT Gateways and Building Automation  Low‑power design, multiple serial interfaces and memory controller support make the device suitable for gateway aggregation and building control systems.
  • Smart Energy and Industrial Systems  Industrial qualification and extended temperature operation support deployment in smart energy and industrial automation applications.

Unique Advantages

  • Dual‑core performance in a compact package: Dual ARM® Cortex®‑A7 cores at up to 1.2 GHz deliver multicore application throughput in a 525‑FCPBGA footprint.
  • Integrated high‑speed I/O: SerDes, multiple GbE ports, PCIe Gen2, SATA and USB 3.0 (with PHY) reduce external chipset needs and simplify board design.
  • Security and system partitioning: Secure Boot and ARM TrustZone® provide a hardware foundation for secure firmware and runtime isolation.
  • Reliability for embedded deployments: ECC‑protected caches and industrial temperature qualification support robust operation in demanding environments.
  • Power‑aware architecture: Designed for power‑sensitive applications with system power targets under 3 W, enabling energy‑efficient designs.
  • Enablement and ecosystem: Part of the QorIQ Layerscape family with available software and ecosystem resources to accelerate development and integration.

Why Choose LS1020AXN7MQB?

The LS1020AXN7MQB positions itself as a highly integrated, power‑aware microprocessor for embedded networking and industrial applications that require dual‑core processing, robust security and an extensive set of high‑speed interfaces. Its combination of ECC‑protected caches, Secure Boot/TrustZone® and on‑chip SerDes/PCIe/GbE connectivity reduces external components and simplifies system architecture.

This device is well suited to designers building enterprise access points, IoT gateways, controllers and security appliances who need predictable operation across industrial temperature ranges and the long‑term benefits of vendor enablement and ecosystem support.

Request a quote or submit an inquiry to get pricing and availability information for LS1020AXN7MQB and begin your design evaluation today.

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