LS1021ASE7HNB

IC MPU QORIQ 800MHZ 525FCPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32-Bit 800MHz 525-FCPBGA (19x19)

Quantity 1,359 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1021A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A7Device Package525-FCPBGA (19x19)Display & Interface Controllers2D-ACE
ECCN5A002A1 FREEthernetGbE (3)HTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°CPackage / Case525-FBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 6Gbps (1)Security FeaturesSecure Boot, TrustZone®Speed800MHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 3.0 (1) + PHY

Overview of LS1021ASE7HNB – ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32‑Bit 800MHz 525‑FCPBGA (19×19)

The LS1021ASE7HNB is an NXP QorIQ Layerscape microprocessor integrating a dual‑core ARM® Cortex®‑A7 architecture running at 800 MHz. It targets compact, fanless and power‑efficient embedded networking and industrial designs where integration, security and multiple high‑speed I/O are required.

Typical market segments include enterprise access points, multi‑protocol IoT gateways, industrial and factory automation, mobile wireless routers, and building automation where robust networking, storage and peripheral support are essential.

Key Features

  • Core  Dual ARM® Cortex®‑A7 cores, 32‑bit, operating at 800 MHz as specified for this part.
  • Cache and Security  Series‑level design includes ECC protection for caches and integrates Secure Boot and ARM TrustZone® for hardware‑assisted security and trusted execution.
  • Memory  On‑chip memory controller supporting DDR3L and DDR4; series documentation indicates support for 8‑, 16‑ or 32‑bit interfaces at up to 1600 MHz.
  • Networking and High‑Speed I/O  Three Gigabit Ethernet (GbE) ports, a four‑lane multi‑protocol SerDes, dual PCIe Gen2 ports (DMA controlled) and one SATA 6 Gbps port provide broad connectivity for networking and storage.
  • USB and Peripherals  Integrated SuperSpeed USB 3.0 controller with PHY plus additional USB functionality; serial IO includes multiple UARTs, I2C and SPI options as indicated by the series documentation.
  • Display and Multimedia  Integrated 2D‑ACE display interface controller and series support for LCD integration suitable for user interfaces.
  • Industrial I/O  Series features include multiple CAN ports and up to 10 UARTs for industrial protocol support and sensor/field device connectivity.
  • Package and Temperature  525‑FCPBGA (19×19) surface‑mount package; operating temperature range 0 °C to 105 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Enterprise Access Points: High‑integration networking for 802.11ac/n access points requiring multiple GbE ports and USB/SATA peripherals.
  • Multi‑protocol IoT Gateways: Gateway designs that need secure boot, TrustZone® and a mixture of high‑speed and serial interfaces for edge aggregation.
  • Industrial Automation: Factory floor controllers and protocol translators using multiple CAN ports, extensive UARTs and robust memory interfaces.
  • Mobile Wireless Routers: Compact, fanless routers benefiting from low power operation, integrated SerDes and PCIe connectivity.
  • Building and Energy Automation: Control and monitoring nodes that require secure boot, display support and diverse I/O for sensors and actuators.

Unique Advantages

  • Dual‑core efficiency: Two ARM® Cortex®‑A7 cores at 800 MHz deliver a balance of performance and power efficiency for fanless embedded systems.
  • Highly integrated I/O: Multiple GbE ports, PCIe, SATA and USB 3.0 with PHY reduce external controller count and simplify BOM and board layout.
  • Security‑aware design: Secure Boot and TrustZone® provide hardware foundations for secure device boot and trusted execution environments.
  • Memory flexibility: DDR3L/DDR4 controller with support for multiple data widths allows scalable memory configurations to match application needs.
  • Industrial connectivity: On‑chip CAN, numerous UARTs and serial interfaces enable direct interfacing with industrial protocols and field devices.
  • Compact packaging: 525‑FCPBGA (19×19) package enables placement in small form‑factor designs while keeping high pin count for rich peripheral access.

Why Choose LS1021ASE7HNB?

The LS1021ASE7HNB positions itself as a compact, highly integrated Layerscape microprocessor for embedded networking and industrial applications that require balanced performance, security and extensive peripheral connectivity. Its ARM® Cortex®‑A7 dual‑core architecture combined with onboard support for GbE, PCIe, SATA and USB 3.0 simplifies system design and reduces overall BOM.

This part is well‑suited to engineers designing fanless, small‑form‑factor networked products and industrial controllers who need scalable memory options, hardware security features and a broad ecosystem for software and development support.

Request a quote or submit a purchase inquiry to get pricing and availability for the LS1021ASE7HNB. Our team can assist with lead times and volume pricing to support your design cycle.

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