LS1020AXN7HNB

IC MPU QORIQ 800MHZ 525FCPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32-Bit 800MHz 525-FCPBGA (19x19)

Quantity 1,101 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1020A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package525-FCPBGA (19x19)
ECCN3A991A2EthernetGbE (3)HTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 105°CPackage / Case525-FBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesSecure Boot, TrustZone®Speed800MHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 (1), USB 3.0 + PHY

Overview of LS1020AXN7HNB – ARM Cortex‑A7 2‑Core 800 MHz QorIQ Layerscape MPU

The LS1020AXN7HNB is an NXP QorIQ LS1020A series microprocessor integrating dual ARM® Cortex®‑A7 cores at 800 MHz in a 525‑FCPBGA (19×19) package. It targets power‑sensitive networking and industrial embedded applications that require balanced processing, security and multiple high‑speed interfaces.

With dual 32‑bit cores, NEON™ SIMD multimedia acceleration, hardware security features and a broad set of I/O controllers, this device delivers a compact, industrial‑qualified platform for routers, gateways, control and security appliances.

Key Features

  • Core Dual ARM® Cortex®‑A7 cores, 32‑bit, operating at 800 MHz for multitasking and embedded processing.
  • Acceleration NEON™ SIMD multimedia co‑processor for enhanced multimedia and signal processing workloads.
  • Memory Integrated memory controller support for DDR3L and DDR4 types to accommodate modern system memory configurations.
  • Ethernet Up to three Gigabit Ethernet ports for robust wired networking and real‑time packet handling.
  • Storage and USB Single SATA 3 Gb/s interface and both USB 2.0 and USB 3.0 (with integrated PHY) for storage and high‑speed peripheral connectivity.
  • Security Secure Boot and ARM® TrustZone® hardware security features to enable secure system boot and trusted execution environments.
  • Reliability Industrial qualification and wide operating temperature range from −40 °C to 105 °C for deployment in demanding environments.
  • Package & Mounting 525‑FCPBGA (19×19) surface‑mount package designed for compact, board‑level integration.
  • Regulatory RoHS compliant.

Typical Applications

  • Enterprise Access Points and Routers — Dual cores, multiple Gigabit Ethernet ports and integrated high‑speed I/O support 802.11ac/n access point and edge routing functions.
  • I/O Line Cards and Controllers — Memory controller options and multiple serial interfaces enable rich I/O aggregation and line card designs.
  • Security Appliances — Secure Boot and TrustZone® support provide foundations for secure packet processing and enforcement of trusted services.
  • IoT Gateways and Building Automation — Industrial temperature range and integrated connectivity simplify gateway designs that bridge field networks to cloud or enterprise systems.
  • Smart Energy and Industrial Equipment — Rugged operating range and comprehensive peripheral set support monitoring, control and data aggregation tasks.

Unique Advantages

  • Balanced dual‑core performance: Two Cortex‑A7 cores at 800 MHz provide multithreaded processing capacity while keeping system complexity manageable.
  • Integrated networking interfaces: Native support for up to three GbE ports plus SATA and USB 3.0 with PHY reduces external controller count and BOM.
  • Hardware security foundations: Secure Boot and TrustZone® enable platform integrity and isolation of secure functions without extra external security devices.
  • Industrial readiness: Qualification for industrial use and −40 °C to 105 °C operation make the device suitable for factory and infrastructure deployments.
  • Memory flexibility: DDR3L and DDR4 controller support allows designers to choose memory technology that best fits capacity, power and cost targets.
  • Compact packaging: 525‑FCPBGA (19×19) footprint enables dense board layouts for space‑constrained embedded systems.

Why Choose LS1020AXN7HNB?

The LS1020AXN7HNB positions itself as a compact, industrially qualified layerscape solution that combines dual ARM Cortex‑A7 processing, multimedia acceleration and a broad set of integrated interfaces to simplify embedded networking and control designs. Its security features and memory interface options provide a solid foundation for secure, scalable products.

This part is well suited to designers building enterprise networking equipment, secure gateways, industrial controllers and other embedded systems that require a balance of processing capability, integration and environmental robustness backed by the LS1020A series ecosystem and enablement materials.

Request a quote or submit an inquiry for pricing and availability for the LS1020AXN7HNB to start your design evaluation and procurement process.

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