LS1023AXN7KQB

IC MPU QORIQ 1.0GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.0GHz 621-FCPBGA (21x21)

Quantity 1,768 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (21x21)ECCN5A002A1
Ethernet1GbE (7) or 10GbE (1) & 1GbE (5)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case621-FBGA, FCBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.0GHzSupplier Device Package621-FCPBGA (21×21)
USBUSB 3.0 (2) + PHY

Overview of LS1023AXN7KQB – IC MPU QORIQ 1.0GHZ 621FCPBGA

The LS1023AXN7KQB is an NXP QorIQ Layerscape microprocessor featuring a dual-core ARM® Cortex®-A53 64-bit CPU running at 1.0 GHz. Designed for embedded networking and industrial edge applications, this industrial‑qualified device combines compute, integrated I/O and security features for compact, fanless system designs.

Its architecture targets small-form-factor networking and industrial infrastructure use cases, offering a balance of performance, integration and thermal resilience for designs that require extended operating temperature and BOM-optimized implementations.

Key Features

  • CPU Core — Dual ARM® Cortex®-A53 64-bit cores at 1.0 GHz, providing a modern 64-bit processing foundation for embedded networking and control tasks.
  • Memory Support — Integrated controllers for DDR3L and DDR4 memory to support flexible system memory configurations.
  • High-speed I/O and SerDes — Multi-protocol SerDes for high-speed interfaces and support for multiple Gigabit Ethernet ports and PCIe interfaces to enable robust networking and peripheral connectivity.
  • Ethernet and Networking — Configurable Ethernet options (including multiple 1 GbE and 10 GbE port configurations) and Frame Manager capabilities for hardware packet parsing, classification and policing to offload CPU processing.
  • Storage and USB — Integrated SATA 6 Gb/s (SATA 3.0) support and USB 3.0 interfaces with PHY for high-bandwidth peripheral and storage connectivity.
  • Security — Hardware security features including Secure Boot and ARM TrustZone® plus an integrated security engine to enable in-line IPsec and cryptographic offload.
  • Package and Mounting — 621‑FCPBGA (21 × 21 mm) surface-mount package suitable for compact, PCB‑level integration.
  • Industrial Qualification and Temperature — Industrial-qualified device with an operating temperature range of −40 °C to 105 °C for reliable operation in harsh environments.
  • Compliance — RoHS compliant to meet standard environmental requirements.

Typical Applications

  • Branch Office Routers — Dual Cortex‑A53 cores and integrated networking I/O enable compact routing platforms with hardware packet processing.
  • vCPE and Edge Equipment — Designed for small-form-factor, fanless edge devices where BOM optimization and integrated interfaces reduce system cost and complexity.
  • Multi‑protocol IoT Gateways — Flexible SerDes and multiple Ethernet options support mixed connectivity and protocol translation at the network edge.
  • Industrial PLC and Control — Industrial qualification and extended temperature range suit control and automation systems requiring dependable operation in challenging environments.
  • Security Appliances — Integrated security engine and Frame Manager capabilities enable in-line IPsec and packet processing for security-focused network appliances.

Unique Advantages

  • Integrated I/O Reduces BOM: Multi-protocol SerDes, Ethernet, PCIe, SATA and USB integration minimizes external components and simplifies board design.
  • Security Built In: Secure Boot, TrustZone® and an integrated security engine enable hardware-enforced security and cryptographic offload for protected system designs.
  • Industrial‑grade Reliability: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh, industrial environments.
  • Small Form Factor Package: 621‑FCPBGA (21 × 21 mm) package allows compact system layouts and supports fanless, space-constrained platforms.
  • Memory Flexibility: Support for DDR3L and DDR4 memory controllers enables designers to choose memory technology that fits performance and cost requirements.
  • Targeted Networking Performance: Architecture and offload-capable Frame Manager enable high-throughput networking with reduced CPU overhead, suitable for edge and gateway devices.

Why Choose LS1023AXN7KQB?

The LS1023AXN7KQB combines dual 64‑bit ARM Cortex‑A53 cores, flexible memory support and a comprehensive set of integrated I/O and security capabilities in a compact, industrial‑qualified package. It is positioned for designs that require reliable, connected edge compute with the ability to offload packet processing and cryptographic workloads to dedicated engines.

This part is well suited to engineers building small-form-factor networking, edge and industrial control systems that benefit from BOM optimizations, fanless operation and extended temperature operation. Its integration of networking, storage and security features supports scalable designs with a focus on reliability and efficient system integration.

Request a quote or submit an inquiry to receive pricing and availability for LS1023AXN7KQB and to discuss how this processor can fit your embedded networking or industrial design requirements.

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