LS1023AXE8PQB

IC MPU QORIQ 1.4GHZ 780FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.4GHz 780-FCPBGA (23x23)

Quantity 189 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FCPBGA (23x23)ECCN5A002A1
Ethernet1GbE (7) or 10GbE (1) & 1GbE (5)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.4GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (2) + PHY

Overview of LS1023AXE8PQB – IC MPU QORIQ 1.4GHz 780-FCPBGA

The LS1023AXE8PQB is a QorIQ Layerscape microprocessor IC featuring a dual-core ARM® Cortex®-A53 64-bit CPU running at 1.4 GHz. It targets embedded networking and industrial infrastructure applications, offering a compact, highly integrated communications-focused SoC design.

Designed for small-form-factor and industrial use, the device combines multi-protocol high-speed I/O, memory controller support for DDR3L/DDR4, and hardware security features to deliver performance, integration, and operational reliability for edge networking and industrial control platforms.

Key Features

  • CPU Core – Dual ARM® Cortex®-A53 64-bit cores at 1.4 GHz, delivering a balance of performance and power efficiency for embedded networking tasks.
  • Cache & System Interconnect – Series architecture includes a generous L2 cache and ARM CoreLink CCI‑400 coherent interconnect with SMMU support for robust memory and accelerator access control.
  • Memory – Integrated memory controller support for DDR3L and DDR4 DRAM types to match modern embedded memory requirements.
  • High‑Speed SerDes and I/O – Four‑lane, multi‑protocol SerDes fabric for high‑speed interface support; flexible Ethernet options as specified for the series.
  • Ethernet Configuration – Flexible networking options: configurations cited include seven 1GbE ports or one 10GbE plus five 1GbE ports, enabling a range of connectivity topologies.
  • Storage & USB – Single SATA 6 Gbps (SATA 3.0) port and two USB 3.0 ports with PHY for high-bandwidth peripheral and storage connectivity.
  • PCIe – Series-level support for multiple DMA-controlled PCI Express Gen2 interfaces suitable for expansion and offload engines.
  • Data Path Acceleration – On-chip data path acceleration architecture (DPAA) and Frame Manager functionality for hardware-assisted packet parsing, classification and policing to reduce CPU overhead.
  • Security – Hardware security features including Secure Boot and ARM TrustZone® for platform integrity and trusted execution.
  • Industrial Qualification & Thermal – Industrial qualification with operating temperature range from −40°C to 105°C for deployment in demanding environments.
  • Package & Mounting – 780‑FCPBGA supplier device package (23 × 23 mm), surface-mount package suited to compact PCB designs.
  • RoHS Compliance – RoHS‑compliant manufacturing status for regulatory and environmental considerations.

Typical Applications

  • Edge and Branch Networking – Ideal for branch office routers and vCPE where compact, high‑throughput packet handling and flexible Ethernet configurations are required.
  • Integrated Services & Security Appliances – Suitable for integrated service platforms and security appliances that benefit from hardware acceleration and built‑in security features like Secure Boot and TrustZone®.
  • IoT and Gateway Devices – Multi‑protocol IoT gateways and industrial gateways that need a combination of multi‑port Ethernet, SerDes connectivity and managed storage interfaces.
  • Industrial Control – Industrial PLC and control systems that require industrial temperature qualification and reliable, high‑performance processing for deterministic workloads.

Unique Advantages

  • Purpose-built communications processing: Architecture and DPAA offloads reduce CPU overhead for packet processing, enabling higher effective throughput in small-form-factor designs.
  • Flexible networking I/O: Configurable Ethernet port options and multi‑protocol SerDes enable a variety of board-level network topologies without extensive external logic.
  • Integrated security primitives: Secure Boot and TrustZone® support help establish device trust and protect software stacks from early boot through runtime.
  • Industrial-grade operation: Qualification for industrial use and a −40°C to 105°C operating range support deployments in harsh and temperature-variable environments.
  • Compact package: 780‑FCPBGA (23×23 mm) surface-mount package supports high-density, low-BOM system designs for space-constrained applications.

Why Choose LS1023AXE8PQB?

The LS1023AXE8PQB positions itself as a compact, industrial-grade Layerscape microprocessor suited for edge networking and industrial infrastructure designs that require balanced CPU performance, flexible high‑speed I/O, and hardware security. Its dual ARM® Cortex®-A53 cores, DDR3L/DDR4 memory support, and integrated acceleration/Frame Manager features enable efficient packet processing and system integration for small-form-factor appliances.

For designers targeting branch routers, gateways, industrial controllers, and service appliances, this part offers a scalable, vendor-supported architecture with the thermal and qualification characteristics needed for deployed embedded systems.

Request a quote or submit an inquiry for pricing and availability of the LS1023AXE8PQB to evaluate it for your next embedded networking or industrial design.

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