LS1023AXN7PQB

IC MPU QORIQ 1.4GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.4GHz 621-FCPBGA (21x21)

Quantity 670 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (21x21)ECCN5A002A1
Ethernet1GbE (7) or 10GbE (1) & 1GbE (5)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case621-FBGA, FCBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.4GHzSupplier Device Package621-FCPBGA (21×21)
USBUSB 3.0 (2) + PHY

Overview of LS1023AXN7PQB – ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2‑Core 1.4GHz

The LS1023AXN7PQB is a QorIQ Layerscape microprocessor featuring a dual‑core, 64‑bit ARM® Cortex®‑A53 CPU running at 1.4 GHz. It is purpose-built for embedded networking and industrial edge applications, offering a compact, highly integrated SoC footprint for small‑form‑factor and fanless designs.

Designed for integrated services, branch office and edge equipment, and industrial control, the LS1023A family delivers network‑centric performance (greater than 10 Gb/s for the dual‑core configuration) while providing flexible I/O and hardware security features for robust embedded deployments.

Key Features

  • Core and CPU Dual ARM® Cortex®‑A53 64‑bit cores at 1.4 GHz, delivering multi‑threaded processing for embedded networking and control tasks.
  • Memory Support Integrated memory controllers for DDR3L and DDR4, enabling flexible memory choices for performance and power tradeoffs.
  • High‑Speed Networking Configurable Ethernet options including multiple 1 GbE ports or a combination of 10 GbE and 1 GbE ports; integrated Frame Manager provides hardware packet parsing, classification and policing.
  • SerDes and I/O Flexibility Four‑lane, multi‑protocol SerDes and a versatile I/O subsystem support high‑speed interfaces suitable for a range of networking peripherals.
  • Storage and USB Single SATA 6 Gbps interface and two USB 3.0 ports with PHY integration for high‑bandwidth storage and peripheral connectivity.
  • Security Hardware security features including Secure Boot and ARM TrustZone®; the integrated security engine (SEC 5.4) supports inline cryptographic offload such as IPsec.
  • Package and Thermal Supplied in a 621‑FCPBGA (21 × 21 mm) surface‑mount package and specified for industrial temperature operation from −40 °C to 105 °C.
  • Qualification and Compliance Industrial qualification and RoHS compliance for deployment in industrial and infrastructure applications.

Typical Applications

  • Branch Office Routers Dual‑core processing, flexible Ethernet and packet handling accelerate routing and security functions for small enterprise sites.
  • vCPE and Edge Appliances Compact Layerscape integration and >10 Gb/s throughput enable virtualized customer premises equipment and edge compute platforms.
  • Multi‑Protocol IoT Gateways High‑speed SerDes, multiple Ethernet ports and protocol offload engines support heterogeneous connectivity and protocol translation at the edge.
  • Industrial PLC and Control Industrial temperature range and robust I/O make the device suitable for control and automation systems requiring reliable, long‑life operation.
  • Security Appliances Integrated security engine and TrustZone® support hardware‑accelerated cryptographic workloads and secure boot chains for network security devices.

Unique Advantages

  • Network‑Centric Performance: Dual‑core 64‑bit Cortex‑A53 architecture plus Layerscape data path features enable greater than 10 Gb/s packet performance for edge use cases.
  • Integrated Connectivity: Multiple Ethernet configurations, SATA 6 Gbps and USB 3.0 reduce external component count and simplify board design.
  • Hardware Security Foundation: Secure Boot, TrustZone® and the integrated SEC engine enable secure provisioning and cryptographic acceleration without heavy CPU load.
  • Industrial Readiness: Specified for −40 °C to 105 °C and industrial qualification for deployment in harsh environments.
  • Compact Package: 621‑FCPBGA (21 × 21 mm) surface‑mount package supports small‑form‑factor and fanless product designs.
  • Design Efficiency: Layerscape architecture and integrated offload engines help lower BOM and power needs for cost‑effective edge systems.

Why Choose LS1023AXN7PQB?

The LS1023AXN7PQB combines dual ARM® Cortex®‑A53 cores, flexible high‑speed I/O and integrated security to address demanding embedded networking and industrial applications. Its Layerscape architecture and offload engines provide the throughput and packet processing capabilities required for edge routing, gateways and security appliances while supporting industrial temperature operation.

This device is suited for designers seeking a compact, industrially qualified microprocessor with strong networking integration, hardware security features, and a reduced BOM footprint for small‑form‑factor and fanless systems.

Request a quote or submit an inquiry to receive pricing and availability information for LS1023AXN7PQB and to discuss how it fits your next embedded networking or industrial design.

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