LS2084ACE7TTB

LAYERSCAPE 64-BIT ARM CORTEX-A72
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 8 Core, 64-Bit 1.8GHz 1292-BGA (37.5x37.5)

Quantity 1,788 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS2084A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1292-BGA (37.5x37.5)ECCNN/A
Ethernet10GbE (8), 1GbE (16), 2.5GbE (16)Graphics AccelerationNoHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case1292-BBGA
RAM ControllersDDR4, SDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 6Gbps (2)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1292-BGA (37.5×37.5)USBUSB 3.0 + PHY (2)

Overview of LS2084ACE7TTB – LAYERSCAPE 64-BIT ARM CORTEX-A72

The LS2084ACE7TTB is an NXP Layerscape microprocessor featuring an 8-core, 64-bit ARM® Cortex®-A72 architecture running at 1.8 GHz. It combines multi-core processing with high-density I/O to address compute-intensive embedded networking and industrial applications.

Designed for systems that require integrated memory support, multi‑gigabit Ethernet connectivity and hardware security, this device delivers a compact surface-mount solution in a 1292-BGA (37.5 × 37.5 mm) package with industrial temperature qualification.

Key Features

  • Processor Core  8-core ARM® Cortex®-A72, 64-bit operation at 1.8 GHz for multi-threaded embedded workloads.
  • Memory Interfaces  Support for DDR4 and SDRAM memory controllers to meet system memory requirements.
  • High‑Density Ethernet  Multiple Ethernet interfaces including 10GbE (8 ports), 2.5GbE (16 ports) and 1GbE (16 ports) for carrier-grade and enterprise networking.
  • Storage & USB  SATA 6 Gbps (2 ports) and USB 3.0 with PHY (2 ports) for high-speed storage and peripheral connectivity.
  • Security  Integrated Secure Boot and Arm TrustZone® provide hardware-backed platform security features.
  • Additional Interfaces  DUART and other peripheral interfaces for console, control and management functions.
  • Package & Mounting  1292-BBGA supplier device package (1292-BGA, 37.5 × 37.5 mm) designed for surface-mount assembly.
  • Qualification & Temperature  Industrial qualification with operating temperature range from −40 °C to 105 °C for deployment in rugged environments.
  • Graphics  No graphics acceleration — optimized for networking, control-plane and compute tasks where GPU capability is not required.
  • Compliance  RoHS compliant.

Typical Applications

  • Networking Infrastructure  Control-plane and data-plane processing for switches, routers and edge devices that require dense Ethernet connectivity and multi-core compute.
  • Data Center Offload  Embedded processing for NICs, acceleration appliances and control functions that benefit from integrated high-speed I/O and multi-core performance.
  • 5G Packet Processing  Baseband-adjacent and packet-processing tasks where multi-core ARM processing and multiple high-speed Ethernet ports are required.
  • Industrial Systems  Industrial controllers, gateways and communication hubs that need industrial temperature operation, robust I/O and hardware security.

Unique Advantages

  • Multi-core 64‑bit compute: 8 Cortex‑A72 cores at 1.8 GHz provide scalable processing for parallel networking and control workloads.
  • Extensive networking I/O: High port counts across 10GbE, 2.5GbE and 1GbE simplify designs that require many physical network interfaces.
  • Integrated storage and peripheral support: Dual SATA 6 Gbps and USB 3.0 + PHY reduce the need for external controllers and lower BOM complexity.
  • Hardware security primitives: Secure Boot and TrustZone® enable foundational platform security for trusted system boot and isolation.
  • Industrial-grade operation: Qualification for industrial use and operation from −40 °C to 105 °C supports deployment in demanding environments.
  • Compact surface-mount package: 1292-BGA (37.5 × 37.5 mm) minimizes board area while delivering high integration.

Why Choose LS2084ACE7TTB?

The LS2084ACE7TTB positions itself as a high‑integration embedded processor for designs that demand multi-core ARM performance, extensive networking interfaces and industrial robustness. Its combination of 8 Cortex‑A72 cores, broad Ethernet support, storage and peripheral interfaces and hardware security features makes it well suited for advanced networking, data‑offload and industrial gateway applications.

With industrial qualification and a compact BGA footprint, the device helps simplify system architecture by reducing external components while meeting operating temperature requirements for harsher deployments.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LS2084ACE7TTB.

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