LS2084ASE7V17B

The LS2084ASE7V17B is an NXP Layerscape microprocessor IC built around ARM® Cortex®-A72 cores, delivering an 8-core, 64-bit processing platform running at 2 GHz. Designed for embedded networking and compute-focused applications, this device combines multi-core performance with high-bandwidth I/O and integrated memory controllers to support demanding control and data-plane tasks.

Its combination of DDR4/SDRAM support, extensive Ethernet connectivity, storage and USB interfaces, and hardware security primitives makes it suited to applications requiring packet processing, system consolidation, and secure boot functionality within compact FCBGA packaging.

Key Features

• Core / Architecture Eight ARM® Cortex®-A72 cores, 64-bit architecture, operating at 2 GHz for multi-threaded embedded processing.
• Memory Integrated DDR4 and SDRAM controllers to support high-bandwidth system memory configurations.
• Ethernet & Networking Rich, multi-rate Ethernet connectivity including 8 × 10GbE, 16 × 1GbE, and 16 × 2.5GbE for flexible network port and throughput configurations.
• Storage & USB Two SATA 6 Gbps ports and two USB 3.0 ports with PHY provide high-speed storage and peripheral interfaces.
• Security Hardware Secure Boot and Arm TrustZone® support to enable protected boot flows and trusted execution environments.
• Package & Mounting 1292-FCPBGA package (37.5 × 37.5 mm), surface-mount, suitable for high-density embedded boards.
• Operating Range & Compliance Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance for regulatory alignment.
• Additional Interfaces DUART and other system interfaces to support console, control, and peripheral connectivity in embedded designs.

Typical Applications

• Network Appliances Use as a compute and control plane processor in switches, routers, and edge routers where multi-port Ethernet and packet handling are required.
• Edge and Edge Compute Host virtualized or containerized network services and protocol processing close to the data source using its multi-core architecture and high-speed I/O.
• Data Center Offload Implement control-plane functions and offload tasks that benefit from hardware security and high-throughput Ethernet connections.
• 5G and Telecom Infrastructure Integrate into baseband and packet processing elements that require deterministic compute and abundant network interfaces.

Unique Advantages

• Multi-core 64-bit Processing: Eight Cortex-A72 cores at 2 GHz provide parallel compute capacity for packet processing and application workloads.
• Extensive Network I/O: Large counts of 10GbE, 2.5GbE and 1GbE ports simplify system design for dense network connectivity without many external controllers.
• On-board Memory Support: DDR4 and SDRAM controllers minimize external logic and enable high-performance memory subsystems for low-latency tasks.
• Integrated Storage and USB: SATA 6 Gbps and USB 3.0 interfaces provide direct connections for storage, logging, and peripheral expansion.
• Built-in Platform Security: Secure Boot and TrustZone® support enable secure system start-up and trusted execution zones to protect firmware and data.
• Compact, High-density Package: 1292-FCPBGA (37.5 × 37.5 mm) package supports high integration in space-constrained embedded boards.

Why Choose LS2084ASE7V17B?

The LS2084ASE7V17B positions itself as a high-performance, highly integrated Layerscape processor for embedded networking and compute applications. With eight ARM Cortex-A72 cores, extensive multi-rate Ethernet, on-chip memory controller support, and hardware security features, it offers a balanced platform for systems that require compute throughput, connectivity density, and trusted operation within a compact FCBGA footprint.

Engineers and designers targeting network appliances, edge compute nodes, telecom infrastructure, and data-plane offload designs will find the LS2084ASE7V17B useful for consolidating functions, reducing external component count, and accelerating time-to-market while maintaining regulatory and temperature requirements for consumer-class embedded products.

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