LS2084ASN711B

IC MPU QORIQ 2.1GHZ 1292FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 8 Core, 64-Bit 2.1GHz 1292-FCPBGA (37.5x37.5)

Quantity 1,088 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS2084A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1292-FCPBGA (37.5x37.5)ECCNN/A
Ethernet10GbE (8), 2.5GbE (16)HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width8 Core, 64-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case1292-BBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA (2)
Security FeaturesSecure Boot, TrustZone®Speed2.1GHzSupplier Device Package1292-FCPBGA (37.5×37.5)
USBUSB 3.0 + PHY (2)

Overview of LS2084ASN711B – ARM Cortex‑A72 8‑Core 2.1GHz MPU

The LS2084ASN711B is an NXP QorIQ Layerscape microprocessor featuring eight 64‑bit ARM® Cortex®‑A72 cores running up to 2.1 GHz. Designed for embedded networking and data‑plane applications, the device integrates high‑performance CPU clusters, a robust memory subsystem, and advanced datapath acceleration to enable high‑throughput, low‑latency packet processing.

Its combination of multi‑core compute, DPAA2 acceleration elements, and extensive high‑speed I/O positions the LS2084ASN711B for use in routers, security appliances, gateways and other embedded infrastructure where integrated connectivity and system integration reduce BOM and development time.

Key Features

  • Core & Architecture Eight ARM® Cortex®‑A72 64‑bit cores arranged in four clusters, each cluster sharing a 1 MB L2 cache; CPU frequency up to 2.1 GHz for multicore compute.
  • Platform Cache & Interconnect 1 MB platform cache with ECC protection and a hierarchical interconnect fabric to support coherent, deterministic data flow across cores and accelerators.
  • Memory Subsystem Two 64‑bit DDR4 SDRAM memory controllers with ECC and interleaving support for high bandwidth and data integrity (DDR4 operation up to platform rates specified in datasheet).
  • Datapath Acceleration (DPAA2) Integrated DPAA2 features including wire‑rate I/O processing, queue and buffer management, cryptography acceleration (SEC 5.2), RegEx pattern matching (PME 2.0), and compression/decompression (DCE 1.0) to offload packet‑processing workloads.
  • High‑Speed Connectivity Up to eight 10 GbE MACs and up to sixteen 1/2.5 GbE MACs, plus 16 SerDes lanes (up to 10.3125 GHz) to support dense, high‑throughput network interfaces.
  • PCIe & Peripheral Interfaces Four PCIe Gen3 controllers (scalable widths and SR‑IOV support on PCIe3), two SATA 3.0 controllers, and two USB 3.0 controllers with integrated PHY for flexible system expansion and storage connectivity.
  • Security & Boot Secure Boot and ARM TrustZone® support provide platform‑level security features for secure provisioning and runtime isolation.
  • Package & Thermal 1292‑ball FCPBGA package (37.5 × 37.5 mm) with surface‑mount mounting; operating temperature range 0 °C to 105 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Network Appliances — High‑density routing, switching and security appliances leveraging multiple 10 GbE and 2.5 GbE interfaces and DPAA2 offloads for packet processing.
  • Telecommunications Infrastructure — Edge and aggregation platforms that require multi‑core processing, hardware acceleration for crypto and pattern matching, and flexible PCIe and storage connectivity.
  • Enterprise Gateways & VPNs — Secure gateway and VPN appliances using Secure Boot and TrustZone for trusted bootflows and isolated security domains.
  • Storage & NAS Systems — Systems requiring SATA and high‑speed peripheral connectivity alongside robust memory bandwidth and ECC protection.

Unique Advantages

  • High multicore throughput: Eight Cortex‑A72 cores at up to 2.1 GHz deliver parallel compute capacity for concurrent control‑plane and data‑plane tasks.
  • Integrated datapath acceleration: DPAA2 components (packet parsing, queue management, crypto, RegEx, compression) reduce CPU load and simplify software stack design for networking workloads.
  • Extensive I/O integration: Multiple 10 GbE and 2.5 GbE MACs, PCIe Gen3 controllers, USB 3.0 and SATA provide flexible connectivity to peripherals, storage and uplink interfaces.
  • Memory reliability: Dual DDR4 controllers with ECC and interleaving support maintain data integrity for demanding embedded systems.
  • Security foundation: Secure Boot and TrustZone®-enabled architecture help establish trusted boot and runtime environments for protected applications.
  • Compact, manufacturable package: 1292‑FCPBGA (37.5×37.5 mm) surface‑mount package supports high‑density board designs with predictable thermal and mounting characteristics.

Why Choose LS2084ASN711B?

The LS2084ASN711B balances high‑performance multicore processing with specialized datapath accelerators and comprehensive I/O to tackle modern embedded networking and infrastructure designs. Its integrated DDR4 controllers with ECC, multi‑lane SerDes, and PCIe/ethernet connectivity reduce external components and simplify system architecture.

Targeted at designers building routers, security appliances, enterprise gateways and storage systems, this QorIQ Layerscape device offers a scalable platform that combines compute, acceleration and connectivity for robust, production‑grade embedded solutions backed by NXP’s platform ecosystem.

Request a quote or submit a pricing and availability inquiry for the LS2084ASN711B to begin your procurement or design evaluation process.

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