MCIMX286DVM4BR

IC MPU I.MX28 454MHZ 289MAPBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX28 1 Core, 32-Bit 454MHz 289-MAPBGA (14x14)

Quantity 116 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 286
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package289-MAPBGA (14x14)
Display & Interface ControllersKeypadECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-20°C ~ 70°C (TA)Package / Case289-LFBGARAM ControllersLVDDR, LVDDR2, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Hardware ID
Speed454MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX286DVM4BR – IC MPU I.MX28 454MHZ 289MAPBGA

The MCIMX286DVM4BR is an NXP Semiconductors i.MX28-series applications processor featuring a single ARM926EJ-S 32-bit core running up to 454 MHz. It is a low-power, high-performance embedded processor optimized for consumer and industrial applications that require integrated power management, flexible memory interfaces and broad peripheral connectivity.

Designed for human–machine interfaces, industrial control and portable devices, the device combines on-chip SRAM and an integrated power management unit with standard interfaces such as USB 2.0, 10/100 Ethernet and CAN to simplify system design and reduce external component count.

Key Features

  • Core and Performance — ARM926EJ-S single 32‑bit core running up to 454 MHz for responsive embedded processing.
  • Memory Interface — Integrated controllers for LVDDR, LVDDR2 and DDR2 external memories to support a range of memory choices.
  • On‑chip SRAM — 128 Kbyte on‑chip SRAM that can reduce or eliminate external RAM for small-footprint RTOS designs.
  • Integrated Power Management — On-chip PMU with a triple-output DC‑DC switching converter and multiple linear regulators providing power sequencing and battery charging capability.
  • Security — Boot security, cryptography and hardware ID features for device authentication and secure boot strategies.
  • Connectivity — USB 2.0 with PHY (2), 10/100 Mbps Ethernet (1) and CAN interface support for common embedded networking and peripheral needs.
  • Co‑processor — Dedicated DCP (Data Co-Processor) for cryptographic and data-processing offload.
  • Package and Mounting — 289-ball MAPBGA package (14 × 14 mm, 0.8 mm pitch), surface mount.
  • Graphics — No dedicated graphics acceleration.
  • Qualification and Environmental — Consumer qualification; RoHS compliant.
  • Operating Temperature — Specified for −20 °C to 70 °C operation.

Typical Applications

  • Human–Machine Interface (HMI) Panels — Industrial and home HMI panels that require responsive UI control and integrated power sequencing.
  • Industrial Control and Robotics — PLCs, drive controllers and factory robotics displays leveraging the processor's interfaces and memory flexibility.
  • Handheld Scanners and Printers — Portable devices benefiting from compact package, integrated PMU and on‑chip SRAM for small-footprint firmware.
  • Portable Medical and Monitoring Devices — Patient-monitoring equipment where integrated power management and secure boot capabilities are important.
  • Smart Energy and Gateway Devices — Energy meters and gateways using Ethernet, CAN and USB connectivity for communications and data collection.

Unique Advantages

  • Integrated Power Subsystem — On-chip triple-output DC‑DC converter and regulators simplify power design and provide required power sequencing and battery charging functionality.
  • Reduced External Memory Needs — 128 Kbyte on‑chip SRAM enables smaller BOMs for lightweight RTOS implementations.
  • Flexible Memory Support — Controllers for LVDDR, LVDDR2 and DDR2 let designers choose memory types to match performance and cost targets.
  • Broad Peripheral Set — USB 2.0 + PHY, 10/100 Ethernet and CAN support common embedded connectivity requirements without additional bridge components.
  • Security Capabilities — Built‑in boot security, cryptography and hardware ID features support secure device identity and trusted boot flows.
  • Compact, Industry‑Standard Package — 289‑MAPBGA (14 × 14 mm) provides a small footprint while exposing a wide set of I/O for system integration.

Why Choose MCIMX286DVM4BR?

The MCIMX286DVM4BR positions itself as a highly integrated, single‑core embedded processor for applications that need a balance of processing performance, power management and peripheral connectivity. With an ARM926EJ‑S core at up to 454 MHz, integrated PMU, on‑chip SRAM and flexible memory controllers, it addresses designs that prioritize reduced BOM and compact board area.

Part of the i.MX28 family from NXP Semiconductors, this device is suitable for consumer‑qualified embedded and industrial applications requiring standard networking and interface options, secure boot capabilities and operation across a −20 °C to 70 °C range. Its combination of integration and connectivity supports streamlined development and deployment in a variety of product categories.

Request a quote or submit an inquiry to obtain pricing and availability for the MCIMX286DVM4BR and to discuss how it can meet your project requirements.

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