MCIMX6Y2DVK09AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 272-MAPBGA (9x9) |
|---|---|
| Quantity | 383 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Y |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7 | Device Package | 272-MAPBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Electrophoretic, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 272-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | ||
| Speed | 900MHz | Supplier Device Package | 272-MAPBGA (9×9) | USB | USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.8V, 3.3V |
Overview of MCIMX6Y2DVK09AB – IC MPU I.MX6 900MHZ 272MAPBGA
The MCIMX6Y2DVK09AB is a microprocessor IC built around a single ARM® Cortex®-A7 32‑bit core running at 900 MHz in a 272‑MAPBGA (9×9) package. It targets connected and consumer embedded devices that require an efficient application processor with integrated system-level features.
As part of the i.MX 6 family, the device includes an integrated power management module that reduces external power-supply complexity and simplifies power sequencing, while offering a broad set of memory and peripheral interfaces for flexible system design.
Key Features
- Core — Single ARM® Cortex®-A7 32‑bit core operating at 900 MHz, delivering efficient application processing for embedded workloads.
- Memory Support — Integrated controllers for LPDDR2, DDR3 and DDR3L provide flexibility for system memory selection and scaling.
- Connectivity — Dual 10/100 Mbps Ethernet ports and a CANbus interface support wired networking and in-vehicle/industrial communication needs.
- USB — Two USB 2.0 OTG ports with PHY enable host and peripheral USB connectivity options.
- Display Interfaces — Display interface controllers for electrophoretic and LCD panels facilitate user-interface and low-power display designs.
- Security Features — Hardware security including A-HAB, ARM TrustZone (ARM TZ), CSU, SJC and SNVS for robust platform protection.
- Power Management — Integrated power management module reduces external regulator count and simplifies power sequencing requirements.
- Package and Mounting — 272‑MAPBGA (9×9) surface-mount package suitable for compact embedded boards.
- Qualification and Environmental — Consumer qualification with RoHS compliance and an operating temperature range of 0 °C to 95 °C.
Typical Applications
- Consumer Devices — Application processor for consumer products that need integrated power management and a compact, surface-mount package.
- Connected Devices — Gateways and IoT nodes leveraging dual Ethernet, USB OTG, and wireless peripheral connectivity (WLAN, Bluetooth, GPS, camera sensors) supported by the platform.
- Display-Control Systems — E-paper and LCD driven user interfaces using the on-chip display interface controllers for low-power or interactive displays.
Unique Advantages
- Integrated Power Management Module — Reduces external component count and simplifies power sequencing for faster time-to-market.
- Flexible Memory Options — Support for LPDDR2, DDR3 and DDR3L enables designers to choose memory configurations that balance cost and performance.
- Rich Peripheral Set — Dual Ethernet, dual USB 2.0 OTG with PHY and CANbus provide multiple connectivity paths for networking and peripheral expansion.
- Built-in Security Stack — A-HAB, ARM TrustZone, CSU, SJC and SNVS deliver hardware-level features for secure boot and runtime protection.
- Compact Surface-Mount Package — 272‑MAPBGA (9×9) package supports dense board layouts while maintaining thermal and assembly suitability for embedded designs.
- Consumer-Grade Reliability — Consumer qualification and RoHS compliance align the device with mainstream product development and regulatory requirements.
Why Choose MCIMX6Y2DVK09AB?
The MCIMX6Y2DVK09AB positions itself as a single‑core, energy-efficient application processor option within the i.MX 6 family, combining a 900 MHz ARM® Cortex®-A7 core with integrated power management and a wide set of memory and peripheral interfaces. This balance of performance and system integration is well suited to connected consumer and embedded designs that require reliable processing, flexible memory choices and multiple connectivity options.
Designers benefit from a platform that simplifies power architecture, supports common memory technologies, and includes hardware security features to address platform-level protection. The compact 272‑MAPBGA package and consumer qualification make the device appropriate for space-constrained products aimed at mainstream markets.
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