MIMX8MN5DVPIZAA

IC MPU I.MX8MN 1.4GHZ 306TFBGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC i.MX8MN 4 Core, 64-Bit 1.4GHz 306-TFBGA (11x11)

Quantity 322 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MN
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package306-TFBGA (11x11)
Display & Interface ControllersLCD, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case306-TFBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Speed1.4GHzSupplier Device Package306-TFBGA (11×11)USBUSB 2.0 OTG + PHY (1)

Overview of MIMX8MN5DVPIZAA – IC MPU I.MX8MN 1.4GHz 306-TFBGA

The MIMX8MN5DVPIZAA is an NXP i.MX 8MN series microprocessor IC integrating ARM® Cortex®-A53 application cores and an ARM® Cortex®-M7 real-time core. This 64-bit, quad-core application processor is specified at 1.4 GHz for the device and is offered in a compact 306-TFBGA (11 × 11 mm) package.

Designed for consumer-class embedded systems, the device targets media-focused applications that require multimedia processing, display and camera interfaces, and integrated peripheral support while providing on-chip security and flexible memory options.

Key Features

  • CPU Architecture — Quad ARM® Cortex®-A53 application cores (64-bit) and an ARM® Cortex®-M7 real-time core; the part is specified at 1.4 GHz and the family documentation references Cortex‑M7 operation up to 750 MHz.
  • Multimedia and DSP — Multimedia co-processor support including NEON™ Media Processing Engine (MPE) for accelerated media operations and graphics acceleration indicated in product data.
  • Memory Interfaces — Integrated controllers supporting DDR3L, DDR4 and LPDDR4 memory types for flexible system memory design.
  • Display & Imaging — On-chip display interface controllers including LCD, MIPI‑CSI and MIPI‑DSI to support displays and camera inputs.
  • Connectivity — Gigabit Ethernet (GbE) and USB 2.0 OTG with PHY (1) for wired networking and host/device USB connectivity.
  • Audio & Peripherals — Support for audio and legacy interfaces including AC’97 and a broad set of consumer/industrial peripherals referenced in the datasheet.
  • Security — Hardware security features including ARM TrustZone (ARM TZ), CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot and runtime protection.
  • Package & Mounting — 306‑TFBGA (11 × 11 mm, 0.5 mm pitch) surface-mount package suitable for compact embedded designs.
  • Operating Range & Compliance — Consumer-qualified device with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Consumer multimedia devices — Media and audio-centric products that benefit from integrated NEON MPE, graphics acceleration and display/camera interfaces.
  • Audio and voice systems — Devices requiring multiple audio interfaces (I2S, AC’97, TDM, S/PDIF noted in family documentation) and on-chip processing for audio workloads.
  • Connected home and networking — Gateways, hubs and appliances using GbE and USB connectivity for wired networks and peripheral attachment.
  • Embedded HMIs and displays — Human‑machine interfaces leveraging LCD and MIPI DSI/CSI support for touchscreen displays and camera inputs.

Unique Advantages

  • Highly integrated CPU pairing — Combination of quad Cortex‑A53 application cores with a Cortex‑M7 real-time core enables separation of high‑level OS workloads and deterministic control tasks.
  • Media-capable architecture — NEON MPE and graphics acceleration support media-rich user experiences while keeping system design consolidated.
  • Flexible memory support — DDR3L, DDR4 and LPDDR4 controller options simplify memory selection across performance and power targets.
  • On-chip security modules — ARM TZ, CAAM, HAB and related features provide a layered security foundation for secure boot and runtime protection.
  • Compact surface-mount package — 306‑TFBGA (11 × 11 mm) package accommodates space-constrained PCBs without sacrificing peripheral access.
  • Consumer-grade temperature and compliance — 0 °C to 95 °C operating range and RoHS compliance align the part to consumer product requirements noted in the documentation.

Why Choose MIMX8MN5DVPIZAA?

The MIMX8MN5DVPIZAA positions itself as a balanced, media-focused application processor within NXP’s i.MX 8M Nano family, combining quad 64‑bit Cortex‑A53 processing with an integrated Cortex‑M7 for real‑time tasks. Its mix of multimedia acceleration, flexible memory interfaces, display/camera connectivity and hardware security modules makes it suited for consumer embedded products that require integrated media, audio and networking capability.

Designed for engineers seeking a compact package and a broad peripheral set, this device offers scalability across the i.MX 8M Nano family and access to NXP’s documented platform features for system implementation and long-term product development.

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