MIMX8MN4DVTJZAA

IC MPU I.MX8MN 1.5GHZ 486LFBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8MN 2 Core, 64-Bit 1.5GHz 486-LFBGA (14x14)

Quantity 1,958 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MN
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M7Core ProcessorARM® Cortex®-A53Device Package486-LFBGA (14x14)
Display & Interface ControllersLCD, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case486-LFBGA, FCBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Speed1.5GHzSupplier Device Package486-LFBGA (14×14)USBUSB 2.0 + PHY (2)

Overview of MIMX8MN4DVTJZAA – IC MPU I.MX8MN 1.5GHZ 486LFBGA

The MIMX8MN4DVTJZAA is an NXP Semiconductors microprocessor in the i.MX 8MN family featuring ARM® Cortex®-A53 architecture. This dual-core, 64-bit application processor runs at up to 1.5 GHz and includes an ARM® Cortex®-M7 co-processor for real-time tasks.

Designed for embedded and consumer markets, the device delivers a balance of compute performance, media and display interfaces, security features, and integrated memory controllers to support compact, surface-mount system designs.

Key Features

  • Core and Real-time Processing — Dual ARM® Cortex®-A53 64-bit cores running up to 1.5 GHz, plus an ARM® Cortex®-M7 co-processor for deterministic real-time processing.
  • Memory Support — Integrated controllers for DDR3L, DDR4 and LPDDR4 memory technologies to support varied system memory designs.
  • Display and Camera Interfaces — Display interface controllers including LCD, MIPI-DSI and MIPI-CSI to support graphical user interfaces and camera inputs.
  • Connectivity — Gigabit Ethernet (GbE) and dual USB 2.0 ports with PHY for wired networking and peripheral connectivity.
  • Security — On-chip security features including ARM TrustZone (ARM TZ), CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot and cryptographic functions.
  • Graphics and Media — Graphics acceleration capability to drive UI and multimedia workloads.
  • Peripheral Interfaces — I2C and other common peripheral interfaces for sensor and subsystem integration.
  • Package and Mounting — 486-LFBGA (14 × 14 mm) FCBGA package, surface-mount mounting for compact PCB integration.
  • Operating Range — Specified operating temperature range of 0 °C to 95 °C for consumer-grade applications.
  • Compliance — RoHS compliant.

Typical Applications

  • Consumer Multimedia Devices — Use the dual Cortex‑A53 cores, graphics acceleration and display interfaces to drive interactive media and UI experiences.
  • Smart Home and IoT Gateways — Leverage GbE, USB 2.0 ports and on-chip security blocks for connected consumer devices and local gateway functions.
  • Human-Machine Interfaces (HMI) — MIPI-DSI/MIPI-CSI and LCD controllers combined with graphics acceleration for touch displays and camera-enabled control panels.
  • Embedded Control with Real-Time Tasks — Offload deterministic control and low-latency tasks to the integrated ARM® Cortex®-M7 co-processor while application processing runs on the A53 cores.

Unique Advantages

  • Balanced Heterogeneous Processing: Dual 64-bit Cortex‑A53 application cores plus a Cortex‑M7 co-processor enable separation of high-level OS workloads and real-time control.
  • Flexible Memory Options: Support for DDR3L, DDR4 and LPDDR4 memory controllers simplifies BOM choices across performance and power targets.
  • Integrated Media and Display Interfaces: On-chip LCD, MIPI‑DSI and MIPI‑CSI controllers reduce the need for external bridge chips in display- and camera-driven designs.
  • Built-in Security Modules: Hardware blocks including ARM TZ, CAAM and HAB provide secure boot and cryptographic acceleration for protected applications.
  • Compact Surface-Mount Package: 486‑LFBGA (14×14 mm) FCBGA package supports high-density, space-constrained embedded system layouts.
  • Consumer-Grade Qualification: Specified for consumer applications with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Why Choose MIMX8MN4DVTJZAA?

The MIMX8MN4DVTJZAA combines a dual-core ARM® Cortex®-A53 application platform with an ARM® Cortex®-M7 co-processor, integrated memory controllers, display and camera interfaces, and a comprehensive set of security modules. This blend of capabilities positions the device for embedded consumer designs that require responsive application processing, media handling and secure connectivity in a compact surface-mount package.

Backed by NXP Semiconductors and the i.MX 8MN family design foundation, the device suits engineers seeking a scalable, integrated processor solution for consumer and embedded product lines where compute, media and security features are required.

Request a quote or submit an order inquiry to evaluate MIMX8MN4DVTJZAA for your next embedded design and to receive pricing and availability information.

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