MIMX8MN5CVPIZAA

IC MPU I.MX8MN 1.4GHZ 306TFBGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC i.MX8MN 4 Core, 64-Bit 1.4GHz 306-TFBGA (11x11)

Quantity 280 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MN
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package306-TFBGA (11x11)
Display & Interface ControllersLCD, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case306-TFBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Speed1.4GHzSupplier Device Package306-TFBGA (11×11)USBUSB 2.0 OTG + PHY (1)

Overview of MIMX8MN5CVPIZAA – ARM® Cortex®-A53 / Cortex®-M7 Microprocessor, 1.4 GHz, 306-TFBGA

The MIMX8MN5CVPIZAA is an industrial-grade application processor from the i.MX 8MN family that combines a quad Arm® Cortex®-A53 application cluster with a Cortex®-M7 for real-time tasks. With Cortex‑A53 cores operating up to 1.4 GHz and a Cortex‑M7 core for real-time and low-power processing, the device targets embedded and industrial applications requiring balanced compute performance, multimedia capabilities, and robust security.

This member of the i.MX 8M Nano series delivers integrated multimedia and audio interfaces, flexible memory controller support, and a compact 306‑TFBGA (11×11) surface-mount package for space-constrained designs operating across an extended temperature range.

Key Features

  • Core architecture  Quad Arm® Cortex®-A53 application cores up to 1.4 GHz plus a Cortex®-M7 core (up to 750 MHz as documented in the series datasheet) for real-time and low-power tasks.
  • Multimedia acceleration  Integrated multimedia co-processors and NEON™ MPE support for accelerated media processing and DSP-class workloads.
  • Memory support  On-chip RAM controllers compatible with DDR3L, DDR4 and LPDDR4 memory types to match a range of system performance and power targets.
  • Display and camera interfaces  Display controllers include LCD, MIPI-DSI, and MIPI-CSI support to drive screens and capture camera input for HMI and vision use cases.
  • Audio and peripheral interfaces  Wide audio peripheral set including AC'97 and additional audio interfaces documented for the series (I2S, TDM, S/PDIF in the series datasheet), plus general-purpose peripheral support.
  • Connectivity  Integrated Gigabit Ethernet (GbE) and a USB 2.0 OTG controller with PHY (1) for networked and USB-enabled embedded systems.
  • Security  Hardware security features including ARM TrustZone (ARM TZ), CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot, cipher acceleration and system-level protection.
  • Package and mounting  306‑TFBGA supplier device package (11×11 mm) with surface-mount mounting suitable for compact industrial boards.
  • Industrial qualification and operating range  Qualified for industrial applications with an operating temperature range of −40 °C to 105 °C.

Typical Applications

  • Industrial HMI and control panels  Drives graphical user interfaces and display pipelines using integrated LCD and MIPI-DSI controllers while handling application logic on the Cortex‑A53 cores.
  • Audio and multimedia devices  Supports a broad set of audio interfaces and multimedia acceleration for networked audio, codecs and media playback implementations.
  • Edge compute and vision  Combines MIPI‑CSI camera input and multimedia processing engines for lightweight vision and edge processing tasks.
  • Ethernet-connected embedded systems  Integrated GbE and USB OTG make the device suitable for networked industrial gateways, instrumentation and connected appliances.

Unique Advantages

  • Balanced heterogeneous processing  Dual-class cores (Cortex‑A53 + Cortex‑M7) allow partitioning of application and real-time workloads without additional MCUs.
  • Integrated multimedia and audio  On-chip multimedia acceleration and a wide range of audio interfaces reduce external component count for media-rich products.
  • Flexible memory options  Support for DDR3L, DDR4 and LPDDR4 enables designers to optimize for cost, performance or power.
  • Industrial-temperature qualification  Specified operation from −40 °C to 105 °C supports deployments in harsh and industrial environments.
  • Comprehensive hardware security  Multiple security engines and secure-boot features in the silicon help simplify secure system design and protect IP and data.
  • Compact surface-mount package  The 306‑TFBGA (11×11) package provides a small footprint for space-constrained embedded boards.

Why Choose MIMX8MN5CVPIZAA?

The MIMX8MN5CVPIZAA positions itself as a versatile industrial application processor that balances multicore application performance with a dedicated real-time core, integrated multimedia/audio capabilities, and extensive security features. Its flexible memory support and industrial temperature qualification make it suitable for embedded systems that require durability, multimedia handling, and secure operation.

This device is well suited to engineers designing compact, connected industrial and consumer-embedded products who need an integrated processor solution with verified security modules, multiple display and audio interfaces, and a small form-factor package supported by the i.MX 8M Nano series documentation.

Request a quote or submit a sales inquiry to begin procurement and receive pricing and availability for the MIMX8MN5CVPIZAA.

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