MIMX8MN3DVPIZAA
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC i.MX8MN 3 Core, 64-Bit 1.4GHz 306-TFBGA (11x11) |
|---|---|
| Quantity | 938 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8MN |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 306-TFBGA (11x11) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, MIPI-CSI | ECCN | N/A | Ethernet | GbE | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 306-TFBGA | RAM Controllers | DDR3L, DDR4, LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | ||
| Speed | 1.4GHz | Supplier Device Package | 306-TFBGA (11×11) | USB | USB 2.0 OTG + PHY (1) |
Overview of MIMX8MN3DVPIZAA – IC MPU I.MX8MN 1.4GHZ 306TFBGA
The MIMX8MN3DVPIZAA is an NXP i.MX 8MN series microprocessor IC combining an ARM® Cortex®-A53 application core cluster with an ARM® Cortex®-M7 real-time core. This 3‑core, 64‑bit device runs at up to 1.4 GHz and is supplied in a compact 306‑TFBGA (11×11) surface‑mount package.
Designed for consumer and embedded multimedia designs, the device integrates media‑oriented processing, graphics acceleration and a broad set of security and connectivity features to support audio/visual and general embedded applications where performance, integration and low‑power operation are important.
Key Features
- Processor cores — ARM® Cortex®‑A53 and ARM® Cortex®‑M7 architecture in a 3‑core, 64‑bit configuration running up to 1.4 GHz for application and real‑time tasks.
- Multimedia acceleration — On‑chip multimedia/DSP capabilities with NEON™ MPE support to accelerate media processing and signal tasks.
- Memory interfaces — Integrated controllers for DDR3L, DDR4 and LPDDR4 memory technologies to support a range of system memory options.
- Display and imaging — Display interface controllers including LCD and MIPI‑CSI for handling visual and camera input subsystems.
- Connectivity — Gigabit Ethernet (GbE) and USB 2.0 OTG with PHY (1) for wired networking and peripheral connectivity.
- Audio and peripheral interfaces — Additional interfaces such as AC'97 and family‑level support for I2S/TDM/S/PDIF in the i.MX 8M Nano series enable diverse audio subsystem options.
- Security features — Hardware security support including ARM TrustZone (TZ), CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot and cryptographic operations.
- Package and mounting — 306‑TFBGA package (11×11) with surface‑mount construction for compact board integration.
- Operating conditions — Consumer‑grade operating temperature range from 0 °C to 95 °C and RoHS‑compliant material status.
Typical Applications
- Consumer multimedia devices — On‑device media processing, graphics acceleration and audio subsystem support for smart home and entertainment products.
- Audio products — Integrated audio interfaces and multimedia processing for smart speakers, audio gateways and voice‑enabled devices.
- Embedded imaging systems — LCD and MIPI‑CSI interface support for camera and display handling in compact embedded platforms.
Unique Advantages
- Integrated application and real‑time cores — Combines ARM® Cortex®‑A53 and Cortex®‑M7 to separate high‑level application processing from deterministic control tasks.
- Multimedia and DSP acceleration — NEON™ MPE and multimedia co‑processing reduce software overhead for media workloads.
- Flexible memory support — Support for DDR3L, DDR4 and LPDDR4 provides design flexibility across performance and power targets.
- Comprehensive security blocks — Multiple hardware security modules support secure boot and cryptographic operations to help protect platform integrity.
- Compact package for space‑constrained designs — 306‑TFBGA (11×11) helps minimize PCB area while delivering application processing and connectivity.
- Consumer‑grade qualification and RoHS compliance — Specified for consumer applications with RoHS‑compliant materials.
Why Choose MIMX8MN3DVPIZAA?
The MIMX8MN3DVPIZAA positions itself as a versatile microprocessor for embedded consumer multimedia designs that need a mix of application performance, real‑time control and media capabilities. Its combination of ARM® Cortex®‑A53 and Cortex®‑M7 cores, multimedia acceleration, flexible memory interfaces and integrated security features makes it suitable for compact, connected consumer products.
This part is well suited to designers targeting platforms that require integrated graphics/audio support, GbE and USB connectivity, and a small BGA footprint. The consumer qualification and RoHS compliance help align the device with consumer electronics product development requirements.
Request a quote or submit a request for pricing and availability to begin evaluating the MIMX8MN3DVPIZAA for your next embedded multimedia design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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