MIMX8MN3CVTIZAA

IC MPU I.MX8MN 1.4GHZ 486LFBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8MN 2 Core, 64-Bit 1.4GHz 486-LFBGA (14x14)

Quantity 461 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MN
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M7Core ProcessorARM® Cortex®-A53Device Package486-LFBGA (14x14)
Display & Interface ControllersLCD, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case486-LFBGA, FCBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Speed1.4GHzSupplier Device Package486-LFBGA (14×14)USBUSB 2.0 + PHY (2)

Overview of MIMX8MN3CVTIZAA – IC MPU I.MX8MN 1.4GHZ 486-LFBGA

The MIMX8MN3CVTIZAA is an industrial-qualified application microprocessor from NXP's i.MX 8MN series featuring a dual-core, 64-bit ARM® Cortex®-A53 CPU running at 1.4 GHz with an on-chip ARM® Cortex®-M7 co-processor for real-time tasks. It integrates multimedia-capable display interfaces, hardware security blocks and a broad set of peripheral interfaces for embedded and industrial designs.

Designed for embedded and industrial markets, this device targets applications requiring a balance of compute performance, multimedia connectivity and hardware-level security while operating across a wide temperature range.

Key Features

  • CPU and Real-time Coprocessor  Dual ARM® Cortex®-A53 64-bit cores at 1.4 GHz with an ARM® Cortex®-M7 co-processor for real-time and low-power processing.
  • Memory Interfaces  Integrated controllers for DDR3L, DDR4 and LPDDR4 memory technologies.
  • Display and Graphics  Graphics acceleration supported with display interface controllers including LCD, MIPI-CSI and MIPI-DSI.
  • Connectivity  Gigabit Ethernet (GbE) and USB 2.0 with PHY (2 ports) plus I²C for peripheral control and system integration.
  • Security Features  Hardware security blocks including ARM TrustZone (ARM TZ), CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot and cryptographic functions.
  • Package and Mounting  486-ball LFBGA FCBGA package, 14 × 14 mm, surface-mount form factor.
  • Qualification and Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C.
  • Additional Interfaces  Integrated support for common peripheral interfaces such as I²C.

Typical Applications

  • Industrial Control & Automation  Industrial-qualified temperature range and GbE connectivity make this device suitable for embedded controllers and automation equipment.
  • Human–Machine Interfaces (HMI)  Display controllers (LCD, MIPI-DSI) and graphics acceleration enable responsive user interfaces and touchscreen displays.
  • Multimedia Endpoints  Combined Cortex‑A53 processing, graphics acceleration and MIPI-CSI support enable audio/video and multimedia applications.
  • Secure Embedded Devices  On-chip security modules (ARM TZ, CAAM, HAB, SNVS) support secure boot and cryptographic functions for secure endpoints.

Unique Advantages

  • Balanced Compute and Real-Time Processing: Dual 64-bit Cortex‑A53 cores paired with a Cortex‑M7 coprocessor support both application-level processing and deterministic real-time tasks.
  • Flexible Memory Support: Built-in controllers for DDR3L, DDR4 and LPDDR4 provide design flexibility across performance and power targets.
  • Integrated Multimedia Interfaces: Native LCD, MIPI‑CSI and MIPI‑DSI support alongside graphics acceleration simplifies display and camera system design.
  • Hardware Security Ensemble: A suite of security features (ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS) enables authenticated boot and on-chip cryptography without specifying external security components.
  • Industrial Robustness: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh environments.
  • Compact Surface-Mount Package: 486-LFBGA (14 × 14 mm) package provides a compact footprint for space-constrained embedded designs.

Why Choose MIMX8MN3CVTIZAA?

The MIMX8MN3CVTIZAA delivers a practical combination of 64-bit application processing, dedicated real-time coprocessing and comprehensive security features in an industrial-qualified package. It is well suited to embedded designs that demand multimedia capability, robust connectivity and hardware-based security within a compact surface-mount footprint.

As part of the i.MX 8MN family from NXP, this device supports design scalability within the series while offering the temperature, packaging and peripheral set expected for industrial embedded applications.

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