MIMX8UD3CVP08SC

8ULP DUAL CORTEX A35
Part Description

8ULP DUAL CORTEX A35

Quantity 1,730 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UD
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSP3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A35Display & Interface ControllersMIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100MbpsGraphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40 °C – 105 °CQualificationIndustrial
RAM ControllersLPDDR3, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed800 MHzUSBUSB 2.0 (2)

Overview of MIMX8UD3CVP08SC – 8ULP DUAL CORTEX A35

The MIMX8UD3CVP08SC is an industrial-grade microprocessor from NXP’s i.MX 8ULP family that combines a dual Arm® Cortex®-A35 application domain with an Arm Cortex®-M33 real-time domain. The device integrates multiple DSP and acceleration blocks along with modern memory and display interfaces to support embedded designs requiring balanced application performance, real-time control and advanced audio/ML processing.

Designed for embedded and industrial markets, the part delivers an 800 MHz nominal Cortex‑A35 CPU, co-processors for DSP and cryptography, LPDDR memory support, display and camera interfaces, wired and USB connectivity, and an extended operating temperature range for robust field operation.

Key Features

  • Processing cores — Dual ARM® Cortex®-A35 64-bit cores at 800 MHz nominal for application processing, paired with an ARM® Cortex®-M33 real-time core (nominal 216 MHz) for deterministic control and background tasks.
  • DSP and co-processors — Integrated HiFi4 DSP and Tensilica Fusion F1 DSP for audio and ML workloads, plus PowerQuad and Casper co-processors connected to the M33 core to accelerate DSP and cryptography functions.
  • Memory support — 32-bit LPDDR3 / LPDDR4 memory interface with support for LPDDR4x (series-level), plus on-chip memory including 64 KB RAM and 768 KB shared memory (zero wait state) and 512 KB L2 cache with SCU.
  • Display and camera interfaces — MIPI-DSI and MIPI-CSI display interface controllers for camera and display connectivity.
  • Connectivity — Single 10/100 Mbps Ethernet MAC and two USB 2.0 ports (dual High Speed USB OTG with integrated PHY reported at series level) for wired and host/device connectivity.
  • Storage and serial interfaces — Multiple serial interfaces including UART, SPI, I2C and eMMC/SD host support (series-level features include 3 eMMC/SD host interfaces supporting eMMC5.1 and SD3.0 and FlexSPI serial flash interfaces).
  • Security — EdgeLock secure enclave, Advanced High Assurance Boot (AHAB) support, cryptographic acceleration, NIST-compliant RNG and one-time programmable fuse for key storage (series-level security features).
  • Package & mounting — MAPBGA 485 package (15 × 15 mm, 0.5 mm pitch) and surface-mount mounting type for compact board-level integration.
  • Industrial qualification & temperature range — Industrial-qualified device with operating temperature range of −40 °C to 105 °C and RoHS compliance for industrial deployments.

Typical Applications

  • Industrial control — Real-time control and supervisory application processing using the combined Cortex‑M33 and Cortex‑A35 domains for machine control, PLCs and gateway devices.
  • Human-machine interfaces (HMI) — Driving displays and camera inputs via MIPI-DSI/CSI and handling UI workloads on the dual Cortex‑A35 cores with graphics acceleration.
  • Audio and voice-enabled devices — On-chip HiFi4 and Fusion DSPs accelerate low‑power audio processing, voice algorithms and lightweight ML inference at the edge.
  • Secure edge appliances — Hardware security features and secure boot capabilities enable protected firmware and cryptographic operations for connected industrial endpoints.

Unique Advantages

  • Dual-domain architecture: Separate Cortex‑A35 application domain and Cortex‑M33 real-time domain let designers run a rich OS alongside deterministic RTOS workloads without external MCUs.
  • Integrated DSP and accelerators: HiFi4 and Fusion DSPs plus PowerQuad and Casper offload audio, ML and crypto tasks to reduce CPU load and simplify BOM.
  • Flexible memory and storage options: Support for LPDDR3/LPDDR4 and FlexSPI/external eMMC/SD interfaces enables a range of memory configurations for performance and cost trade-offs.
  • Industrial-ready thermal range: −40 °C to 105 °C operation and industrial qualification support reliable deployment in harsh environments.
  • Built-in security primitives: EdgeLock enclave, AHAB boot, cryptographic accelerators and NIST-compliant RNG provide a hardware-rooted security foundation for embedded applications.
  • Compact, surface-mount packaging: MAPBGA 15 × 15 mm package reduces board area while offering extensive I/O for complex embedded designs.

Why Choose MIMX8UD3CVP08SC?

The MIMX8UD3CVP08SC positions itself as a versatile, industrial-grade application processor that balances application performance, real-time control and on-chip acceleration for audio, ML and security tasks. Its dual-core Cortex‑A35 application domain, Cortex‑M33 real-time core, integrated DSPs and hardware security blocks make it suitable for embedded designs that require consolidated functionality with robust field operation.

Designers targeting industrial gateways, HMIs, audio/voice products and secure edge appliances gain scalability across memory and peripheral options, a compact BGA package and industry-oriented temperature and qualification attributes backed by the i.MX 8ULP series architecture.

Request a quote or contact sales to discuss pricing, availability and how the MIMX8UD3CVP08SC can fit into your next embedded design.

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