MIMX8UD3CVP08SC
| Part Description |
8ULP DUAL CORTEX A35 |
|---|---|
| Quantity | 1,730 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8UD |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A35 | Display & Interface Controllers | MIPI-CSI, MIPI-DSI | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps | Graphics Acceleration | Yes | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 105 °C | Qualification | Industrial | ||
| RAM Controllers | LPDDR3, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 800 MHz | USB | USB 2.0 (2) |
Overview of MIMX8UD3CVP08SC – 8ULP DUAL CORTEX A35
The MIMX8UD3CVP08SC is an industrial-grade microprocessor from NXP’s i.MX 8ULP family that combines a dual Arm® Cortex®-A35 application domain with an Arm Cortex®-M33 real-time domain. The device integrates multiple DSP and acceleration blocks along with modern memory and display interfaces to support embedded designs requiring balanced application performance, real-time control and advanced audio/ML processing.
Designed for embedded and industrial markets, the part delivers an 800 MHz nominal Cortex‑A35 CPU, co-processors for DSP and cryptography, LPDDR memory support, display and camera interfaces, wired and USB connectivity, and an extended operating temperature range for robust field operation.
Key Features
- Processing cores — Dual ARM® Cortex®-A35 64-bit cores at 800 MHz nominal for application processing, paired with an ARM® Cortex®-M33 real-time core (nominal 216 MHz) for deterministic control and background tasks.
- DSP and co-processors — Integrated HiFi4 DSP and Tensilica Fusion F1 DSP for audio and ML workloads, plus PowerQuad and Casper co-processors connected to the M33 core to accelerate DSP and cryptography functions.
- Memory support — 32-bit LPDDR3 / LPDDR4 memory interface with support for LPDDR4x (series-level), plus on-chip memory including 64 KB RAM and 768 KB shared memory (zero wait state) and 512 KB L2 cache with SCU.
- Display and camera interfaces — MIPI-DSI and MIPI-CSI display interface controllers for camera and display connectivity.
- Connectivity — Single 10/100 Mbps Ethernet MAC and two USB 2.0 ports (dual High Speed USB OTG with integrated PHY reported at series level) for wired and host/device connectivity.
- Storage and serial interfaces — Multiple serial interfaces including UART, SPI, I2C and eMMC/SD host support (series-level features include 3 eMMC/SD host interfaces supporting eMMC5.1 and SD3.0 and FlexSPI serial flash interfaces).
- Security — EdgeLock secure enclave, Advanced High Assurance Boot (AHAB) support, cryptographic acceleration, NIST-compliant RNG and one-time programmable fuse for key storage (series-level security features).
- Package & mounting — MAPBGA 485 package (15 × 15 mm, 0.5 mm pitch) and surface-mount mounting type for compact board-level integration.
- Industrial qualification & temperature range — Industrial-qualified device with operating temperature range of −40 °C to 105 °C and RoHS compliance for industrial deployments.
Typical Applications
- Industrial control — Real-time control and supervisory application processing using the combined Cortex‑M33 and Cortex‑A35 domains for machine control, PLCs and gateway devices.
- Human-machine interfaces (HMI) — Driving displays and camera inputs via MIPI-DSI/CSI and handling UI workloads on the dual Cortex‑A35 cores with graphics acceleration.
- Audio and voice-enabled devices — On-chip HiFi4 and Fusion DSPs accelerate low‑power audio processing, voice algorithms and lightweight ML inference at the edge.
- Secure edge appliances — Hardware security features and secure boot capabilities enable protected firmware and cryptographic operations for connected industrial endpoints.
Unique Advantages
- Dual-domain architecture: Separate Cortex‑A35 application domain and Cortex‑M33 real-time domain let designers run a rich OS alongside deterministic RTOS workloads without external MCUs.
- Integrated DSP and accelerators: HiFi4 and Fusion DSPs plus PowerQuad and Casper offload audio, ML and crypto tasks to reduce CPU load and simplify BOM.
- Flexible memory and storage options: Support for LPDDR3/LPDDR4 and FlexSPI/external eMMC/SD interfaces enables a range of memory configurations for performance and cost trade-offs.
- Industrial-ready thermal range: −40 °C to 105 °C operation and industrial qualification support reliable deployment in harsh environments.
- Built-in security primitives: EdgeLock enclave, AHAB boot, cryptographic accelerators and NIST-compliant RNG provide a hardware-rooted security foundation for embedded applications.
- Compact, surface-mount packaging: MAPBGA 15 × 15 mm package reduces board area while offering extensive I/O for complex embedded designs.
Why Choose MIMX8UD3CVP08SC?
The MIMX8UD3CVP08SC positions itself as a versatile, industrial-grade application processor that balances application performance, real-time control and on-chip acceleration for audio, ML and security tasks. Its dual-core Cortex‑A35 application domain, Cortex‑M33 real-time core, integrated DSPs and hardware security blocks make it suitable for embedded designs that require consolidated functionality with robust field operation.
Designers targeting industrial gateways, HMIs, audio/voice products and secure edge appliances gain scalability across memory and peripheral options, a compact BGA package and industry-oriented temperature and qualification attributes backed by the i.MX 8ULP series architecture.
Request a quote or contact sales to discuss pricing, availability and how the MIMX8UD3CVP08SC can fit into your next embedded design.

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