MIMX8UD3DVP08SC

I.MX8ULP, DUAL 800MHZ
Part Description

I.MX8ULP, DUAL 800MHZ

Quantity 1,088 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UD
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSP3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A35Display & Interface ControllersMIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100MbpsGraphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature0 °C – 95 °CQualificationConsumer
RAM ControllersLPDDR3, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed800 MHzUSBUSB 2.0 (2)

Overview of MIMX8UD3DVP08SC – I.MX8ULP, DUAL 800MHZ

The MIMX8UD3DVP08SC is an I.MX8ULP-series microprocessor featuring dual ARM® Cortex®-A35 cores running at 800 MHz and an ARM® Cortex®-M33 real-time core. It combines application-class processing, real-time control and dedicated DSP engines to address embedded designs that require efficient compute, multimedia and secure connectivity.

Designed for embedded and IoT applications, this device integrates multiple memory interfaces, display and camera controllers, audio DSPs and hardware security features to simplify system-level integration while maintaining low-power operation and broad peripheral support.

Key Features

  • Cores and Performance  Dual ARM® Cortex®-A35 application cores at 800 MHz with 64-bit support plus an ARM® Cortex®-M33 real-time core for mixed OS/RTOS designs.
  • DSP and Graphics  Integrated HiFi4 DSP and Fusion DSP for audio and compute acceleration, plus a 3D GPU for graphics acceleration.
  • Memory Interfaces  Supports 32-bit LPDDR3, LPDDR4 and LPDDR4X memory controllers to accommodate a range of memory performance and capacity needs.
  • Display and Camera  MIPI-DSI display controller and MIPI-CSI camera interfaces for high-quality user interfaces and vision inputs.
  • Connectivity and I/O  Single 10/100 Mbps Ethernet port, dual USB 2.0 OTG ports, multiple UART, SPI, I2C and I3C interfaces for flexible peripheral connectivity.
  • Storage and Boot  Dual FlexSPI serial flash interface plus up to three eMMC/SD host interfaces supporting eMMC5.1 and SD3.0 for boot and mass storage options.
  • Security  Hardware cryptographic acceleration, EdgeLock secure enclave (Root of Trust), on-the-fly decryption for external flash and secure boot capabilities as described in the series datasheet.
  • Package and Mounting  Surface-mount package; series datasheet references MAPBGA 15 × 15 mm, 0.5 mm pitch package options.
  • Operating Range and Compliance  Consumer-grade qualification with operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Edge and IoT Devices  Dual-core application processing with an M33 real-time core and multiple connectivity options makes this device suitable for edge gateways and IoT controllers that combine application logic and real-time tasks.
  • Audio and Voice Products  On-chip HiFi4 and Fusion DSPs accelerate advanced audio processing and low-power voice engines for smart speakers, voice assistants and conferencing systems.
  • Human-Machine Interfaces  MIPI-DSI display support and 3D GPU enable responsive graphical user interfaces for control panels, handheld devices and instrumentation.
  • Secure Connected Devices  Integrated cryptographic accelerators and EdgeLock secure enclave support secure boot, encrypted storage and hardware-based root of trust for connected endpoints.

Unique Advantages

  • Dual-domain Architecture: Combines dual Cortex-A35 application cores with a Cortex-M33 real-time core to run rich OS environments alongside deterministic real-time tasks.
  • Integrated DSP and Accelerator Suite: HiFi4 and Fusion DSPs plus PowerQuad and CASPER co-processors accelerate audio, signal processing and cryptography, reducing external BOM and CPU load.
  • Flexible Memory and Boot Options: Support for LPDDR3/LPDDR4/LPDDR4X, FlexSPI and eMMC/SD host interfaces simplifies system design across storage and performance requirements.
  • Comprehensive Peripheral Set: Multiple UART/SPI/I2C/I3C channels, USB 2.0 OTG and MIPI display/camera interfaces provide broad I/O for varied embedded systems.
  • Hardware Security Building Blocks: EdgeLock secure enclave, cryptographic acceleration and on-the-fly decryption enable robust device-level security and secure boot implementations.
  • Consumer-Grade Robustness: RoHS-compliant, surface-mount package and 0 °C to 95 °C operating range suit a wide range of consumer and commercial embedded products.

Why Choose MIMX8UD3DVP08SC?

The MIMX8UD3DVP08SC positions itself as a versatile embedded processor that balances application performance, real-time control and specialized DSP acceleration. Its integrated security features and broad peripheral interfaces make it well suited to connected devices that require multimedia, secure boot and sensor/communication integration.

This device is aimed at designers building consumer and commercial embedded systems who need a compact, integrated solution that reduces system complexity while offering scalable memory, display, audio and security options backed by the i.MX8ULP series architecture.

Request a quote or submit an inquiry to receive pricing and availability for the MIMX8UD3DVP08SC and to discuss how it fits your next embedded design.

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