MIMX8UD7CVP08SC
| Part Description |
I.MX8ULP, DUAL 800MHZ |
|---|---|
| Quantity | 1,201 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8UD |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A35 | Display & Interface Controllers | MIPI-CSI, MIPI-DSI | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A992C | Ethernet | 10/100Mbps | Graphics Acceleration | Yes | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 1 (Unlimited) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | RAM Controllers | LPDDR3, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | USB | USB 2.0 (2) |
Overview of MIMX8UD7CVP08SC – I.MX8ULP, DUAL 800MHZ
The MIMX8UD7CVP08SC is a microprocessor IC from NXP Semiconductors' i.MX 8UD series featuring a dual ARM® Cortex®-A35 64‑bit application domain. The device integrates heterogeneous processing with an ARM® Cortex®-M33 real‑time domain and dedicated audio/visual acceleration to address embedded designs that require balanced compute and low‑power operation.
On‑chip support for LPDDR3/LPDDR4 memory, MIPI-CSI/DSI display interfaces, Ethernet 10/100, USB 2.0, and I²C make this part suited to embedded multimedia, connectivity and power‑optimized systems. The processor architecture includes multiple power domains and low‑power modes to help system designers reduce runtime energy consumption.
Key Features
- Core Processor — Dual ARM® Cortex®-A35 cores (64‑bit) providing the main application processing capability.
- Heterogeneous Co‑processing — Integrated ARM® Cortex®-M33 real‑time core, HiFi4 DSP and 3D GPU for offloading real‑time control, audio processing and graphics acceleration.
- Memory Support — LPDDR3 and LPDDR4 memory controller support to accommodate a range of system memory configurations.
- Display Interfaces — MIPI-CSI and MIPI-DSI controllers for camera and display connectivity.
- Connectivity — 10/100 Mbps Ethernet, two USB 2.0 ports and I²C for common peripheral and network interfaces.
- Power and Low‑Power Design — Multiple independent power domains (Real‑time, Application, LPAV, DGO, VBAT) and selectable power modes enable power‑optimized operation; supports PMIC and non‑PMIC use cases and domain shutdown to save power.
- Graphics Acceleration — On‑chip GPU support (GPU3D and GPU2D indicated in architecture) for accelerated UI and visual workloads.
- Package and Mounting — Surface mount device suitable for standard PCB assembly processes.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Low‑power embedded systems — Dual Cortex‑A35 and Cortex‑M33 domains plus domain power control enable designers to optimize energy use across application and real‑time tasks.
- Multimedia interfaces — MIPI‑DSI/CSI and on‑chip graphics acceleration support camera and display front‑ends for visual user interfaces.
- Connected devices — Integrated Ethernet, USB 2.0 and I²C provide wired connectivity and peripheral integration for networked embedded products.
Unique Advantages
- Heterogeneous processing in a single device: Combines dual Cortex‑A35 application cores with a Cortex‑M33 real‑time core, HiFi4 DSP and GPU to consolidate compute, control and media tasks.
- Flexible memory options: Support for LPDDR3 and LPDDR4 memory controllers lets designers choose memory performance and cost points appropriate to the application.
- Power‑aware architecture: Distinct power domains and low‑power modes — including the ability to shut down AP or LPAV domains when using the real‑time domain — permit fine‑grained power management.
- Integrated multimedia and I/O: MIPI display/camera interfaces, graphics acceleration, Ethernet, USB and I²C reduce external component count for compact embedded designs.
- Surface mount packaging: Standard surface‑mount form factor supports typical automated assembly flows.
- Standards and compliance: RoHS compliance supports environmental and regulatory objectives in product design.
Why Choose MIMX8UD7CVP08SC?
The MIMX8UD7CVP08SC positions itself as a balanced, integrated microprocessor for embedded designers who need a combination of application performance, real‑time control and multimedia capability with aggressive power management. Its heterogeneous architecture and multiple power domains enable designers to partition workloads and optimize energy use without adding external processors.
Backed by NXP Semiconductors documentation for power measurement and domain management, this part is suited to teams developing compact, connected and power‑sensitive products that require a mix of application processing, audio/video acceleration and real‑time responsiveness.
Request a quote or submit a purchase inquiry to get pricing and availability for MIMX8UD7CVP08SC. Our team can help with lead times and volume ordering details.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016