MIMX8UD5CVP08SC

8ULP DUAL CORTEX A35
Part Description

8ULP DUAL CORTEX A35

Quantity 1,304 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UD
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSP3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A35Display & Interface ControllersMIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100MbpsGraphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40 °C – 105 °CQualificationIndustrial
RAM ControllersLPDDR3, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed800 MHzUSBUSB 2.0 (2)

Overview of MIMX8UD5CVP08SC – 8ULP DUAL CORTEX A35

The MIMX8UD5CVP08SC is an industrial-qualified microprocessor from NXP’s i.MX 8ULP family featuring dual ARM® Cortex®-A35 application cores and an ARM® Cortex®-M33 real-time core. The device integrates multiple DSP engines and co-processors to support audio processing, machine learning workloads, and secure cryptographic functions.

Targeted at embedded and industrial designs, this part combines application-class processing with real-time control and multimedia capabilities, providing a compact, highly integrated platform for connected devices, human‑machine interfaces, and audio/vision applications.

Key Features

  • Cores & Performance Dual ARM® Cortex®-A35 application cores (64-bit) running up to 800 MHz, paired with an ARM® Cortex®-M33 real-time core (nominal frequency 216 MHz) to separate OS and real-time workloads.
  • Real-time and DSP Acceleration Integrated Cortex‑M33 for deterministic control plus a Tensilica Fusion DSP (Fusion F1) and HiFi4 DSP for low-power audio processing and advanced audio/machine learning acceleration. Co-processors PowerQuad and CASPER accelerate DSP and cryptography functions.
  • Memory Interfaces Supports 32-bit LPDDR3, LPDDR4 and LPDDR4x memory interfaces to accommodate a range of performance and power profiles.
  • Graphics & Display Graphics acceleration with NEON SIMD engine and MIPI display interfaces (MIPI‑DSI) and camera interfaces (MIPI‑CSI) for display and vision applications.
  • Connectivity & I/O Integrated Ethernet 10/100 Mbps, dual USB 2.0 OTG ports, multiple UART/SPI/I2C/I3C/I2S interfaces, FlexSPI for serial flash and up to three eMMC/SD host interfaces.
  • Security & Trusted Boot On-chip cryptographic acceleration, NIST-compliant random number generator, EdgeLock secure enclave (ELKe) root of trust, Advanced High Assurance Boot (AHAB) and one-time programmable fuse support for secure boot and key storage.
  • System Integration & Reliability 512 KB L2 cache with Snoop Control Unit, 32 KB instruction/data caches per core, multiple DMA channels, secure/non-secure watchdog timers and on-chip boot ROM for robust system operation.
  • Package & Environmental Industrial-grade mounting (surface mount), operating temperature range −40 °C to 105 °C; available in compact MAPBGA packaging (15 × 15 mm, 0.5 mm pitch as documented for the family).

Typical Applications

  • Industrial Control & HMI Run Linux-based user interfaces on the Cortex‑A35 cores while the Cortex‑M33 handles deterministic control and safety-critical tasks.
  • Audio & Voice Platforms Leverage the Fusion DSP for low‑power audio processing and HiFi4 DSP for advanced audio algorithms and machine learning-based voice features.
  • IoT Gateways & Connected Devices Use integrated Ethernet, multiple host interfaces, and flexible serial memory options to build compact, connected edge devices and gateways.
  • Vision & Display Systems MIPI‑CSI and MIPI‑DSI interfaces plus graphics acceleration enable camera-based sensing and modern display-driven interfaces.

Unique Advantages

  • Heterogeneous compute in one device: Combines dual Cortex‑A35 application processors with a Cortex‑M33 real‑time core and multiple DSPs to consolidate application, control and signal processing domains.
  • Integrated security foundation: EdgeLock secure enclave, AHAB boot ROM, cryptographic accelerators and a NIST-compliant RNG provide on-chip mechanisms for secure boot and protected key handling.
  • Purpose-built audio and ML acceleration: Fusion F1 DSP for low‑power audio and HiFi4 DSP for advanced audio and machine learning workloads reduce external processor needs.
  • Flexible memory and storage options: Support for LPDDR3/LPDDR4/LPDDR4x and multiple FlexSPI/eMMC/SD interfaces enables designers to select the optimal memory configuration for cost and performance.
  • Industrial readiness: Industrial qualification and an extended operating temperature range (−40 °C to 105 °C) support deployment in demanding environments.
  • Rich peripheral set: Ethernet, dual USB OTG, MIPI‑CSI/DSI and multiple serial interfaces simplify BOM and accelerate design integration.

Why Choose MIMX8UD5CVP08SC?

The MIMX8UD5CVP08SC delivers a balanced combination of application processing, real‑time control and specialized signal processing in an industrial‑qualified package. Its heterogeneous architecture—dual Cortex‑A35, Cortex‑M33 and dedicated DSP/co‑processor blocks—lets designers partition workloads to optimize performance and power for embedded and industrial systems.

This part is suited to designs that require secure boot, multimedia and connectivity in a compact surface‑mount solution, providing a scalable platform for products that need integrated audio/ML acceleration, display/camera interfaces and robust security primitives.

Request a quote or contact sales to discuss pricing, availability, and how the MIMX8UD5CVP08SC can fit into your next embedded or industrial design.

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