MIMX8UD5CVP08SC
| Part Description |
8ULP DUAL CORTEX A35 |
|---|---|
| Quantity | 1,304 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8UD |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A35 | Display & Interface Controllers | MIPI-CSI, MIPI-DSI | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps | Graphics Acceleration | Yes | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 105 °C | Qualification | Industrial | ||
| RAM Controllers | LPDDR3, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 800 MHz | USB | USB 2.0 (2) |
Overview of MIMX8UD5CVP08SC – 8ULP DUAL CORTEX A35
The MIMX8UD5CVP08SC is an industrial-qualified microprocessor from NXP’s i.MX 8ULP family featuring dual ARM® Cortex®-A35 application cores and an ARM® Cortex®-M33 real-time core. The device integrates multiple DSP engines and co-processors to support audio processing, machine learning workloads, and secure cryptographic functions.
Targeted at embedded and industrial designs, this part combines application-class processing with real-time control and multimedia capabilities, providing a compact, highly integrated platform for connected devices, human‑machine interfaces, and audio/vision applications.
Key Features
- Cores & Performance Dual ARM® Cortex®-A35 application cores (64-bit) running up to 800 MHz, paired with an ARM® Cortex®-M33 real-time core (nominal frequency 216 MHz) to separate OS and real-time workloads.
- Real-time and DSP Acceleration Integrated Cortex‑M33 for deterministic control plus a Tensilica Fusion DSP (Fusion F1) and HiFi4 DSP for low-power audio processing and advanced audio/machine learning acceleration. Co-processors PowerQuad and CASPER accelerate DSP and cryptography functions.
- Memory Interfaces Supports 32-bit LPDDR3, LPDDR4 and LPDDR4x memory interfaces to accommodate a range of performance and power profiles.
- Graphics & Display Graphics acceleration with NEON SIMD engine and MIPI display interfaces (MIPI‑DSI) and camera interfaces (MIPI‑CSI) for display and vision applications.
- Connectivity & I/O Integrated Ethernet 10/100 Mbps, dual USB 2.0 OTG ports, multiple UART/SPI/I2C/I3C/I2S interfaces, FlexSPI for serial flash and up to three eMMC/SD host interfaces.
- Security & Trusted Boot On-chip cryptographic acceleration, NIST-compliant random number generator, EdgeLock secure enclave (ELKe) root of trust, Advanced High Assurance Boot (AHAB) and one-time programmable fuse support for secure boot and key storage.
- System Integration & Reliability 512 KB L2 cache with Snoop Control Unit, 32 KB instruction/data caches per core, multiple DMA channels, secure/non-secure watchdog timers and on-chip boot ROM for robust system operation.
- Package & Environmental Industrial-grade mounting (surface mount), operating temperature range −40 °C to 105 °C; available in compact MAPBGA packaging (15 × 15 mm, 0.5 mm pitch as documented for the family).
Typical Applications
- Industrial Control & HMI Run Linux-based user interfaces on the Cortex‑A35 cores while the Cortex‑M33 handles deterministic control and safety-critical tasks.
- Audio & Voice Platforms Leverage the Fusion DSP for low‑power audio processing and HiFi4 DSP for advanced audio algorithms and machine learning-based voice features.
- IoT Gateways & Connected Devices Use integrated Ethernet, multiple host interfaces, and flexible serial memory options to build compact, connected edge devices and gateways.
- Vision & Display Systems MIPI‑CSI and MIPI‑DSI interfaces plus graphics acceleration enable camera-based sensing and modern display-driven interfaces.
Unique Advantages
- Heterogeneous compute in one device: Combines dual Cortex‑A35 application processors with a Cortex‑M33 real‑time core and multiple DSPs to consolidate application, control and signal processing domains.
- Integrated security foundation: EdgeLock secure enclave, AHAB boot ROM, cryptographic accelerators and a NIST-compliant RNG provide on-chip mechanisms for secure boot and protected key handling.
- Purpose-built audio and ML acceleration: Fusion F1 DSP for low‑power audio and HiFi4 DSP for advanced audio and machine learning workloads reduce external processor needs.
- Flexible memory and storage options: Support for LPDDR3/LPDDR4/LPDDR4x and multiple FlexSPI/eMMC/SD interfaces enables designers to select the optimal memory configuration for cost and performance.
- Industrial readiness: Industrial qualification and an extended operating temperature range (−40 °C to 105 °C) support deployment in demanding environments.
- Rich peripheral set: Ethernet, dual USB OTG, MIPI‑CSI/DSI and multiple serial interfaces simplify BOM and accelerate design integration.
Why Choose MIMX8UD5CVP08SC?
The MIMX8UD5CVP08SC delivers a balanced combination of application processing, real‑time control and specialized signal processing in an industrial‑qualified package. Its heterogeneous architecture—dual Cortex‑A35, Cortex‑M33 and dedicated DSP/co‑processor blocks—lets designers partition workloads to optimize performance and power for embedded and industrial systems.
This part is suited to designs that require secure boot, multimedia and connectivity in a compact surface‑mount solution, providing a scalable platform for products that need integrated audio/ML acceleration, display/camera interfaces and robust security primitives.
Request a quote or contact sales to discuss pricing, availability, and how the MIMX8UD5CVP08SC can fit into your next embedded or industrial design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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