MIMX8US3CVP08SC
| Part Description |
8ULP DUAL CORTEX A35 |
|---|---|
| Quantity | 1,546 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8US |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A35, ARM® Cortex®-M33 | Display & Interface Controllers | MIPI-CSI, MIPI-DSI | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 100M, 10M | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | ||
| Operating Temperature | -40 °C – 105 °C | Qualification | Industrial | RAM Controllers | LPDDR3, LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 800 MHz | ||
| USB | USB 2.0 (2) |
Overview of MIMX8US3CVP08SC – 8ULP DUAL CORTEX A35
The MIMX8US3CVP08SC is an industrial-grade microprocessor from NXP’s i.MX 8ULP family combining dual Arm® Cortex®-A35 application cores with an Arm® Cortex®-M33 real-time core. It is designed for embedded systems that require a balance of application-level compute, real-time responsiveness, low-power operation and integrated security.
With an 800 MHz nominal application core frequency, on-chip DSP engines and comprehensive security features, this device targets industrial and embedded applications such as connected human-machine interfaces, edge audio/ML processing and sensor/communication gateways where integration and robustness matter.
Key Features
- Core Architecture Dual Arm® Cortex®-A35 application cores paired with an Arm® Cortex®-M33 real-time core to support rich OS workloads alongside real-time control.
- Performance 800 MHz nominal application core frequency with NEON SIMD and an L2 cache (512 KB) to accelerate compute and multimedia tasks.
- On-chip DSP and Accelerators Integrated Fusion DSP and HiFi4 DSP for low-power audio and advanced audio/machine-learning workloads; co-processors (PowerQuad and CASPER) accelerate DSP and cryptography functions.
- Memory Support 32-bit LPDDR3/LPDDR4 memory interface with support for LPDDR4x noted in the series specification for flexible memory design choices.
- Security Comprehensive security suite including AHAB (Advanced High Assurance Boot), CAAM, OTFAD, TRNG and NXP’s EdgeLock Secure Enclave as root of trust for secure boot, cryptography and key storage.
- Peripheral Interfaces Rich connectivity with dual USB 2.0 OTG ports, MIPI-CSI and MIPI-DSI display interfaces, multiple I2C, SPI and UART ports, and 10/100 Mbps Ethernet.
- Storage and Flash Multiple external storage options supported by FlexSPI serial flash interfaces and up to three eMMC/SD host interfaces as described in the i.MX 8ULP series datasheet.
- Package and Temperature Series MAPBGA package options (15 × 15 mm, 0.5 mm pitch) and industrial-grade operating temperature range of −40°C to 105°C for harsh environments.
- Mounting Surface-mount package suitable for production PCB assembly.
Typical Applications
- Industrial Control & Automation Process and machine control systems leveraging the real-time Cortex‑M33 core for deterministic tasks while the Cortex‑A35 cores handle HMI and higher-level logic.
- Connected HMI and Displays Touch and graphical interfaces using MIPI‑DSI for display connectivity and Cortex‑A35 compute for UI rendering and application software.
- Edge Audio and ML Low-power audio processing and edge machine-learning inference using the Fusion DSP and HiFi4 DSP alongside co-processor acceleration.
- Communications Gateways Embedded gateways and sensor aggregators using multiple serial interfaces, USB and 10/100 Ethernet for wired connectivity.
Unique Advantages
- Balanced Heterogeneous Computing: Dual Cortex‑A35 plus Cortex‑M33 architecture separates rich OS workloads from real-time control, simplifying software partitioning.
- Integrated Security Stack: EdgeLock Secure Enclave, AHAB, CAAM and TRNG provide a hardware-rooted security foundation for secure boot and cryptographic operations.
- DSP and Accelerator Offloads: Fusion and HiFi4 DSPs with PowerQuad/CASPER offloads reduce CPU load for audio, DSP and cryptography tasks, lowering overall power consumption.
- Industrial-Ready: Qualification for industrial applications and a −40°C to 105°C operating range support deployment in demanding environments.
- Flexible Memory and Storage Options: Support for LPDDR3/LPDDR4 and multiple flash/eMMC interfaces enables scalable memory and boot configurations.
- Rich I/O Integration: Multiple USB ports, MIPI display/camera interfaces, I2C, SPI, UART and Ethernet reduce external component count and simplify BOM.
Why Choose MIMX8US3CVP08SC?
The MIMX8US3CVP08SC positions itself as a versatile, industrial-grade embedded processor that combines application-level performance, real-time control and a strong hardware security foundation. Its heterogeneous architecture, integrated DSPs and broad peripheral set make it suitable for designs that must consolidate multiple functions—UI, connectivity, audio/ML and real-time control—into a single device.
For engineers and procurement teams building robust embedded systems, this part offers scalability across memory and interface options, a temperature rating for harsh environments and proven security features to support long-term, secure deployments.
Request a quote or contact sales to discuss pricing, availability and how MIMX8US3CVP08SC can be integrated into your next embedded design.

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