MIMX8US3CVP08SC

8ULP DUAL CORTEX A35
Part Description

8ULP DUAL CORTEX A35

Quantity 1,546 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8US
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A35, ARM® Cortex®-M33Display & Interface ControllersMIPI-CSI, MIPI-DSI
ECCNN/AEthernet100M, 10MHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountNumber of Cores/Bus Width1 Core, 64-Bit
Operating Temperature-40 °C – 105 °CQualificationIndustrialRAM ControllersLPDDR3, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed800 MHz
USBUSB 2.0 (2)

Overview of MIMX8US3CVP08SC – 8ULP DUAL CORTEX A35

The MIMX8US3CVP08SC is an industrial-grade microprocessor from NXP’s i.MX 8ULP family combining dual Arm® Cortex®-A35 application cores with an Arm® Cortex®-M33 real-time core. It is designed for embedded systems that require a balance of application-level compute, real-time responsiveness, low-power operation and integrated security.

With an 800 MHz nominal application core frequency, on-chip DSP engines and comprehensive security features, this device targets industrial and embedded applications such as connected human-machine interfaces, edge audio/ML processing and sensor/communication gateways where integration and robustness matter.

Key Features

  • Core Architecture Dual Arm® Cortex®-A35 application cores paired with an Arm® Cortex®-M33 real-time core to support rich OS workloads alongside real-time control.
  • Performance 800 MHz nominal application core frequency with NEON SIMD and an L2 cache (512 KB) to accelerate compute and multimedia tasks.
  • On-chip DSP and Accelerators Integrated Fusion DSP and HiFi4 DSP for low-power audio and advanced audio/machine-learning workloads; co-processors (PowerQuad and CASPER) accelerate DSP and cryptography functions.
  • Memory Support 32-bit LPDDR3/LPDDR4 memory interface with support for LPDDR4x noted in the series specification for flexible memory design choices.
  • Security Comprehensive security suite including AHAB (Advanced High Assurance Boot), CAAM, OTFAD, TRNG and NXP’s EdgeLock Secure Enclave as root of trust for secure boot, cryptography and key storage.
  • Peripheral Interfaces Rich connectivity with dual USB 2.0 OTG ports, MIPI-CSI and MIPI-DSI display interfaces, multiple I2C, SPI and UART ports, and 10/100 Mbps Ethernet.
  • Storage and Flash Multiple external storage options supported by FlexSPI serial flash interfaces and up to three eMMC/SD host interfaces as described in the i.MX 8ULP series datasheet.
  • Package and Temperature Series MAPBGA package options (15 × 15 mm, 0.5 mm pitch) and industrial-grade operating temperature range of −40°C to 105°C for harsh environments.
  • Mounting Surface-mount package suitable for production PCB assembly.

Typical Applications

  • Industrial Control & Automation Process and machine control systems leveraging the real-time Cortex‑M33 core for deterministic tasks while the Cortex‑A35 cores handle HMI and higher-level logic.
  • Connected HMI and Displays Touch and graphical interfaces using MIPI‑DSI for display connectivity and Cortex‑A35 compute for UI rendering and application software.
  • Edge Audio and ML Low-power audio processing and edge machine-learning inference using the Fusion DSP and HiFi4 DSP alongside co-processor acceleration.
  • Communications Gateways Embedded gateways and sensor aggregators using multiple serial interfaces, USB and 10/100 Ethernet for wired connectivity.

Unique Advantages

  • Balanced Heterogeneous Computing: Dual Cortex‑A35 plus Cortex‑M33 architecture separates rich OS workloads from real-time control, simplifying software partitioning.
  • Integrated Security Stack: EdgeLock Secure Enclave, AHAB, CAAM and TRNG provide a hardware-rooted security foundation for secure boot and cryptographic operations.
  • DSP and Accelerator Offloads: Fusion and HiFi4 DSPs with PowerQuad/CASPER offloads reduce CPU load for audio, DSP and cryptography tasks, lowering overall power consumption.
  • Industrial-Ready: Qualification for industrial applications and a −40°C to 105°C operating range support deployment in demanding environments.
  • Flexible Memory and Storage Options: Support for LPDDR3/LPDDR4 and multiple flash/eMMC interfaces enables scalable memory and boot configurations.
  • Rich I/O Integration: Multiple USB ports, MIPI display/camera interfaces, I2C, SPI, UART and Ethernet reduce external component count and simplify BOM.

Why Choose MIMX8US3CVP08SC?

The MIMX8US3CVP08SC positions itself as a versatile, industrial-grade embedded processor that combines application-level performance, real-time control and a strong hardware security foundation. Its heterogeneous architecture, integrated DSPs and broad peripheral set make it suitable for designs that must consolidate multiple functions—UI, connectivity, audio/ML and real-time control—into a single device.

For engineers and procurement teams building robust embedded systems, this part offers scalability across memory and interface options, a temperature rating for harsh environments and proven security features to support long-term, secure deployments.

Request a quote or contact sales to discuss pricing, availability and how MIMX8US3CVP08SC can be integrated into your next embedded design.

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