MIMX8UX5AVLFZACR

I.MX 8DUALX
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8D 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 604 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersMIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case609-BFBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 + PHY (2)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8UX5AVLFZACR – I.MX 8DUALX

The MIMX8UX5AVLFZACR is an industrial-grade embedded microprocessor from NXP Semiconductors featuring a heterogeneous 3-core architecture with ARM® Cortex®-A53 and ARM® Cortex®-M4F processors. The device combines a high-performance 64‑bit application domain (up to 1.2 GHz) with a dedicated real-time core (264 MHz) for deterministic control tasks.

Designed for embedded and industrial applications, the I.MX 8DUALX integrates graphics acceleration, rich display interfaces, and multi-protocol connectivity—along with hardware security features and a wide operating temperature range—enabling compact, robust system designs for HMI, gateways, and control systems.

Key Features

  • Core & Performance Triple-core architecture with ARM® Cortex®-A53 application cores (up to 1.2 GHz) plus an ARM® Cortex®-M4F real-time core (264 MHz) and NEON multimedia acceleration.
  • Memory Support Flexible external memory controller options supporting DDR3L, DDR4 and LPDDR4 to match performance and power targets.
  • Graphics & Display Integrated graphics acceleration with MIPI-CSI and MIPI-DSI display/ camera interfaces for rich user interfaces and video input.
  • Connectivity & I/O Built-in 10/100/1000 Mbps Ethernet (1), dual USB 2.0 ports with PHY, and CANbus support for industrial networking and peripheral expansion.
  • Security & Trusted Boot Hardware security features including ARM TrustZone, CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot, crypto acceleration and system isolation.
  • Package & Mounting Available in a 609‑FBGA (21 × 21 mm) surface-mount package suitable for compact board designs.
  • Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 125 °C for deployment in demanding environments.
  • Compliance RoHS compliant.

Typical Applications

  • Industrial Automation & Controls — Real-time control and supervisory processing using the Cortex‑M4F core for deterministic tasks and Cortex‑A53 cores for higher-level application processing.
  • Human-Machine Interfaces (HMI) — Graphics acceleration and MIPI display interfaces enable responsive, feature-rich operator panels and touch displays.
  • Connected Gateways & Edge Devices — Gigabit Ethernet, USB and CANbus support for protocol bridging, data aggregation and edge analytics in industrial networks.
  • Motor and Sensor Control — Dedicated real-time core and rich I/O make the device suitable for motor control, sensor interfacing and embedded control loops.

Unique Advantages

  • Highly integrated processing: Combines 64‑bit application cores with a real-time Cortex‑M4F core to consolidate system functions and reduce BOM.
  • Flexible memory options: Support for DDR3L, DDR4 and LPDDR4 lets designers optimize for cost, performance or power.
  • Broad connectivity: On-chip Ethernet, USB PHYs and CANbus simplify board-level design for industrial networking and peripheral interfaces.
  • Industrial readiness: Rated for −40 °C to 125 °C operation and industrial qualification for reliable field deployment.
  • Hardware security suite: Multiple security blocks (ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS) provide foundation for secure boot and runtime protection.
  • Compact packaging: 609‑FBGA (21×21 mm) package enables high-density system designs while supporting surface-mount assembly.

Why Choose MIMX8UX5AVLFZACR?

The MIMX8UX5AVLFZACR positions itself as a versatile embedded processor that balances application performance and real-time control in a single device. Its combination of ARM® Cortex®‑A53 application cores and an ARM® Cortex®‑M4F real-time core, broad memory support, integrated graphics/display interfaces and industrial-grade operating range make it well suited for demanding embedded and industrial designs.

Backed by NXP Semiconductors, this part delivers a compact, secure and connected platform for developers building HMIs, gateways, industrial controllers and other embedded systems that require long-term reliability and integration of compute, connectivity and security.

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