MIMX8UX5FVLFZAC

I.MX8 QXP 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,121 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8UX5FVLFZAC – I.MX8 QXP 21X21

The MIMX8UX5FVLFZAC is an NXP Semiconductors microprocessor IC featuring ARM® Cortex®-A53 and ARM® Cortex®-M4F cores in a 3-core, 64-bit configuration. With a primary application-core frequency of 1.2 GHz and a companion core at 264 MHz, this device targets embedded designs that require application-class processing alongside integrated peripheral support.

Engineered for multimedia and connected embedded systems, the device combines general-purpose compute, DSP acceleration and comprehensive I/O to address HMI, imaging, secure connectivity and industrial control segments while providing a highly integrated package option for compact designs.

Key Features

  • Core Architecture  ARM® Cortex®-A53 plus ARM® Cortex®-M4F; 3 cores, 64-bit compute backbone with a 1.2 GHz application core and a 264 MHz companion core.
  • DSP and Multimedia Acceleration  Integrated multimedia co-processors including NEON and Hi-Fi4 DSP support and graphics acceleration for advanced audio and processing tasks.
  • Memory Interfaces  On-chip controllers for DDR3L SDRAM and LPDDR4 DRAM provide flexible external memory choices for performance and capacity scaling.
  • Display and Imaging  Display interface controllers for LCD and LVDS plus MIPI-CSI and MIPI-DSI for camera and panel connectivity.
  • Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps), USB 2.0 OTG with PHY (1) and USB 3.0 OTG with PHY (1), plus CANbus support for robust wired connectivity.
  • Security  Hardware and software security features including A-HAB, ARM TrustZone (ARM TZ), CAAM, 3DES, DES, MD5, SHA and SNVS for secure boot and cryptographic operations.
  • Package and Mounting  609-FBGA package (21 mm × 21 mm) designed for surface-mount assembly to support compact board layouts.
  • Compliance  RoHS compliant.

Typical Applications

  • Human–Machine Interfaces (HMI)  Drive displays and multimedia UI layers using the integrated display controllers and graphics acceleration.
  • Imaging and Vision  Camera and sensor interfacing via MIPI-CSI and on-chip processing resources for image handling and preprocessing.
  • Secure Connected Devices  Gateways and edge devices leveraging dual Gigabit Ethernet, USB 3.0, and onboard security features for encrypted communications and secure boot.
  • Industrial Control and Automation  Embedded control nodes using CANbus and mixed I/O to interface with sensors, actuators and field networks.

Unique Advantages

  • Balanced Heterogeneous Processing  Combination of Cortex‑A53 and Cortex‑M4F cores provides both application-level compute and companion processing capability in a single device.
  • Integrated Multimedia and DSP Engines  NEON and Hi‑Fi4 DSP support with graphics acceleration reduces external processor dependency for audio, vision and signal tasks.
  • Comprehensive Connectivity Suite  Dual Gigabit Ethernet, USB 2.0/3.0 OTG with PHY and CANbus simplify system integration and reduce BOM complexity.
  • Hardware Security Building Blocks  A-HAB, ARM TrustZone and CAAM among other cryptographic primitives enable secure boot, encryption and authenticated workflows.
  • Flexible Memory Support  DDR3L and LPDDR4 memory controller support allows designers to select memory technology that matches performance and power targets.
  • Compact, Production-Ready Package  609‑FBGA (21×21 mm) surface‑mount package streamlines board real estate for compact embedded platforms.

Why Choose MIMX8UX5FVLFZAC?

The MIMX8UX5FVLFZAC positions itself as a versatile embedded microprocessor combining multi‑core compute, DSP acceleration and a broad set of integrated I/O and security features. It is well suited to designers building connected multimedia devices, secure edge appliances and industrial control systems that benefit from on-chip connectivity and cryptographic capabilities.

Backed by NXP Semiconductors’ product family and technical documentation, this device offers a compact 609‑FBGA footprint and feature set intended to simplify system design while providing scalable memory and interface options for production deployments.

Request a quote or submit your requirements today to check availability and pricing for the MIMX8UX5FVLFZAC.

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