MIMX8UX6AVLFZAC

I.MX8 DX 21X21
Part Description

I.MX8 DX 21X21

Quantity 1,063 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FECCN5A992CGraphics AccelerationYes
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width3 Core, 64-BitOperating Temperature–QualificationAutomotive
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantVoltage – I/O1.8 V – 3.3 V

Overview of MIMX8UX6AVLFZAC – I.MX8 DX 21X21

The MIMX8UX6AVLFZAC is a microprocessor from the NXP i.MX 8UX series designed for embedded and infotainment applications. It combines a heterogeneous core architecture featuring ARM® Cortex®-A53 and ARM® Cortex®-M4F processors in a 3-core, 64-bit configuration to handle application processing alongside real-time tasks.

Factory documentation for the i.MX8X family highlights integrated graphics and video subsystems, multi‑display support, and advanced audio processing, enabling multimedia-rich embedded platforms with compact surface-mount package options and RoHS compliance.

Key Features

  • CPU Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M4F cores in a 3-core, 64-bit configuration for combined application and real-time processing.
  • Graphics & Video  Graphics acceleration is supported; the series documentation describes separate GPU and VPU subsystems and a failover-ready display controller for multimedia and display-rich designs.
  • Audio & DSP  Series documentation references a high-performance Tensilica® HiFi 4 DSP for advanced audio preprocessing and voice recognition tasks.
  • Memory Interfaces  Data sheet notes support for LPDDR4 and DDR3L memory interfaces to match a range of performance and cost targets.
  • Multi‑Display Support  The family supports up to three displays with multiple output options (including parallel, MIPI‑DSI, and LVDS) for flexible HMI and multimedia implementations.
  • Package Options  Available package outlines include 21 × 21 mm and 17 × 17 mm FCPBGA options with 0.8 mm pitch, suitable for compact surface-mount assemblies.
  • Mounting & Compliance  Surface-mount device construction and RoHS compliance are specified for assembly and regulatory alignment.
  • Comprehensive Technical Data  Detailed datasheet coverage includes electrical characteristics, PLL and oscillator details, I/O timing, ADC, boot configuration, and package pin assignments to support design and validation.

Typical Applications

  • Infotainment and Multimedia Platforms  Leverages graphics/video acceleration, multi‑display capability, and audio DSP for rich user interfaces and media playback systems.
  • Embedded HMI Systems  Combines application and real-time cores with display and I/O support to drive interactive control panels and operator interfaces.
  • Advanced Audio Processing  Uses the integrated DSP and ARM cores for preprocessing, postprocessing, and voice recognition in voice-enabled products.
  • Multi‑display Embedded Solutions  Supports systems requiring multiple simultaneously driven displays with flexible output options.

Unique Advantages

  • Heterogeneous Multicore Design:  ARM® Cortex®-A53 plus Cortex®-M4F enables separation of application-level workloads and real-time control tasks for deterministic performance.
  • Integrated Multimedia Subsystems:  Dedicated GPU and VPU subsystems plus a display controller reduce external component count for graphics and video functions.
  • Flexible Memory Support:  LPDDR4 and DDR3L interface options allow designers to balance performance and cost across target applications.
  • Compact Package Choices:  21 × 21 mm and 17 × 17 mm FCPBGA package outlines with 0.8 mm pitch provide options for space-constrained board designs.
  • Extensive Documentation:  The supplied technical documentation includes electrical characteristics, boot-mode configuration, peripheral timing, and package assignments to accelerate system bring-up.
  • RoHS Compliant:  Meets RoHS requirements for environmentally compliant manufacturing.

Why Choose MIMX8UX6AVLFZAC?

The MIMX8UX6AVLFZAC positions itself as a versatile embedded microprocessor within the i.MX 8UX family, combining multi-core ARM processing with dedicated multimedia and audio subsystems. This combination supports designs that require concurrent application processing, real-time control, and rich user interfaces.

Its flexible memory interfaces, multi‑display capabilities, and compact BGA package options make it well-suited for embedded and infotainment-oriented platforms where integration, documented electrical characteristics, and space-optimized mounting are important design considerations.

Request a quote or submit an inquiry to check availability, lead times, and pricing for the MIMX8UX6AVLFZAC. Our team can provide the latest purchasing information and assist with your design requirements.

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