MIMX8UX6FVLFZAC

I.MX8 QXP 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 918 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8UX6FVLFZAC – I.MX8 QXP 21X21

The MIMX8UX6FVLFZAC is a high-integration microprocessor IC in the i.MX 8UX series featuring an ARM® Cortex®-A53 main core cluster paired with an ARM® Cortex®-M4F real-time core. It delivers a 1.2 GHz application processor together with a 3-core, 64-bit architecture optimized for embedded designs that require compute, real-time control and multimedia acceleration.

Built for embedded systems, this device combines advanced security engines, multiple high‑speed connectivity and display interfaces, and DSP acceleration to support graphics, audio and secure applications while simplifying board-level integration.

Key Features

  • CPU and Real-Time Cores — ARM® Cortex®-A53 plus ARM® Cortex®-M4F in a 3-core, 64‑bit configuration with a 1.2 GHz main processor frequency for application and real-time task partitioning.
  • DSP and Multimedia Acceleration — Integrated NEON SIMD and Hi‑Fi4 DSP support multimedia processing and advanced audio tasks.
  • Memory Interfaces — Supports DDR3L SDRAM and LPDDR4 DRAM memory controllers for flexible memory subsystem design.
  • Display and Camera Interfaces — Includes controllers for LCD and LVDS plus MIPI-CSI and MIPI-DSI to enable rich human‑machine interfaces and camera connectivity.
  • High‑Speed Connectivity — Dual Gigabit Ethernet ports (10/100/1000 Mbps), USB 3.0 OTG + PHY and USB 2.0 OTG + PHY provide robust wired connectivity options.
  • Automotive-style Communications — CANbus interface support for deterministic vehicle or industrial fieldbus communication.
  • Security and Cryptography — On‑chip security features include 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS for secure boot and runtime protection.
  • Package and Mounting — 609‑FBGA (21 × 21 mm) package, surface mount, for compact, board‑level integration.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Embedded Control and HMI: Drives displays and touch interfaces using MIPI‑DSI/MIPI‑CSI, LCD and LVDS while handling application and real‑time tasks.
  • Industrial Networking and Gateways: Dual Gigabit Ethernet and CANbus provide connectivity and protocol bridging for industrial systems and edge devices.
  • Multimedia and Audio Devices: NEON and Hi‑Fi4 DSP acceleration supports audio processing, codecs and multimedia pipelines.
  • Secure Edge Compute: Built‑in cryptography engines and secure boot elements enable protected firmware and data handling for embedded security use cases.

Unique Advantages

  • Balanced Application + Real‑Time Processing: Combines a 1.2 GHz ARM® Cortex®-A53 application core with an ARM® Cortex®-M4F real‑time core to separate high‑level OS tasks from deterministic control workloads.
  • Integrated Multimedia Engines: NEON SIMD and Hi‑Fi4 DSP reduce external processing needs for audio and media, simplifying BOM and software partitioning.
  • Comprehensive Connectivity: Dual Gigabit Ethernet, USB 3.0/2.0 OTG and CANbus support diverse wired interfaces from high‑throughput networking to fieldbus integration.
  • Hardware Security Primitives: Multiple on‑chip crypto accelerators and secure boot features provide a foundation for building secure embedded products.
  • Compact, Production‑Ready Package: 609‑FBGA (21×21 mm) surface‑mount package enables high‑density board layouts for space‑constrained systems.

Why Choose MIMX8UX6FVLFZAC?

The MIMX8UX6FVLFZAC positions itself as a versatile embedded processor that pairs application performance with real‑time control and dedicated multimedia acceleration. Its combination of ARM® Cortex®-A53 and Cortex®-M4F cores, broad connectivity (Gigabit Ethernet, USB 3.0/2.0, CANbus), display/camera interfaces and hardware security features make it suitable for integrated embedded systems that require compute, connectivity and protected operation.

This device is well suited to designers seeking a compact, secure and feature‑rich processor for industrial, multimedia and edge applications where integration and reliable long‑term support are important design considerations.

Request a quote or submit an inquiry today to receive pricing and availability information for the MIMX8UX6FVLFZAC. Our team can provide lead‑time details and assist with technical questions.

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