MIMX8UX5FVOFZAC

I.MX 8DUALX 17X17
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 446 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz, 264MHz
Supplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8UX5FVOFZAC – ARM Cortex‑A53 / Cortex‑M4F 3‑Core 1.2 GHz Microprocessor, 609‑FBGA

The MIMX8UX5FVOFZAC is an embedded microprocessor from NXP Semiconductors’ i.MX 8UX series, combining ARM® Cortex®‑A53 and ARM® Cortex®‑M4F cores in a 3‑core, 64‑bit architecture. With a 1.2 GHz application core frequency and integrated real‑time processing, this device targets embedded designs that require multicore compute, graphics acceleration, and a wide range of on‑chip connectivity and display interfaces.

Configured in a 609‑FBGA (21×21) surface‑mount package and RoHS compliant, the part provides integrated memory controllers, multimedia DSP support and multiple high‑speed I/O options to address compact, feature‑rich embedded systems.

Key Features

  • Core Architecture  ARM® Cortex®‑A53 application cores combined with an ARM® Cortex®‑M4F real‑time core; 3 cores total, 64‑bit processing at up to 1.2 GHz.
  • Multimedia and DSP  Includes NEON and Hi‑Fi4 DSP capabilities for multimedia and signal processing workloads.
  • Memory Interfaces  On‑chip controllers for DDR3L and LPDDR4 DRAM to support system memory requirements.
  • Display and Camera Interfaces  Built‑in controllers for LCD, LVDS, MIPI‑CSI and MIPI‑DSI for driving displays and connecting camera sensors.
  • High‑Speed Connectivity  Dual 10/100/1000 Mbps Ethernet ports and integrated USB support including USB 3.0 OTG + PHY and USB 2.0 OTG + PHY.
  • Package and Mounting  609‑FBGA supplier device package (21×21) in a surface‑mount form factor for compact board designs.
  • Graphics Acceleration  On‑chip graphics acceleration to support GUI and multimedia display tasks.
  • Compliance  RoHS compliant.

Typical Applications

  • Multimedia and HMI systems  Use the integrated display interfaces and graphics acceleration for user interfaces, graphical displays and video playback.
  • Connected embedded gateways  Dual gigabit Ethernet and USB 3.0/2.0 OTG enable high‑bandwidth connectivity for networked devices and edge gateways.
  • Real‑time control with application processing  Combine Cortex‑A53 application processing with Cortex‑M4F real‑time control for mixed workload embedded systems.
  • Multimedia-enabled IoT devices  NEON and Hi‑Fi4 DSP support enables audio processing, signal processing and other compute‑intensive multimedia tasks.

Unique Advantages

  • Balanced multicore architecture: Delivers application‑level performance and dedicated real‑time processing in a single device for mixed‑function systems.
  • Rich on‑chip I/O: Integrated dual gigabit Ethernet and both USB 3.0 and USB 2.0 OTG ports reduce the need for external controllers and simplify board design.
  • Comprehensive display support: Multiple display and camera interfaces (LCD, LVDS, MIPI‑CSI, MIPI‑DSI) enable flexible HMI and vision designs.
  • Multimedia acceleration: NEON and Hi‑Fi4 DSP capabilities provide hardware acceleration for audio, signal processing and multimedia workloads.
  • Compact, manufacturable package: 609‑FBGA (21×21) surface‑mount package supports high‑density designs and automated assembly processes.
  • Standards‑aligned compliance: RoHS compliance supports regulatory and environmental requirements for production.

Why Choose MIMX8UX5FVOFZAC?

The MIMX8UX5FVOFZAC positions itself as a highly integrated embedded processor that pairs 64‑bit application performance with real‑time control, making it suitable for compact systems that demand multimedia capability, robust connectivity and flexible display support. Its combination of ARM® Cortex®‑A53 and Cortex®‑M4F cores, DSP acceleration and broad I/O support enables designers to consolidate functionality while maintaining performance and determinism.

This device is well suited for engineers designing connected HMIs, multimedia‑enabled IoT devices, and embedded gateways who need an integrated solution with proven architectural building blocks and on‑chip peripherals to accelerate development and deployment.

Request a quote or submit a pricing inquiry to get availability and lead‑time information for MIMX8UX5FVOFZAC.

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