MIMX8UX5FVOFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21) |
|---|---|
| Quantity | 446 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8UX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 609-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 609-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 264MHz | ||
| Supplier Device Package | 609-FBGA (21×21) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8UX5FVOFZAC – ARM Cortex‑A53 / Cortex‑M4F 3‑Core 1.2 GHz Microprocessor, 609‑FBGA
The MIMX8UX5FVOFZAC is an embedded microprocessor from NXP Semiconductors’ i.MX 8UX series, combining ARM® Cortex®‑A53 and ARM® Cortex®‑M4F cores in a 3‑core, 64‑bit architecture. With a 1.2 GHz application core frequency and integrated real‑time processing, this device targets embedded designs that require multicore compute, graphics acceleration, and a wide range of on‑chip connectivity and display interfaces.
Configured in a 609‑FBGA (21×21) surface‑mount package and RoHS compliant, the part provides integrated memory controllers, multimedia DSP support and multiple high‑speed I/O options to address compact, feature‑rich embedded systems.
Key Features
- Core Architecture ARM® Cortex®‑A53 application cores combined with an ARM® Cortex®‑M4F real‑time core; 3 cores total, 64‑bit processing at up to 1.2 GHz.
- Multimedia and DSP Includes NEON and Hi‑Fi4 DSP capabilities for multimedia and signal processing workloads.
- Memory Interfaces On‑chip controllers for DDR3L and LPDDR4 DRAM to support system memory requirements.
- Display and Camera Interfaces Built‑in controllers for LCD, LVDS, MIPI‑CSI and MIPI‑DSI for driving displays and connecting camera sensors.
- High‑Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and integrated USB support including USB 3.0 OTG + PHY and USB 2.0 OTG + PHY.
- Package and Mounting 609‑FBGA supplier device package (21×21) in a surface‑mount form factor for compact board designs.
- Graphics Acceleration On‑chip graphics acceleration to support GUI and multimedia display tasks.
- Compliance RoHS compliant.
Typical Applications
- Multimedia and HMI systems Use the integrated display interfaces and graphics acceleration for user interfaces, graphical displays and video playback.
- Connected embedded gateways Dual gigabit Ethernet and USB 3.0/2.0 OTG enable high‑bandwidth connectivity for networked devices and edge gateways.
- Real‑time control with application processing Combine Cortex‑A53 application processing with Cortex‑M4F real‑time control for mixed workload embedded systems.
- Multimedia-enabled IoT devices NEON and Hi‑Fi4 DSP support enables audio processing, signal processing and other compute‑intensive multimedia tasks.
Unique Advantages
- Balanced multicore architecture: Delivers application‑level performance and dedicated real‑time processing in a single device for mixed‑function systems.
- Rich on‑chip I/O: Integrated dual gigabit Ethernet and both USB 3.0 and USB 2.0 OTG ports reduce the need for external controllers and simplify board design.
- Comprehensive display support: Multiple display and camera interfaces (LCD, LVDS, MIPI‑CSI, MIPI‑DSI) enable flexible HMI and vision designs.
- Multimedia acceleration: NEON and Hi‑Fi4 DSP capabilities provide hardware acceleration for audio, signal processing and multimedia workloads.
- Compact, manufacturable package: 609‑FBGA (21×21) surface‑mount package supports high‑density designs and automated assembly processes.
- Standards‑aligned compliance: RoHS compliance supports regulatory and environmental requirements for production.
Why Choose MIMX8UX5FVOFZAC?
The MIMX8UX5FVOFZAC positions itself as a highly integrated embedded processor that pairs 64‑bit application performance with real‑time control, making it suitable for compact systems that demand multimedia capability, robust connectivity and flexible display support. Its combination of ARM® Cortex®‑A53 and Cortex®‑M4F cores, DSP acceleration and broad I/O support enables designers to consolidate functionality while maintaining performance and determinism.
This device is well suited for engineers designing connected HMIs, multimedia‑enabled IoT devices, and embedded gateways who need an integrated solution with proven architectural building blocks and on‑chip peripherals to accelerate development and deployment.
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Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
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