MIMX8UX6AVOFZAC
| Part Description |
I.MX8 QXP 17X17 |
|---|---|
| Quantity | 1,364 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8UX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4F, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Grade | Automotive | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | Operating Temperature | -40 °C – 105 °C | ||
| Qualification | Automotive | RAM Controllers | DDR3L, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.2 GHz | USB | USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of MIMX8UX6AVOFZAC – I.MX8 QXP 17X17
The MIMX8UX6AVOFZAC is a high-performance embedded microprocessor from NXP Semiconductors built on a 3-core, 64-bit architecture. It combines ARM® Cortex®-A53 application processing with an ARM® Cortex®-M4F real-time domain and integrated DSP capabilities to address connected, display-driven embedded designs.
With a 1.2 GHz operating speed, multiple high-speed interfaces and support for modern memory standards, this device targets embedded applications that require balanced compute, multimedia and connectivity in a compact surface-mount package footprint.
Key Features
- CPU Architecture 3-core, 64-bit architecture combining ARM® Cortex®-A53 and ARM® Cortex®-M4F cores running up to 1.2 GHz for mixed application and real-time workloads.
- Co-processors & DSP Integrated ARM® Cortex®-M4F and Hi-Fi4 DSP provide dedicated processing for real-time tasks, audio processing and signal acceleration.
- Memory Interfaces Supports DDR3L and LPDDR4 memory controllers for flexible system memory configurations.
- Display & Graphics Display interface controllers include LCD, LVDS, MIPI-CSI and MIPI-DSI and the device includes graphics acceleration for user interfaces and multimedia.
- Ethernet & USB Dual 10/100/1000 Mbps Ethernet ports and one USB 2.0 port with integrated PHY provide wired connectivity for networking and peripherals.
- System Integration Multiple on-chip peripherals and interfaces reduce external BOM and simplify board-level integration for embedded systems.
- Operating Range Rated for operation from -40°C to 105°C, suitable for extended-temperature embedded deployments.
- Mounting & Compliance Surface mount device and RoHS compliant for modern manufacturing processes and environmental requirements.
Typical Applications
- Industrial HMI and Control Drives display-rich human-machine interfaces and local control logic with combined application and real-time cores plus display interfaces.
- Edge Multimedia & Audio Processing On-chip Hi-Fi4 DSP and graphics acceleration enable localized audio and multimedia processing for edge devices.
- Networked Appliances Dual Gigabit Ethernet and USB connectivity support network gateways, media bridges and appliance controllers requiring high-throughput interfaces.
- Embedded Compute Modules Compact surface-mount form factor and flexible memory support make it suitable for system-on-module and compact embedded compute designs.
Unique Advantages
- Balanced Multi-Domain Processing: Combines 64-bit application cores with a real-time core and DSPs to separate OS-level tasks from deterministic processing.
- Flexible Memory Support: DDR3L and LPDDR4 controller support enables designers to choose memory options that match performance and power targets.
- Integrated Connectivity: Dual Gigabit Ethernet and USB 2.0 with PHY reduce the need for external controllers and simplify board design.
- Rich Display Interfaces: Native LCD, LVDS, MIPI-CSI and MIPI-DSI controllers streamline development of UIs and camera-enabled applications.
- Wide Temperature Operation: -40°C to 105°C rating supports deployment in extended-temperature embedded environments.
- RoHS Compliant & Surface Mount: Designed for modern manufacturing and environmental standards to ease production integration.
Why Choose MIMX8UX6AVOFZAC?
The MIMX8UX6AVOFZAC from NXP Semiconductors offers a compact, integrated microprocessor solution for embedded systems that need a blend of application processing, real-time control and DSP acceleration. Its combination of a 3-core 64-bit architecture, graphics acceleration, flexible memory support and robust connectivity makes it well suited for display-centric, networked and multimedia edge applications.
Designed for efficient system integration and manufacturing, this device provides a platform-level feature set that helps reduce external components while supporting extended-temperature operation for demanding embedded deployments.
Request a quote or submit an inquiry for pricing and availability of MIMX8UX6AVOFZAC to move your design into production.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016