MIMX8UX6AVOFZAC

I.MX8 QXP 17X17
Part Description

I.MX8 QXP 17X17

Quantity 1,364 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4F, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDisplay & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100/1000Mbps (2)GradeAutomotive
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountNumber of Cores/Bus Width3 Core, 64-BitOperating Temperature-40 °C – 105 °C
QualificationAutomotiveRAM ControllersDDR3L, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.2 GHzUSBUSB 2.0 + PHY (1)
Voltage – I/O1.8 V – 3.3 V

Overview of MIMX8UX6AVOFZAC – I.MX8 QXP 17X17

The MIMX8UX6AVOFZAC is a high-performance embedded microprocessor from NXP Semiconductors built on a 3-core, 64-bit architecture. It combines ARM® Cortex®-A53 application processing with an ARM® Cortex®-M4F real-time domain and integrated DSP capabilities to address connected, display-driven embedded designs.

With a 1.2 GHz operating speed, multiple high-speed interfaces and support for modern memory standards, this device targets embedded applications that require balanced compute, multimedia and connectivity in a compact surface-mount package footprint.

Key Features

  • CPU Architecture  3-core, 64-bit architecture combining ARM® Cortex®-A53 and ARM® Cortex®-M4F cores running up to 1.2 GHz for mixed application and real-time workloads.
  • Co-processors & DSP  Integrated ARM® Cortex®-M4F and Hi-Fi4 DSP provide dedicated processing for real-time tasks, audio processing and signal acceleration.
  • Memory Interfaces  Supports DDR3L and LPDDR4 memory controllers for flexible system memory configurations.
  • Display & Graphics  Display interface controllers include LCD, LVDS, MIPI-CSI and MIPI-DSI and the device includes graphics acceleration for user interfaces and multimedia.
  • Ethernet & USB  Dual 10/100/1000 Mbps Ethernet ports and one USB 2.0 port with integrated PHY provide wired connectivity for networking and peripherals.
  • System Integration  Multiple on-chip peripherals and interfaces reduce external BOM and simplify board-level integration for embedded systems.
  • Operating Range  Rated for operation from -40°C to 105°C, suitable for extended-temperature embedded deployments.
  • Mounting & Compliance  Surface mount device and RoHS compliant for modern manufacturing processes and environmental requirements.

Typical Applications

  • Industrial HMI and Control  Drives display-rich human-machine interfaces and local control logic with combined application and real-time cores plus display interfaces.
  • Edge Multimedia & Audio Processing  On-chip Hi-Fi4 DSP and graphics acceleration enable localized audio and multimedia processing for edge devices.
  • Networked Appliances  Dual Gigabit Ethernet and USB connectivity support network gateways, media bridges and appliance controllers requiring high-throughput interfaces.
  • Embedded Compute Modules  Compact surface-mount form factor and flexible memory support make it suitable for system-on-module and compact embedded compute designs.

Unique Advantages

  • Balanced Multi-Domain Processing: Combines 64-bit application cores with a real-time core and DSPs to separate OS-level tasks from deterministic processing.
  • Flexible Memory Support: DDR3L and LPDDR4 controller support enables designers to choose memory options that match performance and power targets.
  • Integrated Connectivity: Dual Gigabit Ethernet and USB 2.0 with PHY reduce the need for external controllers and simplify board design.
  • Rich Display Interfaces: Native LCD, LVDS, MIPI-CSI and MIPI-DSI controllers streamline development of UIs and camera-enabled applications.
  • Wide Temperature Operation: -40°C to 105°C rating supports deployment in extended-temperature embedded environments.
  • RoHS Compliant & Surface Mount: Designed for modern manufacturing and environmental standards to ease production integration.

Why Choose MIMX8UX6AVOFZAC?

The MIMX8UX6AVOFZAC from NXP Semiconductors offers a compact, integrated microprocessor solution for embedded systems that need a blend of application processing, real-time control and DSP acceleration. Its combination of a 3-core 64-bit architecture, graphics acceleration, flexible memory support and robust connectivity makes it well suited for display-centric, networked and multimedia edge applications.

Designed for efficient system integration and manufacturing, this device provides a platform-level feature set that helps reduce external components while supporting extended-temperature operation for demanding embedded deployments.

Request a quote or submit an inquiry for pricing and availability of MIMX8UX6AVOFZAC to move your design into production.

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