MIMX8UX6FVOFZAC

I.MX 8DUALX 17X17
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 645 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8UX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz, 264MHz
Supplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8UX6FVOFZAC – I.MX 8DUALX 17X17

The MIMX8UX6FVOFZAC is an NXP Semiconductors microprocessor from the i.MX 8UX series designed for embedded applications. It integrates ARM® Cortex® application and real-time core architectures with on-chip multimedia and graphics capabilities to address display, connectivity and multimedia-focused designs.

With multi-core 64‑bit processing, dedicated DSP and multimedia accelerators, and a high‑density BGA package, this device targets embedded systems that require integrated display interfaces, high‑speed networking and USB connectivity while maintaining a compact surface‑mount footprint.

Key Features

  • Processor Cores ARM® Cortex®-A53 and ARM® Cortex®-M4F cores; listed as a 3‑core, 64‑bit architecture with operating frequencies shown at 1.2 GHz and 264 MHz.
  • Co‑processors and DSP Multimedia accelerators including NEON and HiFi4 DSP support for enhanced audio and media processing tasks.
  • Memory Interfaces Memory controller support for DDR3L SDRAM and LPDDR4 DRAM, enabling flexible memory configurations for embedded systems.
  • Display and Camera Interfaces Integrated controllers for LCD and LVDS displays plus MIPI‑CSI and MIPI‑DSI interfaces for camera and high‑resolution display connectivity.
  • Wired Networking Dual Gigabit Ethernet (10/100/1000 Mbps ×2) for high‑bandwidth networked applications.
  • USB Connectivity On‑chip USB ports including USB 2.0 OTG with PHY (1) and USB 3.0 OTG with PHY (1) for host/device and high‑speed peripheral support.
  • Graphics Acceleration Graphics acceleration capability is indicated to support UI and multimedia rendering workloads.
  • Package and Mounting 609‑FBGA package (21 × 21 mm) listed as 609‑BFBGA / 609‑FBGA, designed for surface mount assembly.
  • Compliance RoHS compliant.

Typical Applications

  • Embedded HMI and Displays — Drive LCD/LVDS panels or MIPI‑DSI displays and run graphical user interfaces with on‑chip graphics acceleration.
  • Multimedia Devices — Leverage NEON and HiFi4 DSP support for audio and media processing in multimedia‑centric embedded products.
  • Networked Embedded Systems — Use dual Gigabit Ethernet interfaces for industrial gateways, edge nodes or other network‑connected appliances.
  • Camera and Vision Interfaces — Integrate camera sensors via MIPI‑CSI for vision or imaging applications.

Unique Advantages

  • Multi‑core 64‑bit Architecture: Offers a combination of application and real‑time cores within a single device to separate OS and real‑time tasks.
  • Integrated Multimedia Acceleration: NEON and HiFi4 DSPs provide hardware acceleration for audio and media workloads, reducing software overhead.
  • Broad Display and Camera Support: Native LCD, LVDS, MIPI‑DSI and MIPI‑CSI controllers simplify integration of displays and imaging sensors.
  • High‑speed Connectivity: Dual Gigabit Ethernet plus USB 2.0/3.0 OTG with PHY enable robust wired networking and peripheral interfacing.
  • Compact Surface‑Mount Package: 609‑FBGA (21×21) offers a high‑density, production‑ready package for space‑constrained designs.
  • Supply‑Chain Friendly Compliance: RoHS compliance supports environmental and regulatory requirements for many embedded products.

Why Choose MIMX8UX6FVOFZAC?

The MIMX8UX6FVOFZAC positions itself as a highly integrated embedded microprocessor combining multi‑core computing, dedicated DSP/multimedia accelerators, broad display/camera interfaces and dual Gigabit Ethernet in a compact 609‑FBGA package. It suits designs that require a balance of application processing, real‑time control and media connectivity within a single silicon solution.

This part is appropriate for engineers and product teams building embedded HMIs, multimedia devices, networked edge systems and camera enabled products who need verified interfaces and hardware acceleration while maintaining a compact, surface‑mount form factor.

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