MIMX8US5CVP08SC
| Part Description |
8ULP DUAL CORTEX A35 |
|---|---|
| Quantity | 1,666 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8US |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A35, ARM® Cortex®-M33 | Display & Interface Controllers | MIPI-CSI, MIPI-DSI | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100M, 10M | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Operating Temperature | -40 °C – 105 °C | ||
| Qualification | Industrial | RAM Controllers | LPDDR3, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 800 MHz |
Overview of MIMX8US5CVP08SC – 8ULP DUAL CORTEX A35
The MIMX8US5CVP08SC is an NXP i.MX 8ULP family microprocessor combining dual ARM® Cortex®-A35 application cores with an ARM® Cortex®-M33 real-time core. The architecture supports running a rich operating system on the Cortex‑A35 cores and an RTOS on the Cortex‑M33, enabling mixed application and real-time workloads in industrial embedded systems.
Designed for industrial applications, this part integrates multimedia DSP engines, a broad set of peripheral interfaces, and hardware security features to address use cases that require processing, connectivity, and device-level trust in a single surface-mount package.
Key Features
- Core architecture Dual ARM® Cortex®-A35 application processors at 800 MHz combined with an ARM® Cortex®-M33 real-time processor (nominal RUN frequency 216 MHz) to separate application and real-time tasks.
- DSP and co‑processors Integrated Tensilica Fusion F1 DSP and HiFi4 DSP for audio and machine learning workloads, plus PowerQuad and CASPER co-processors connected to the Cortex‑M33 to accelerate DSP and cryptography functions. Fusion DSP nominal frequency shown as 200 MHz.
- Memory support 32-bit external memory interface supporting LPDDR3, LPDDR4 and LPDDR4x; includes on-chip resources such as 512 KB L2 cache, 32 KB instruction and 32 KB data caches, 64 KB on-chip RAM and 768 KB shared memory.
- Security features Hardware security features include Advanced High Assurance Boot (AHAB), CAAM, CRC, NXP's EdgeLock Secure Enclave, OTFAD (on-the-fly decryption), and a TRNG (NIST-compliant random number generator).
- Connectivity and I/O Rich peripheral set with Dual FlexSPI for serial flash, 3x eMMC/SD host interfaces, dual high-speed USB OTG with integrated PHY, 1x 10/100 Mbit/s Ethernet, multiple UART/SPI/I2C/I3C/I2S ports, FlexCAN and FlexIO.
- Display and imaging MIPI-CSI and MIPI-DSI display interface controllers for camera and display subsystem integration, plus graphics acceleration for UI and multimedia tasks.
- Package and temperature Industrial qualification with surface-mount packaging (MAPBGA 15 × 15 mm, 0.5 mm pitch referenced in the i.MX 8ULP datasheet) and an operating temperature range of −40 °C to 105 °C.
- Boot and reliability Dedicated boot ROM, secure boot capabilities, watchdog timers (secure and non-secure), and multiple DMA channels for robust, deterministic system operation.
Typical Applications
- Industrial Control and Automation Use the dual‑core application and real‑time domains to run user interfaces and field control logic simultaneously while meeting industrial temperature requirements.
- Audio and Edge Machine Learning Leverage the HiFi4 and Fusion DSPs plus co‑processors for low‑power audio processing, voice interfaces, and compact ML inference at the edge.
- Connected Gateways and IIoT Nodes Integrate Ethernet, USB OTG, and multiple serial interfaces to build secure connectivity endpoints and protocol bridges for industrial networks.
- Smart Displays and Vision-enabled Devices Combine MIPI-DSI/CSI, graphics acceleration, and multimedia engines for human‑machine interfaces, camera processing, and visualization.
Unique Advantages
- Heterogeneous processing domains: Separate application and real‑time workloads by design, enabling Linux-class applications on Cortex‑A35 and deterministic control on Cortex‑M33.
- Integrated security stack: EdgeLock Secure Enclave, AHAB, CAAM, OTFAD and TRNG provide a hardware-rooted security foundation for secure boot, key storage, and encrypted external memory.
- DSP and accelerator ecosystem: Fusion F1, HiFi4, PowerQuad and CASPER accelerate audio, DSP and cryptographic workloads to reduce software complexity and offload CPU cores.
- Comprehensive peripheral set: Broad host and serial interfaces, dual FlexSPI and eMMC/SD support simplify system integration for multi‑media and connectivity designs.
- Industrial-ready thermal range: Qualified for −40 °C to 105 °C operation, supporting deployment in temperature-challenging environments.
Why Choose MIMX8US5CVP08SC?
The MIMX8US5CVP08SC positions itself as a balanced, highly integrated microprocessor for industrial embedded designs that require concurrent application-level processing, real-time control, multimedia/DSP capability and hardware-backed security. Its combination of dual Cortex‑A35 cores, a Cortex‑M33 real-time processor and dedicated DSP/co‑processors enables consolidated system architectures that reduce BOM and simplify firmware partitioning.
This part is suited to designers building industrial HMI, connected sensors/gateways, audio‑centric devices and vision-enabled controls that demand secure boot, robust peripheral connectivity and industrial temperature operation, all within the i.MX 8ULP processor family footprint.
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