MIMX8US5CVP08SC

8ULP DUAL CORTEX A35
Part Description

8ULP DUAL CORTEX A35

Quantity 1,666 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8US
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A35, ARM® Cortex®-M33Display & Interface ControllersMIPI-CSI, MIPI-DSIECCNN/A
Ethernet100M, 10MGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountOperating Temperature-40 °C – 105 °C
QualificationIndustrialRAM ControllersLPDDR3, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed800 MHz

Overview of MIMX8US5CVP08SC – 8ULP DUAL CORTEX A35

The MIMX8US5CVP08SC is an NXP i.MX 8ULP family microprocessor combining dual ARM® Cortex®-A35 application cores with an ARM® Cortex®-M33 real-time core. The architecture supports running a rich operating system on the Cortex‑A35 cores and an RTOS on the Cortex‑M33, enabling mixed application and real-time workloads in industrial embedded systems.

Designed for industrial applications, this part integrates multimedia DSP engines, a broad set of peripheral interfaces, and hardware security features to address use cases that require processing, connectivity, and device-level trust in a single surface-mount package.

Key Features

  • Core architecture Dual ARM® Cortex®-A35 application processors at 800 MHz combined with an ARM® Cortex®-M33 real-time processor (nominal RUN frequency 216 MHz) to separate application and real-time tasks.
  • DSP and co‑processors Integrated Tensilica Fusion F1 DSP and HiFi4 DSP for audio and machine learning workloads, plus PowerQuad and CASPER co-processors connected to the Cortex‑M33 to accelerate DSP and cryptography functions. Fusion DSP nominal frequency shown as 200 MHz.
  • Memory support 32-bit external memory interface supporting LPDDR3, LPDDR4 and LPDDR4x; includes on-chip resources such as 512 KB L2 cache, 32 KB instruction and 32 KB data caches, 64 KB on-chip RAM and 768 KB shared memory.
  • Security features Hardware security features include Advanced High Assurance Boot (AHAB), CAAM, CRC, NXP's EdgeLock Secure Enclave, OTFAD (on-the-fly decryption), and a TRNG (NIST-compliant random number generator).
  • Connectivity and I/O Rich peripheral set with Dual FlexSPI for serial flash, 3x eMMC/SD host interfaces, dual high-speed USB OTG with integrated PHY, 1x 10/100 Mbit/s Ethernet, multiple UART/SPI/I2C/I3C/I2S ports, FlexCAN and FlexIO.
  • Display and imaging MIPI-CSI and MIPI-DSI display interface controllers for camera and display subsystem integration, plus graphics acceleration for UI and multimedia tasks.
  • Package and temperature Industrial qualification with surface-mount packaging (MAPBGA 15 × 15 mm, 0.5 mm pitch referenced in the i.MX 8ULP datasheet) and an operating temperature range of −40 °C to 105 °C.
  • Boot and reliability Dedicated boot ROM, secure boot capabilities, watchdog timers (secure and non-secure), and multiple DMA channels for robust, deterministic system operation.

Typical Applications

  • Industrial Control and Automation Use the dual‑core application and real‑time domains to run user interfaces and field control logic simultaneously while meeting industrial temperature requirements.
  • Audio and Edge Machine Learning Leverage the HiFi4 and Fusion DSPs plus co‑processors for low‑power audio processing, voice interfaces, and compact ML inference at the edge.
  • Connected Gateways and IIoT Nodes Integrate Ethernet, USB OTG, and multiple serial interfaces to build secure connectivity endpoints and protocol bridges for industrial networks.
  • Smart Displays and Vision-enabled Devices Combine MIPI-DSI/CSI, graphics acceleration, and multimedia engines for human‑machine interfaces, camera processing, and visualization.

Unique Advantages

  • Heterogeneous processing domains: Separate application and real‑time workloads by design, enabling Linux-class applications on Cortex‑A35 and deterministic control on Cortex‑M33.
  • Integrated security stack: EdgeLock Secure Enclave, AHAB, CAAM, OTFAD and TRNG provide a hardware-rooted security foundation for secure boot, key storage, and encrypted external memory.
  • DSP and accelerator ecosystem: Fusion F1, HiFi4, PowerQuad and CASPER accelerate audio, DSP and cryptographic workloads to reduce software complexity and offload CPU cores.
  • Comprehensive peripheral set: Broad host and serial interfaces, dual FlexSPI and eMMC/SD support simplify system integration for multi‑media and connectivity designs.
  • Industrial-ready thermal range: Qualified for −40 °C to 105 °C operation, supporting deployment in temperature-challenging environments.

Why Choose MIMX8US5CVP08SC?

The MIMX8US5CVP08SC positions itself as a balanced, highly integrated microprocessor for industrial embedded designs that require concurrent application-level processing, real-time control, multimedia/DSP capability and hardware-backed security. Its combination of dual Cortex‑A35 cores, a Cortex‑M33 real-time processor and dedicated DSP/co‑processors enables consolidated system architectures that reduce BOM and simplify firmware partitioning.

This part is suited to designers building industrial HMI, connected sensors/gateways, audio‑centric devices and vision-enabled controls that demand secure boot, robust peripheral connectivity and industrial temperature operation, all within the i.MX 8ULP processor family footprint.

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