MPC860ENZQ50D4

The MPC860ENZQ50D4 is a single‑core, 32‑bit microprocessor from NXP Semiconductors’ MPC860 PowerQUICC family, operating at 50 MHz and optimized for embedded communications applications. It combines a Power Architecture™ CPU with an integrated communications processor module (CPM) and a memory controller to address networking and controller use cases.

Designed for embedded and consumer markets, this device delivers integrated communications interfaces, DRAM support and a compact 357‑pin PBGA (25×25) surface‑mount package to simplify system design and accelerate time to market.

Key Features

• Core and Architecture 32‑bit MPC8xx core built on Power Architecture technology; single‑core CPU operating at 50 MHz.
• On‑chip Communications Coprocessor (CPM) Integrated CPM provides communications and protocol support, with an inter‑integrated controller (I2C) channel available for system control.
• Memory and Controllers Built‑in memory controller supports DRAM, enabling connection to external high‑performance memory types.
• Ethernet Interfaces Four 10 Mbps Ethernet interfaces for discrete network connectivity within embedded systems.
• I/O and Peripherals 3.3 V I/O operation and additional interfaces including I2C for peripheral and system management.
• Package and Mounting Supplied in a 357‑pin PBGA (25×25) surface‑mount package (357‑BBGA case) for compact board layouts.
• Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
• System Integration Features Datasheet series information notes MMUs, instruction and data caches, a PCMCIA socket controller and a real‑time clock within the MPC860 family architecture.

Typical Applications

• Embedded Communications Equipment — Suited for networking and communications controllers that require integrated CPM functionality and multiple 10 Mbps Ethernet ports.
• Network Appliances — Useful in compact routers, gateways or protocol converters where a single‑chip communications controller and DRAM support are required.
• Consumer & Embedded Systems — Appropriate for consumer‑grade embedded controllers and devices operating within the 0 °C to 95 °C range.

Unique Advantages

• Integrated Communications Subsystem: The CPM and I2C channel reduce the need for external communications controller components.
• DRAM Support: On‑chip memory controller support for DRAM enables flexible memory configurations for data buffering and application code.
• Multiple Ethernet Ports: Four 10 Mbps Ethernet interfaces provide native connectivity for multi‑port communication designs.
• Compact PBGA Package: 357‑pin PBGA (25×25) surface‑mount package enables high‑density board layouts in space‑constrained designs.
• Operational Temperature Range: Rated for 0 °C to 95 °C to meet typical consumer and embedded environmental requirements.
• RoHS Compliant: Meets RoHS requirements for environmental compliance in new designs.

Why Choose MPC860ENZQ50D4?

The MPC860ENZQ50D4 offers a balanced combination of integrated communications functionality, DRAM support and compact packaging for embedded networking and controller applications. With a Power Architecture‑based 32‑bit core, an integrated CPM, multiple Ethernet interfaces and I2C support, it is positioned for designs that require on‑chip communications capabilities and flexible memory interfacing.

Its consumer qualification, RoHS compliance and surface‑mount 357‑PBGA package make it suitable for volume consumer and embedded products where board space, integration and supplier ecosystem support from NXP Semiconductors are important considerations.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC860ENZQ50D4.