MPC860PCVR50D4

The MPC860PCVR50D4 is a single‑core, 32‑bit microprocessor from the MPC860 family, operating at 50 MHz and supplied in a 357‑PBGA (25×25) surface‑mount package. It implements Power Architecture technology with integrated memory management and cache support, and includes a communications processor module (CPM) for protocol and I/O offload.

Designed for communications and embedded controller applications, this industrial‑qualified device integrates multiple Ethernet interfaces, DRAM controller support and HDLC/SDLC channel capability to simplify system design and accelerate time to market.

Key Features

• Core and Architecture  32‑bit MPC8xx core at 50 MHz with Power Architecture technology; includes MMUs and instruction/data caches as documented for the MPC860 family.
• Communications Processor (CPM)  Integrated CPM for communications and protocol handling, including HDLC/SDLC interfaces to offload serial communications tasks.
• Ethernet Connectivity  Multiple Ethernet ports: four 10 Mbps ports and one 10/100 Mbps port, enabling diverse network interfaces on a single device.
• Memory Support  On‑chip DRAM controller support for external memory configurations; suitable for embedded systems requiring external DRAM.
• Power and I/O  3.3 V I/O voltage compatibility for common embedded interfaces.
• Industrial Qualification  Rated for industrial operation with an operating temperature range of −40°C to 95°C.
• Package and Mounting  357‑PBGA (25×25) supplier device package, surface‑mount mounting for compact board layouts.
• Standards and Compliance  RoHS compliant to support lead‑free manufacturing processes.

Typical Applications

• Communications and Networking Systems  Use the integrated CPM and multiple Ethernet interfaces for protocol handling and network connectivity in embedded network devices.
• Industrial Control  Industrial‑rated temperature range and robust I/O make the device suitable for industrial automation and controller tasks.
• Embedded Controllers  Single‑chip integration of CPU, memory controller and communications peripherals supports compact embedded control platforms.

Unique Advantages

• Integrated Communications Offload  The CPM and HDLC/SDLC interfaces reduce host CPU overhead for serial and protocol processing, simplifying firmware design.
• Multiple Ethernet Ports  On‑chip support for several Ethernet interfaces enables flexible network topologies without additional MAC controllers.
• Industrial Temperature Range  Operation from −40°C to 95°C supports deployment in demanding industrial environments.
• Compact, Surface‑Mount PBGA  357‑PBGA (25×25) package enables high‑density board designs while preserving thermal and routing performance.
• Documented Hardware Specifications  Backed by MPC860 family hardware specifications and datasheet documentation for electrical, thermal and layout guidance.
• RoHS Compliant  Supports lead‑free manufacturing requirements and regulatory compliance initiatives.

Why Choose MPC860PCVR50D4?

The MPC860PCVR50D4 combines a Power Architecture‑based 32‑bit core with an integrated communications processor, multiple Ethernet interfaces and DRAM controller support to deliver a compact, communications‑focused solution for embedded and industrial designs. Its industrial qualification and documented hardware specifications make it suitable for systems that require reliable operation across a broad temperature range.

This part is well suited for engineers building embedded networking, communications controllers or industrial control platforms who need a single‑chip device that consolidates CPU, memory interface and communications peripherals while adhering to RoHS requirements and established product documentation.

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