MPC860PCZQ50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 1,374 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860PCZQ50D4 – IC MPU MPC8XX 50MHz 357-PBGA

The MPC860PCZQ50D4 is an industrial-grade microprocessor from the NXP Semiconductors MPC860 family. It integrates a single 32-bit MPC8xx core running at 50 MHz and implements Power Architecture™ technology as described in the MPC860 family hardware specification.

Designed for embedded communications and networking applications, this device combines an on-chip communications processor module (CPM), multiple Ethernet interfaces and DRAM controller support in a 357‑pin PBGA (25×25) surface-mount package, offering a compact, integrated solution for industrial embedded systems.

Key Features

  • CPU Core & Architecture  Single 32‑bit MPC8xx core at 50 MHz built on Power Architecture™ technology with on‑chip memory management features as described for the MPC860 family.
  • Communications Coprocessor (CPM)  Integrated CPM for communications tasks and DSP/communications coprocessor support to offload protocol handling and data movement.
  • Ethernet Connectivity  Multiple onboard Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port, enabling a variety of network topologies and link speeds.
  • Memory Support  On‑chip DRAM controller support for external memory interface flexibility, consistent with MPC860 family memory controller capabilities.
  • Peripheral Interfaces  Protocol support including HDLC/SDLC and extended CPM features (series documentation also references I²C channel enhancements), suitable for serial and network protocol handling.
  • Supply & Mounting  3.3 V I/O voltage and surface-mount 357‑PBGA (25×25) package for compact board-level integration.
  • Industrial Qualification & Temperature Range  Industrial‑grade qualification with operating temperature range from −40 °C to 95 °C for deployment in harsh environments.
  • Compliance  RoHS‑compliant device meeting modern material requirements for electronic assemblies.

Typical Applications

  • Embedded Communications Systems  Use as a communications controller in networked devices where integrated CPM and multiple Ethernet ports simplify protocol handling and connectivity.
  • Industrial Control  Suitable for industrial controllers and automation equipment that require industrial temperature qualification and reliable Ethernet interfaces.
  • Network Appliances & Gateways  Ideal for compact gateway or appliance designs that need multiple Ethernet links and on‑chip communications acceleration.
  • PCMCIA‑Enabled Systems  As part of the MPC860 family, supports PCMCIA socket controller functionality for designs requiring removable media or expansion sockets.

Unique Advantages

  • Integrated Communications Subsystem  On‑chip CPM and communications coprocessor support reduce external logic and simplify implementation of network protocols.
  • Multiple Ethernet Interfaces  Four 10 Mbps ports plus one 10/100 Mbps port provide flexible physical connectivity options without additional PHY count.
  • Industrial Temperature Capability  Rated from −40 °C to 95 °C, enabling deployment in demanding industrial environments.
  • Compact PBGA Package  357‑pin PBGA (25×25) surface‑mount package reduces PCB footprint while supporting high pin count connectivity.
  • Flexible Memory Support  DRAM controller support allows use of a range of external memory types to match system performance and capacity needs.
  • Standards‑Aware Compliance  RoHS‑compliant construction supports regulatory and manufacturing requirements for modern electronics production.

Why Choose MPC860PCZQ50D4?

The MPC860PCZQ50D4 delivers a compact, industrially qualified embedded processor solution that pairs a Power Architecture™ MPC8xx core with an integrated communications processor and multiple Ethernet interfaces. Its combination of on‑chip communications features and DRAM controller support makes it well suited to embedded networking, gateway and industrial control designs where integration and reliability matter.

Backed by the MPC860 PowerQUICC family hardware specifications and documentation, this part is appropriate for engineering teams seeking a documented, integrated microprocessor platform for long‑lifecycle embedded applications.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead‑time information for the MPC860PCZQ50D4.

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