MPC860PVR66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 910 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860PVR66D4 – IC MPU MPC8XX 66MHZ 357BGA

The MPC860PVR66D4 is a member of the MPC860 PowerQUICC family: a one‑core, 32‑bit microprocessor built on the MPC8xx core architecture and optimized for communications and embedded controller applications. This device combines a 66 MHz CPU core with the QUICC communications processor module (CPM) and integrated peripheral controllers to support networking and communications systems.

Designed for compact, surface‑mount designs, the MPC860PVR66D4 provides multiple Ethernet interfaces, DRAM controller support, and a 3.3 V I/O interface in a 357‑pin PBGA (25×25) package, making it suitable for embedded communications and controller use cases.

Key Features

  • Core  MPC8xx 32‑bit core, single‑core CPU operating at 66 MHz as specified for this part.
  • Communications Processor (CPM)  Integrated CPM for communications and protocol handling; supports communication offload functions.
  • Memory and DMA  On‑chip support for DRAM controllers to interface with external memory; family documentation references MMUs and instruction/data caches.
  • Ethernet Interfaces  Multiple Ethernet ports: four 10 Mbps interfaces and one 10/100 Mbps interface as listed in the product specifications.
  • I/O and Interfaces  3.3 V I/O voltage and additional serial protocol support including HDLC/SDLC; surface‑mount PBGA package (357‑PBGA, 25×25 mm).
  • Package and Mounting  357‑pin ball grid array (357‑PBGA / 357‑BBGA), surface mount for compact system integration.
  • Operating Range & Compliance  Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS‑compliant construction.

Typical Applications

  • Embedded Communications Systems  Use the MPC860PVR66D4 where integrated protocol handling and multiport Ethernet are required for networking equipment and communications controllers.
  • Network Appliances  Suitable for compact routing, bridging, or gateway functions that benefit from multiple Ethernet interfaces and an on‑chip CPM.
  • Controller and Interface Modules  Ideal for embedded controller tasks that require DRAM support, HDLC/SDLC serial interfaces, and a 3.3 V I/O domain.

Unique Advantages

  • Integrated Communications Subsystem: The onboard CPM and serial protocol support reduce external logic and offload protocol processing from the host CPU.
  • Multiport Ethernet Connectivity: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible physical connectivity options without additional MAC controllers.
  • Compact PBGA Package: 357‑pin PBGA (25×25) enables high I/O density in space‑constrained, surface‑mount designs.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O supports common peripheral ecosystems for easier system-level integration.
  • RoHS‑Compliant Construction: Meets RoHS requirements for lead‑free manufacturing and global regulatory compliance.
  • Documented Family Architecture: Backed by MPC860 family hardware specifications and user documentation to support development and integration.

Why Choose MPC860PVR66D4?

The MPC860PVR66D4 positions itself as an integrated solution for embedded communications and controller applications, combining a 32‑bit MPC8xx core, the QUICC communications processor module, multiple Ethernet interfaces, and DRAM controller support in a compact PBGA package. Its 3.3 V I/O and RoHS compliance make it straightforward to integrate into contemporary embedded designs.

This device is well suited to engineers and system designers building networked embedded products that require on‑chip protocol handling, multiple Ethernet ports, and a documented family architecture for development and long‑term support.

Request a quote or contact sales to discuss availability, pricing, and lead times for the MPC860PVR66D4.

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