MPC860PVR66D4-NXP

POWERQUICC 32 BIT POWER ARCHITEC
Part Description

MPC8xx Microprocessor IC MPC86xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 196 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCNN/AEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TJ)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860PVR66D4-NXP – POWERQUICC 32-Bit Power Architecture Microprocessor, 66 MHz

The MPC860PVR66D4-NXP is a single-core, 32-bit MPC8xx family microprocessor operating at 66 MHz, designed for embedded applications requiring integrated communications and multiple Ethernet interfaces. Produced by NXP Semiconductors and targeted at embedded/consumer markets, it combines a communications co-processor (CPM), DRAM controller support, and a compact PBGA package to simplify system integration.

This device is suited to designs that need on-chip communications features, HDLC/SDLC support, and a variety of Ethernet connectivity options while maintaining a consumer-grade qualification and RoHS compliance.

Key Features

  • Core — Single MPC8xx 32-bit core running at 66 MHz, providing a deterministic processing engine for embedded control and communications tasks.
  • Communications Co-processor (CPM) — On-chip communications co-processor for handling protocol and data-path tasks; supports communications-focused offload capabilities.
  • Memory Support — Integrated DRAM controller support for system memory interfacing.
  • Ethernet Connectivity — Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port to support a range of network topologies and link speeds.
  • Additional Protocol Interfaces — Built-in support for HDLC and SDLC interfaces for serial and link-layer protocol implementations.
  • Power and I/O — 3.3 V I/O voltage for standard embedded system compatibility.
  • Package and Mounting — Available in a 357-PBGA (25×25) supplier device package and listed package case 357-BBGA; surface-mount package for compact board-level integration.
  • Operating Range — Consumer-grade operating temperature from 0 °C to 95 °C.
  • Environmental Compliance — RoHS compliant for reduced hazardous substance content.
  • Graphics — No graphics acceleration included, focusing resources on communications and control functions.

Typical Applications

  • Networked Communication Devices — Use the multiple Ethernet ports and CPM to implement protocol handling and data-plane functions in routers, gateways, and switches.
  • Industrial Embedded Systems — Leverage HDLC/SDLC interfaces and DRAM support for control systems and protocol-driven data acquisition equipment.
  • Consumer Network Appliances — Suitable for consumer-grade networking appliances that require integrated Ethernet connectivity and RoHS compliance.

Unique Advantages

  • Integrated Communications Engine: On-chip CPM and HDLC/SDLC support reduce external peripheral requirements for protocol processing.
  • Multiple Ethernet Interfaces: Four 10 Mbps ports plus a 10/100 Mbps port enable flexible network configurations without extensive external PHY count.
  • Compact Surface-Mount PBGA Package: 357-PBGA (25×25) package supports high I/O density in a space-efficient form factor.
  • 3.3 V I/O Compatibility: Standard I/O voltage simplifies interfacing with common embedded peripherals and memory devices.
  • RoHS Compliant: Meets environmental requirements for projects requiring lead-free components.
  • Consumer Temperature Range: Rated 0 °C to 95 °C for consumer-grade deployments.

Why Choose MPC860PVR66D4-NXP?

The MPC860PVR66D4-NXP is positioned for embedded and consumer applications that require integrated communications functionality, multiple Ethernet interfaces, and a compact surface-mount package. Its single MPC8xx 32-bit core at 66 MHz, combined with a communications co-processor and DRAM controller support, makes it a practical choice for designs prioritizing on-chip protocol handling and network connectivity.

Backed by NXP Semiconductors and offered with RoHS compliance, this part is appropriate for engineers building consumer and embedded networked devices that benefit from a focused communications-oriented microprocessor with clear electrical, package, and temperature specifications.

Request a quote or submit an inquiry to discuss pricing, availability, and lead times for MPC860PVR66D4-NXP and to receive detailed ordering information tailored to your project requirements.

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