MPC860PVR66D4-NXP
| Part Description |
MPC8xx Microprocessor IC MPC86xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 196 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TJ) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860PVR66D4-NXP – POWERQUICC 32-Bit Power Architecture Microprocessor, 66 MHz
The MPC860PVR66D4-NXP is a single-core, 32-bit MPC8xx family microprocessor operating at 66 MHz, designed for embedded applications requiring integrated communications and multiple Ethernet interfaces. Produced by NXP Semiconductors and targeted at embedded/consumer markets, it combines a communications co-processor (CPM), DRAM controller support, and a compact PBGA package to simplify system integration.
This device is suited to designs that need on-chip communications features, HDLC/SDLC support, and a variety of Ethernet connectivity options while maintaining a consumer-grade qualification and RoHS compliance.
Key Features
- Core — Single MPC8xx 32-bit core running at 66 MHz, providing a deterministic processing engine for embedded control and communications tasks.
- Communications Co-processor (CPM) — On-chip communications co-processor for handling protocol and data-path tasks; supports communications-focused offload capabilities.
- Memory Support — Integrated DRAM controller support for system memory interfacing.
- Ethernet Connectivity — Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port to support a range of network topologies and link speeds.
- Additional Protocol Interfaces — Built-in support for HDLC and SDLC interfaces for serial and link-layer protocol implementations.
- Power and I/O — 3.3 V I/O voltage for standard embedded system compatibility.
- Package and Mounting — Available in a 357-PBGA (25×25) supplier device package and listed package case 357-BBGA; surface-mount package for compact board-level integration.
- Operating Range — Consumer-grade operating temperature from 0 °C to 95 °C.
- Environmental Compliance — RoHS compliant for reduced hazardous substance content.
- Graphics — No graphics acceleration included, focusing resources on communications and control functions.
Typical Applications
- Networked Communication Devices — Use the multiple Ethernet ports and CPM to implement protocol handling and data-plane functions in routers, gateways, and switches.
- Industrial Embedded Systems — Leverage HDLC/SDLC interfaces and DRAM support for control systems and protocol-driven data acquisition equipment.
- Consumer Network Appliances — Suitable for consumer-grade networking appliances that require integrated Ethernet connectivity and RoHS compliance.
Unique Advantages
- Integrated Communications Engine: On-chip CPM and HDLC/SDLC support reduce external peripheral requirements for protocol processing.
- Multiple Ethernet Interfaces: Four 10 Mbps ports plus a 10/100 Mbps port enable flexible network configurations without extensive external PHY count.
- Compact Surface-Mount PBGA Package: 357-PBGA (25×25) package supports high I/O density in a space-efficient form factor.
- 3.3 V I/O Compatibility: Standard I/O voltage simplifies interfacing with common embedded peripherals and memory devices.
- RoHS Compliant: Meets environmental requirements for projects requiring lead-free components.
- Consumer Temperature Range: Rated 0 °C to 95 °C for consumer-grade deployments.
Why Choose MPC860PVR66D4-NXP?
The MPC860PVR66D4-NXP is positioned for embedded and consumer applications that require integrated communications functionality, multiple Ethernet interfaces, and a compact surface-mount package. Its single MPC8xx 32-bit core at 66 MHz, combined with a communications co-processor and DRAM controller support, makes it a practical choice for designs prioritizing on-chip protocol handling and network connectivity.
Backed by NXP Semiconductors and offered with RoHS compliance, this part is appropriate for engineers building consumer and embedded networked devices that benefit from a focused communications-oriented microprocessor with clear electrical, package, and temperature specifications.
Request a quote or submit an inquiry to discuss pricing, availability, and lead times for MPC860PVR66D4-NXP and to receive detailed ordering information tailored to your project requirements.

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