MPC860PZQ66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,962 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860PZQ66D4 – IC MPU MPC8XX 66MHZ 357BGA

The MPC860PZQ66D4 is a single‑core 32‑bit microprocessor from NXP Semiconductors' MPC860 family, operating at 66 MHz and supplied in a 357‑pin PBGA (25×25) package. Designed for embedded controller applications, the MPC860 family is particularly suited to communications and networking systems where integrated peripheral functionality and deterministic control are required.

This device combines a 32‑bit MPC8xx core with an integrated communications processor module (CPM), flexible memory controller support and multiple Ethernet interfaces, delivering a compact, integrated solution for consumer‑grade embedded communications designs.

Key Features

  • Processor Core — MPC8xx 32‑bit core running at 66 MHz, supporting standard Power Architecture features including instruction and data cache and MMU functionality as described for the MPC860 family.
  • Communications Processor Module (CPM) — On‑chip CPM for communications and protocol handling, including HDLC/SDLC support to accelerate serial and link‑level interfaces.
  • Ethernet Connectivity — Multiple on‑chip Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port for versatile networking topologies and link options.
  • Memory and Storage — Enhanced memory controller with DRAM support, enabling use with a range of memory types suitable for embedded applications.
  • Package and Mounting — 357‑PBGA (25×25) surface‑mount package that consolidates I/O and reduces PCB footprint for compact system designs.
  • Power and I/O — 3.3 V I/O voltage to match common embedded system signaling levels.
  • Operating Range — Consumer‑grade qualification with an operating temperature range of 0°C to 95°C for a wide range of ambient conditions.
  • Standards and Compliance — RoHS compliant, meeting environmental requirements for lead‑free assembly.

Typical Applications

  • Embedded Communications Equipment — Ideal for controllers and appliances that require integrated protocol processing and multiple Ethernet connections.
  • Networking Devices — Suited to consumer networking products that benefit from an integrated CPM and mixed 10/100 Mbps Ethernet ports.
  • Controller Systems — Fits embedded controller roles that need a 32‑bit core with MMU/cache and flexible DRAM support.
  • PCMCIA‑enabled Designs — The MPC860 family includes PCMCIA socket controller capability for systems requiring removable memory or I/O expansion.

Unique Advantages

  • Integrated Communications Engine: On‑chip CPM and HDLC/SDLC interfaces reduce external logic and simplify protocol implementations.
  • Multiple Ethernet Ports: Built‑in 10 Mbps and 10/100 Mbps interfaces provide flexible network connectivity without additional controllers.
  • Flexible Memory Support: Enhanced memory controller supports DRAM and other memory types, enabling scalable RAM configurations for varied application needs.
  • Compact PBGA Package: 357‑pin PBGA (25×25) consolidates I/O for space‑constrained designs while supporting high signal density.
  • Vendor Documentation: Supported by detailed hardware specifications and user documentation from the MPC860 family to aid design and validation.
  • RoHS Compliant: Meets lead‑free assembly requirements for modern manufacturing processes.

Why Choose MPC860PZQ66D4?

The MPC860PZQ66D4 positions itself as a compact, integrated microprocessor for consumer‑grade embedded communications and networking applications. With a 32‑bit MPC8xx core, integrated CPM, multiple Ethernet interfaces and flexible DRAM support, it offers a balanced combination of processing capability and peripheral integration to simplify system design and reduce BOM complexity.

This part is well suited to developers and product teams building consumer networking or embedded controller products that need documented hardware specifications, integrated communications features, and a compact PBGA package for dense board layouts.

Request a quote or contact sales to discuss pricing, availability, and how the MPC860PZQ66D4 can fit into your next embedded communications design.

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