MPC860SRCZQ50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 235 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860SRCZQ50D4 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860SRCZQ50D4 is a single‑core, 32‑bit microprocessor in the MPC860 PowerQUICC family optimized for embedded communications and controller applications. It implements Power Architecture technology combined with an integrated Communications Processor Module (CPM) and on‑chip system controllers to streamline networking and control system designs.
At 50 MHz with 3.3 V I/O, industrial qualification and a wide operating range of -40°C to 95°C, this device targets robust, field‑deployed embedded systems that require integrated communications, memory interfacing and reliable operation in demanding environments.
Key Features
- Core MPC8xx single 32‑bit core running at 50 MHz, implementing Power Architecture technology.
- Integrated Communications Processor (CPM) On‑chip CPM supports communications and protocol processing to offload the CPU for networking tasks.
- Memory and MMU Includes memory controller support for DRAM and on‑chip memory management and caches as part of the MPC860 family architecture.
- Ethernet Provides Ethernet capability listed as 10 Mbps (4), suitable for multi‑port communications configurations.
- Serial Protocols Additional interfaces include HDLC/SDLC for serial link framing and protocol support.
- System Peripherals Family documentation notes integrated features such as a PCMCIA socket controller and a real‑time clock in the MPC860 family.
- Electrical 3.3 V I/O voltage for common embedded interface compatibility.
- Package & Mounting 357‑PBGA (25 × 25 mm) surface‑mount package for compact board implementation.
- Environmental & Qualification Industrial qualification and RoHS compliant; operating temperature range −40°C to 95°C.
Typical Applications
- Communications Equipment Designed for embedded communications and networking systems where integrated protocol handling and multiple Ethernet links are required.
- Network Controllers & Gateways Suitable for compact controllers and gateway devices that benefit from on‑chip CPM and multi‑port Ethernet capability.
- Industrial Control Systems Industrial temperature rating and robust packaging make it appropriate for factory automation and field controller applications.
Unique Advantages
- Integrated Communications Subsystem: The on‑chip CPM and serial framing interfaces reduce external component count and simplify protocol implementation.
- Single‑Chip Solution: Combines CPU, memory controller and communications peripherals in one device to lower BOM and streamline board design.
- Industrial Temperature Range: −40°C to 95°C operation supports deployment in harsh and temperature‑variable environments.
- Compact Package: 357‑PBGA (25×25) surface‑mount package enables dense PCB layouts for space‑constrained systems.
- Standard 3.3 V I/O: Compatible with widespread embedded I/O voltages for easy integration into existing designs.
- Proven Family Support: Part of the MPC860 PowerQUICC family with available hardware specifications and user documentation for design integration.
Why Choose MPC860SRCZQ50D4?
The MPC860SRCZQ50D4 positions itself as a compact, industrially qualified single‑chip solution for embedded communications and controller applications. Its 50 MHz MPC8xx core combined with an integrated CPM, DRAM controller support and multiple communications interfaces delivers a balanced mix of processing and protocol handling in a single device.
This part is well suited to designers seeking reduced system complexity and a durable component for networking equipment, industrial controllers and other embedded systems that need reliable operation across a wide temperature range and a compact PBGA footprint.
Request a quote or submit a sales inquiry to evaluate the MPC860SRCZQ50D4 for your next embedded communications or industrial controller design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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