MPC860SRCZQ66D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,505 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860SRCZQ66D4 – IC MPU MPC8XX 66MHz 357BGA
The MPC860SRCZQ66D4 is a single‑core 32‑bit microprocessor from the MPC860 (MPC8xx) PowerQUICC family, built on Power Architecture technology and optimized for integrated communications and networking controller applications. It combines a 32‑bit CPU core with an enhanced communications processor module (CPM) and a flexible memory controller to address embedded communications, networking, and industrial control use cases.
Targeted at industrial environments, the device offers a 66 MHz core, 3.3 V I/O, integrated communications interfaces, and an industrial temperature rating for reliable operation in demanding embedded systems.
Key Features
- Core and Architecture — MPC8xx 32‑bit single core running at 66 MHz, implementing Power Architecture technology and on‑chip instruction and data caches as documented for the MPC860 family.
- Communications Processor (CPM) — Integrated CPM for communications tasks with additional interfaces; CPM enhancements referenced in the MPC860 family documentation.
- Ethernet Connectivity — Ethernet capability listed as 10 Mbps (4), providing multiple 10 Mbps Ethernet interfaces as specified for the device.
- Serial Link Protocols — Additional interfaces include HDLC/SDLC for common framed serial communications.
- Memory Support — DRAM controller support is provided; the MPC860 family memory controller supports a range of DRAM types as described in the family documentation.
- Power and I/O — 3.3 V I/O voltage allows compatibility with common embedded I/O levels.
- Package and Mounting — Supplied in a 357‑PBGA (25×25) surface‑mount package (357‑BBGA package case specified).
- Industrial Qualification and Temperature Range — Qualified for industrial use with an operating temperature range of −40 °C to 95 °C.
- Compliance — RoHS compliant.
Typical Applications
- Embedded Communications Controllers — On‑chip CPM and HDLC/SDLC support make this device suitable for embedded systems that require dedicated communications processing.
- Networking Equipment — Multiple 10 Mbps Ethernet interfaces and PowerQUICC family communications features support building networked appliances and edge devices.
- Industrial Control Systems — Industrial qualification and a wide operating temperature range enable deployment in industrial control and monitoring applications.
- Memory‑Intensive Embedded Systems — Integrated DRAM controller support allows use in systems requiring external DRAM for program and data storage.
Unique Advantages
- Integrated Communications Subsystem — The combination of a Power Architecture CPU and an enhanced CPM reduces the need for external communications controllers and simplifies system design.
- Multiple Ethernet Interfaces — Four 10 Mbps Ethernet interfaces (as specified) provide direct connectivity options for networked embedded designs.
- Industrial‑Grade Operation — −40 °C to 95 °C operating range and industrial qualification support reliable operation in harsh environments.
- Compact Surface‑Mount Package — 357‑PBGA (25×25) package provides a compact footprint for space‑constrained board designs.
- Standard 3.3 V I/O — 3.3 V I/O simplifies integration with common peripheral and interface voltage domains.
- RoHS Compliant — Meets lead‑free manufacturing requirements for modern production processes.
Why Choose MPC860SRCZQ66D4?
The MPC860SRCZQ66D4 positions itself as a one‑chip integrated communications controller within the MPC860 PowerQUICC family, combining a 32‑bit Power Architecture core with a communications processor module and flexible memory support. Its mix of integrated communications interfaces, multiple 10 Mbps Ethernet channels, and industrial temperature qualification make it well suited to embedded networking and industrial control designs that require an integrated communications‑centric MCU.
Engineers selecting this part benefit from the MPC860 family documentation and hardware specifications that describe power, timing, thermal, and communications characteristics—facilitating system design and deployment in industrial and embedded communications applications.
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