MPC860SRVR50D4-NXP

The MPC860SRVR50D4-NXP is a single-core, 32-bit microprocessor in the MPC8xx family, manufactured by NXP Semiconductors. Operating at 50 MHz with a 3.3 V I/O domain and integrated communications resources, it is intended for embedded consumer applications that require on-chip protocol handling and multiple Ethernet interfaces.

With integrated DRAM controller support, HDLC/SDLC interfaces and a Communications Processor Module (CPM) co-processor, the device targets designs needing built-in communications functionality and compact surface-mount packaging.

Key Features

• Core  The MPC8xx single 32-bit core runs at 50 MHz, providing deterministic processing for embedded control and communications tasks.
• Communications Co-processor  Includes a Communications Processor Module (CPM) for offloading communications and protocol handling.
• Networking  Four 10 Mbps Ethernet interfaces enable multi-port network connectivity for embedded networking applications.
• Memory  On-chip DRAM controller support facilitates connection to external DRAM for system memory needs.
• Serial Protocols  Additional interfaces for HDLC/SDLC enable hardware-level support for common serial communication protocols.
• Power and I/O  3.3 V I/O voltage suitable for common embedded system designs.
• Package and Mounting  Supplied in a 357-PBGA (25×25) package, surface mount for compact PCB implementations.
• Environmental & Qualification  RoHS compliant and qualified for consumer applications; operating temperature range 0 °C to 95 °C.

Typical Applications

• Embedded networking devices  Multi-port 10 Mbps Ethernet connectivity makes the device suitable for small networked appliances and edge devices.
• Communications controllers  The CPM co-processor and HDLC/SDLC support enable protocol offload and serial link handling in communication-focused modules.
• Consumer embedded systems  Consumer-qualified design and integrated DRAM controller fit consumer electronics requiring protocol handling and system memory.

Unique Advantages

• Integrated communications processor  The on-chip CPM reduces external processing requirements for protocol handling and communications tasks.
• Multiple Ethernet interfaces  Four 10 Mbps Ethernet ports allow compact multi-port network designs without additional PHY-level components.
• On-board memory interface  DRAM controller support simplifies memory subsystem design and integration.
• Compact surface-mount package  357-PBGA (25×25) packaging supports high-density PCB layouts for space-constrained products.
• Consumer qualification and RoHS compliance  Prepared for consumer market requirements with RoHS-compliant manufacturing.
• Wide operating range for consumer environments  0 °C to 95 °C operating temperature accommodates typical consumer operating conditions.

Why Choose MPC860SRVR50D4-NXP?

The MPC860SRVR50D4-NXP combines a 32-bit MPC8xx core at 50 MHz with dedicated communications hardware and multiple 10 Mbps Ethernet interfaces to deliver an integrated solution for embedded communication-centric designs. Its DRAM controller, HDLC/SDLC interfaces, and CPM co-processor help reduce external component count and simplify system architecture.

Backed by NXP Semiconductors and packaged in a compact 357-PBGA (25×25) surface-mount package, this device is suited to engineers developing consumer-class embedded products that require on-chip communications capabilities, memory interfacing, and multi-port networking in a RoHS-compliant form factor.

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