MPC860SRZQ50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 977 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860SRZQ50D4 – 32‑Bit 50 MHz MPC8xx Microprocessor, 357‑PBGA

The MPC860SRZQ50D4 from NXP Semiconductors is a single‑core, 32‑bit microprocessor in the MPC860 PowerQUICC family, operating at 50 MHz. It implements Power Architecture™ technology and integrates a Communications Processor Module (CPM), making it suited to embedded communications and networking applications.

Designed for embedded and consumer systems, this device combines on‑chip communications resources with DRAM memory controller support and multiple interface options to simplify board design while delivering predictable performance within its specified operating range.

Key Features

  • Core  The MPC8xx core is a 32‑bit single core running at 50 MHz, implementing Power Architecture™ technology for deterministic embedded processing.
  • Communications Processing (CPM)  Integrated Communications Processor Module (CPM) and communications co‑processor capability to handle protocol and I/O offload tasks.
  • Memory Support  On‑chip DRAM controller support for standard DRAM memories, enabling flexible system memory architectures.
  • Ethernet  Supports four 10 Mbps Ethernet interfaces for network connectivity in embedded applications.
  • Additional Interfaces  Includes HDLC/SDLC support and multiple serial interfaces exposed by the CPM for protocol and link‑level communications.
  • Package & Mounting  Supplied in a 357‑lead PBGA (25 × 25 mm) package (357‑BBGA case), optimized for surface‑mount assembly.
  • Power & I/O  3.3 V I/O voltage domain for compatibility with common embedded I/O levels.
  • Operating Range & Qualification  Rated for operation from 0 °C to 95 °C and designated with consumer qualification.
  • Compliance  RoHS‑compliant for environmental regulatory alignment.

Typical Applications

  • Embedded Communications Equipment  Integration of the CPM and multiple Ethernet interfaces makes the MPC860SRZQ50D4 suitable for routers, gateways, and other communications nodes.
  • Networking Systems  The device is suited for network‑centric embedded designs requiring link‑level protocol handling and deterministic processing.
  • PCMCIA‑equipped Embedded Devices  On‑chip PCMCIA socket controller (documented in the MPC860 family) supports designs that require PCMCIA card interfaces.
  • Consumer Embedded Products  With consumer qualification and a 0 °C to 95 °C operating window, the part fits a range of consumer embedded applications that need integrated communications functions.
  • Real‑Time Control and Timing  Integrated real‑time clock and CPM capabilities support timing and protocol offload in time‑sensitive embedded designs.

Unique Advantages

  • Integrated Communications Subsystem  The built‑in CPM and communications co‑processor functions reduce external logic and simplify protocol handling on the host CPU.
  • Multiple Network Interfaces  Four 10 Mbps Ethernet interfaces provide direct connectivity options for multi‑port network designs without additional controllers.
  • Compact, Surface‑Mount PBGA Package  The 357‑lead PBGA (25 × 25 mm) delivers high pin count in a compact surface‑mount form factor for space‑constrained boards.
  • Standard I/O Voltage  3.3 V I/O ensures compatibility with common embedded peripherals and simplifies mixed‑voltage system design.
  • RoHS‑Compliant  Meets RoHS environmental requirements to support regulatory needs in global markets.
  • Designed for Embedded Networking  Power Architecture™ core combined with CPM offload provides a balanced platform for embedded networking tasks and system integration.

Why Choose MPC860SRZQ50D4?

The MPC860SRZQ50D4 positions itself as a compact, communications‑focused embedded processor that brings on‑chip protocol handling, DRAM controller support, and multi‑port Ethernet into a single device. Its single 32‑bit Power Architecture™ core at 50 MHz and integrated CPM make it a practical choice for designs that prioritize integrated communications functionality and predictable embedded performance.

This device is well suited for design teams building consumer and embedded networking products that value integration, board‑level simplicity, and regulatory compliance. Long‑standing family documentation and device heritage in the MPC860 PowerQUICC family provide a clear specification base for engineering and system validation.

Request a quote or submit your parts inquiry today to get pricing and availability for MPC860SRZQ50D4. Our team can provide lead‑time information and support for your procurement request.

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