MPC860SRZQ50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 977 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860SRZQ50D4 – 32‑Bit 50 MHz MPC8xx Microprocessor, 357‑PBGA
The MPC860SRZQ50D4 from NXP Semiconductors is a single‑core, 32‑bit microprocessor in the MPC860 PowerQUICC family, operating at 50 MHz. It implements Power Architecture™ technology and integrates a Communications Processor Module (CPM), making it suited to embedded communications and networking applications.
Designed for embedded and consumer systems, this device combines on‑chip communications resources with DRAM memory controller support and multiple interface options to simplify board design while delivering predictable performance within its specified operating range.
Key Features
- Core The MPC8xx core is a 32‑bit single core running at 50 MHz, implementing Power Architecture™ technology for deterministic embedded processing.
- Communications Processing (CPM) Integrated Communications Processor Module (CPM) and communications co‑processor capability to handle protocol and I/O offload tasks.
- Memory Support On‑chip DRAM controller support for standard DRAM memories, enabling flexible system memory architectures.
- Ethernet Supports four 10 Mbps Ethernet interfaces for network connectivity in embedded applications.
- Additional Interfaces Includes HDLC/SDLC support and multiple serial interfaces exposed by the CPM for protocol and link‑level communications.
- Package & Mounting Supplied in a 357‑lead PBGA (25 × 25 mm) package (357‑BBGA case), optimized for surface‑mount assembly.
- Power & I/O 3.3 V I/O voltage domain for compatibility with common embedded I/O levels.
- Operating Range & Qualification Rated for operation from 0 °C to 95 °C and designated with consumer qualification.
- Compliance RoHS‑compliant for environmental regulatory alignment.
Typical Applications
- Embedded Communications Equipment Integration of the CPM and multiple Ethernet interfaces makes the MPC860SRZQ50D4 suitable for routers, gateways, and other communications nodes.
- Networking Systems The device is suited for network‑centric embedded designs requiring link‑level protocol handling and deterministic processing.
- PCMCIA‑equipped Embedded Devices On‑chip PCMCIA socket controller (documented in the MPC860 family) supports designs that require PCMCIA card interfaces.
- Consumer Embedded Products With consumer qualification and a 0 °C to 95 °C operating window, the part fits a range of consumer embedded applications that need integrated communications functions.
- Real‑Time Control and Timing Integrated real‑time clock and CPM capabilities support timing and protocol offload in time‑sensitive embedded designs.
Unique Advantages
- Integrated Communications Subsystem The built‑in CPM and communications co‑processor functions reduce external logic and simplify protocol handling on the host CPU.
- Multiple Network Interfaces Four 10 Mbps Ethernet interfaces provide direct connectivity options for multi‑port network designs without additional controllers.
- Compact, Surface‑Mount PBGA Package The 357‑lead PBGA (25 × 25 mm) delivers high pin count in a compact surface‑mount form factor for space‑constrained boards.
- Standard I/O Voltage 3.3 V I/O ensures compatibility with common embedded peripherals and simplifies mixed‑voltage system design.
- RoHS‑Compliant Meets RoHS environmental requirements to support regulatory needs in global markets.
- Designed for Embedded Networking Power Architecture™ core combined with CPM offload provides a balanced platform for embedded networking tasks and system integration.
Why Choose MPC860SRZQ50D4?
The MPC860SRZQ50D4 positions itself as a compact, communications‑focused embedded processor that brings on‑chip protocol handling, DRAM controller support, and multi‑port Ethernet into a single device. Its single 32‑bit Power Architecture™ core at 50 MHz and integrated CPM make it a practical choice for designs that prioritize integrated communications functionality and predictable embedded performance.
This device is well suited for design teams building consumer and embedded networking products that value integration, board‑level simplicity, and regulatory compliance. Long‑standing family documentation and device heritage in the MPC860 PowerQUICC family provide a clear specification base for engineering and system validation.
Request a quote or submit your parts inquiry today to get pricing and availability for MPC860SRZQ50D4. Our team can provide lead‑time information and support for your procurement request.

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