MPC860TCZQ50D4

The MPC860TCZQ50D4 is a single‑core 32‑bit microprocessor from the MPC860 PowerQUICC family, operating at 50 MHz and designed for embedded communications and networking applications. It integrates a Power Architecture™ CPU core with a communications processor module (CPM) and memory controller capabilities to streamline controller and networked system designs.

Targeted at industrial environments, this device provides multiple on‑chip communications interfaces and a compact 357‑pin PBGA package for surface‑mount assembly, offering a balance of integration, connectivity, and temperature robustness.

Key Features

• 32‑bit Power Architecture Core Single 32‑bit core running at 50 MHz, delivering deterministic processing for embedded control and communications tasks.
• Communications Engine (CPM) Integrated communications coprocessor functionality (CPM) for offloading protocol and I/O tasks from the main CPU.
• Memory and DRAM Controller On‑chip memory controller supporting DRAM to simplify external memory interfacing and system memory management.
• Ethernet Connectivity Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port, enabling diverse networking topologies and link tiers.
• Protocol Interfaces Additional serial protocol support including HDLC/SDLC for embedded communications and protocol framing.
• Industrial Qualification and Temperature Range Rated for industrial operation with an operating temperature range of −40 °C to 95 °C for deployment in demanding environments.
• Package and Mounting 357‑ball PBGA (25 × 25 mm) surface‑mount package providing a compact footprint for board‑level integration.
• 3.3 V I/O Standard 3.3 V I/O voltage compatibility for interfacing with common industrial peripherals and I/O devices.
• Regulatory Compliance RoHS‑compliant material status for environmental and manufacturing compatibility.

Typical Applications

• Communications Equipment — Ideal for embedded routers, switches, and protocol converters that require multiple Ethernet ports and on‑chip communications processing.
• Networked Controllers — Suited for control systems that benefit from integrated DRAM support and a CPM to handle serial and framed protocols.
• Industrial Automation — Deployment in industrial control nodes where extended temperature range and industrial qualification are required.
• Embedded Networking Appliances — Useful in compact appliances that need a surface‑mount PBGA package with integrated networking interfaces.

Unique Advantages

• Highly integrated communications capability: Combines a Power Architecture CPU with a dedicated CPM and multiple Ethernet ports to reduce external component count and simplify system design.
• Industrial temperature performance: −40 °C to 95 °C operating range supports deployment in harsh or temperature‑sensitive environments.
• Compact PBGA package: 357‑ball PBGA (25 × 25 mm) enables a dense board layout for space‑constrained systems.
• Standard 3.3 V I/O: Ensures compatibility with common industrial peripherals and simplifies power‑rail design.
• RoHS compliance: Meets material requirements for modern manufacturing and environmental initiatives.

Why Choose MPC860TCZQ50D4?

The MPC860TCZQ50D4 combines a 32‑bit Power Architecture core with on‑chip communications processing, memory controller support, and multiple Ethernet interfaces to deliver an integrated platform for embedded communications and industrial control designs. Its industrial temperature rating and compact 357‑PBGA package make it suitable for robust, space‑constrained applications.

Backed by NXP Semiconductors documentation for the MPC860 PowerQUICC family, this device is appropriate for engineers and procurement teams seeking a proven, integrated microprocessor solution for networking, protocol handling, and controller applications in industrial environments.

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