MPC860TCVR50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 52 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860TCVR50D4 – IC MPU MPC8XX 50MHZ 357BGA

The MPC860TCVR50D4 is a single‑core 32‑bit microprocessor in the MPC860 family, implementing Power Architecture™ technology and designed for embedded controller and communications applications. It combines a 50 MHz MPC8xx core with an integrated communications processor module (CPM), memory controller support, and multiple Ethernet interfaces to address networking and industrial embedded use cases.

Key Features

  • Core and Architecture  32‑bit MPC8xx core at 50 MHz using Power Architecture™ technology with MMU and instruction/data cache capability as described for the MPC860 family.
  • Communications Processor (CPM)  Integrated CPM providing enhanced communications functions and additional channels such as I2C as documented for the MPC860 family.
  • Memory Support  On‑chip memory controller supporting DRAM types and system memory interfaces; includes PCMCIA socket controller capability noted in the family documentation.
  • Ethernet Connectivity  Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port, enabling multi‑port networking topologies.
  • Peripheral Interfaces  HDLC/SDLC support for serial link framing and communications protocol handling.
  • Power and I/O  3.3 V I/O supply level for system compatibility with common embedded I/O domains.
  • Package and Mounting  357‑ball PBGA package (25 × 25 mm), surface‑mount, suitable for compact system designs.
  • Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 95 °C for deployment in demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Communications & Networking Equipment  Multi‑port Ethernet and CPM integration make this device suitable for routers, switches, and protocol converters.
  • Industrial Control Systems  Industrial temperature rating and DRAM memory controller support suit embedded controllers and automation modules.
  • Embedded Networking Appliances  Compact PBGA footprint and integrated communications peripherals enable space‑constrained networked appliances.
  • Real‑Time Systems  On‑chip real‑time clock and CPM features support real‑time control and timed communications tasks.

Unique Advantages

  • Integrated Communications Subsystem: Built‑in CPM and HDLC/SDLC support reduce external controller requirements for communication tasks.
  • Multi‑Port Ethernet: Four 10 Mbps ports plus one 10/100 Mbps port enable flexible network topologies without additional PHY count.
  • Industrial‑Grade Operation: −40 °C to 95 °C operating range and industrial qualification support deployment in harsh environments.
  • Compact, Surface‑Mount Package: 357‑PBGA (25 × 25 mm) package balances high integration with a compact board footprint.
  • System‑Level Integration: On‑chip memory controller, PCMCIA socket controller capability, and real‑time clock reduce BOM and simplify system design.
  • Standard 3.3 V I/O: 3.3 V IO simplifies interfacing with common peripheral components and memory devices.

Why Choose MPC860TCVR50D4?

The MPC860TCVR50D4 positions itself as an integrated, industrial‑qualified solution for embedded communications and control designs. With a Power Architecture™ 32‑bit core, CPM communications engine, multi‑port Ethernet, and DRAM memory controller support, it offers a balanced mix of processing and communications capabilities in a single package.

This part is well suited to designers targeting compact, rugged networking and embedded controller products that require multiple Ethernet interfaces, real‑time features, and broad memory support while maintaining a surface‑mount PBGA footprint and RoHS compliance.

Request a quote or submit an RFQ to receive pricing and availability for the MPC860TCVR50D4. Our team can provide lead time and ordering information to support your design and procurement needs.

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