MPC860TCVR50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 52 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860TCVR50D4 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860TCVR50D4 is a single‑core 32‑bit microprocessor in the MPC860 family, implementing Power Architecture™ technology and designed for embedded controller and communications applications. It combines a 50 MHz MPC8xx core with an integrated communications processor module (CPM), memory controller support, and multiple Ethernet interfaces to address networking and industrial embedded use cases.
Key Features
- Core and Architecture 32‑bit MPC8xx core at 50 MHz using Power Architecture™ technology with MMU and instruction/data cache capability as described for the MPC860 family.
- Communications Processor (CPM) Integrated CPM providing enhanced communications functions and additional channels such as I2C as documented for the MPC860 family.
- Memory Support On‑chip memory controller supporting DRAM types and system memory interfaces; includes PCMCIA socket controller capability noted in the family documentation.
- Ethernet Connectivity Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port, enabling multi‑port networking topologies.
- Peripheral Interfaces HDLC/SDLC support for serial link framing and communications protocol handling.
- Power and I/O 3.3 V I/O supply level for system compatibility with common embedded I/O domains.
- Package and Mounting 357‑ball PBGA package (25 × 25 mm), surface‑mount, suitable for compact system designs.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 95 °C for deployment in demanding environments.
- Compliance RoHS compliant.
Typical Applications
- Communications & Networking Equipment Multi‑port Ethernet and CPM integration make this device suitable for routers, switches, and protocol converters.
- Industrial Control Systems Industrial temperature rating and DRAM memory controller support suit embedded controllers and automation modules.
- Embedded Networking Appliances Compact PBGA footprint and integrated communications peripherals enable space‑constrained networked appliances.
- Real‑Time Systems On‑chip real‑time clock and CPM features support real‑time control and timed communications tasks.
Unique Advantages
- Integrated Communications Subsystem: Built‑in CPM and HDLC/SDLC support reduce external controller requirements for communication tasks.
- Multi‑Port Ethernet: Four 10 Mbps ports plus one 10/100 Mbps port enable flexible network topologies without additional PHY count.
- Industrial‑Grade Operation: −40 °C to 95 °C operating range and industrial qualification support deployment in harsh environments.
- Compact, Surface‑Mount Package: 357‑PBGA (25 × 25 mm) package balances high integration with a compact board footprint.
- System‑Level Integration: On‑chip memory controller, PCMCIA socket controller capability, and real‑time clock reduce BOM and simplify system design.
- Standard 3.3 V I/O: 3.3 V IO simplifies interfacing with common peripheral components and memory devices.
Why Choose MPC860TCVR50D4?
The MPC860TCVR50D4 positions itself as an integrated, industrial‑qualified solution for embedded communications and control designs. With a Power Architecture™ 32‑bit core, CPM communications engine, multi‑port Ethernet, and DRAM memory controller support, it offers a balanced mix of processing and communications capabilities in a single package.
This part is well suited to designers targeting compact, rugged networking and embedded controller products that require multiple Ethernet interfaces, real‑time features, and broad memory support while maintaining a surface‑mount PBGA footprint and RoHS compliance.
Request a quote or submit an RFQ to receive pricing and availability for the MPC860TCVR50D4. Our team can provide lead time and ordering information to support your design and procurement needs.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016