MPC860TCZQ66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,325 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860TCZQ66D4 – IC MPU MPC8XX 66MHz 357PBGA

The MPC860TCZQ66D4 is a single‑core, 32‑bit microprocessor from the MPC860 PowerQUICC family, built on Power Architecture™ technology. It combines a 66 MHz CPU core with an integrated communications processor module (CPM) and a flexible memory controller for embedded communications and networking applications.

Designed for embedded and industrial systems, the MPC860TCZQ66D4 delivers integrated peripheral and interface functionality—Ethernet ports, HDLC/SDLC support, DRAM controller and real‑time system features—while operating from 3.3 V I/O and a wide temperature range for industrial deployments.

Key Features

  • Core and Architecture  Single 32‑bit MPC8xx core running at 66 MHz, implementing Power Architecture™ technology as described for the MPC860 family.
  • Communications Processor (CPM)  Integrated CPM for communications and serial protocol offload, with HDLC/SDLC interfaces for protocol handling.
  • Ethernet Connectivity  Multiple Ethernet interfaces: four 10 Mbps ports plus one 10/100 Mbps port for mixed‑speed network links.
  • Memory Support  On‑chip memory controller supporting DRAM types and system memory configurations typical of the MPC860 family.
  • Power and I/O  3.3 V I/O signaling for compatibility with common embedded peripherals.
  • Package and Mounting  357‑pin PBGA package (25 × 25 mm) in a surface‑mount form factor for compact board integration.
  • Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 95 °C for rugged environments.
  • Additional Interfaces  HDLC/SDLC support and other serial interfaces provided by the CPM for protocol‑rich applications.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Communication and Networking Equipment  Integration of CPU and CPM plus multiple Ethernet ports makes this device suitable for embedded routers, switches and protocol concentrators.
  • Industrial Control Systems  Industrial temperature rating and 3.3 V I/O support deployment in control nodes, PLCs and factory automation controllers.
  • Embedded Gateways and Protocol Converters  On‑chip CPM and HDLC/SDLC interfaces enable offloading of serial protocol processing in gateway designs.

Unique Advantages

  • Integrated Communications Subsystem: CPM and serial protocol support reduce external controller requirements and simplify PCB design for communication‑centric products.
  • Mixed Ethernet Options: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible network topology options without adding external PHYs.
  • Industrial Temperature Range: −40 °C to 95 °C operation supports deployment in thermally demanding environments.
  • Compact PBGA Package: 357‑pin PBGA (25 × 25 mm) enables a high‑density implementation while maintaining surface‑mount assembly compatibility.
  • 3.3 V I/O Compatibility: Standard 3.3 V signaling ensures straightforward interfacing with common embedded peripherals and transceivers.
  • RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.

Why Choose MPC860TCZQ66D4?

The MPC860TCZQ66D4 positions itself as a compact, communications‑oriented embedded processor combining a Power Architecture™ 32‑bit core with an integrated CPM, DRAM‑capable memory controller and multiple Ethernet interfaces. Its industrial qualification and wide temperature range make it suitable for embedded networking and control products that require reliable protocol handling and mixed‑speed connectivity.

This part is appropriate for engineers designing compact embedded routers, protocol gateways and industrial controllers who need on‑chip communications peripherals, predictable 3.3 V I/O behavior, and a proven MPC860 family architecture backed by documented hardware specifications.

Request a quote or submit an RFQ to check availability and volume pricing for the MPC860TCZQ66D4. Our team can provide lead‑time and ordering information to support your design timeline.

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